Matching Items (5)
Filtering by

Clear all filters

154163-Thumbnail Image.png
Description
The demand for miniaturized components with feature sizes as small as tens of microns and tolerances as small as 0.1 microns is on the rise in the fields of aerospace, electronics, optics and biomedical engineering. Micromilling has proven to be a process capable of generating the required accuracy for these

The demand for miniaturized components with feature sizes as small as tens of microns and tolerances as small as 0.1 microns is on the rise in the fields of aerospace, electronics, optics and biomedical engineering. Micromilling has proven to be a process capable of generating the required accuracy for these features and is an alternative to various non-mechanical micro-manufacturing processes which are limited in terms of cost and productivity, especially at the micro-meso scale. The micromilling process is on the surface, a miniaturized version of conventional milling, hence inheriting its benefits. However, the reduction in scale by a few magnitudes makes the process peculiar and unique; and the macro-scale theories have failed to successfully explain the micromilling process and its machining parameters. One such characteristic is the unpredictable nature of tool wear and breakage. There is a large cost benefit that can be realized by improving tool life. Workpiece rejection can also be reduced by successfully monitoring the condition of the tool to avoid issues. Many researchers have developed Tool Condition Monitoring and Tool Wear Modeling systems to address the issue of tool wear, and to obtain new knowledge. In this research, a tool wear modeling effort is undertaken with a new approach. A new tool wear signature is used for real-time data collection and modeling of tool wear. A theoretical correlation between the number of metal chips produced during machining and the condition of the tool is introduced. Experimentally, it is found that the number of chips produced drops with respect to the feedrate of the cutting process i.e. when the uncut chip thickness is below the theoretical minimum chip thickness.
ContributorsBajaj, Anuj Kishorkumar (Author) / SODEMANN, ANGELA A (Thesis advisor) / Bekki, Jeniffer (Committee member) / Hsu, Keng (Committee member) / Arizona State University (Publisher)
Created2015
Description
The world’s population is currently 9% visually impaired. Medical sciences do not have a biological fix that can cure this visual impairment. Visually impaired people are currently being assisted with biological fixes or assistive devices. The current assistive devices are limited in size as well as resolution. This thesis presents

The world’s population is currently 9% visually impaired. Medical sciences do not have a biological fix that can cure this visual impairment. Visually impaired people are currently being assisted with biological fixes or assistive devices. The current assistive devices are limited in size as well as resolution. This thesis presents the development and experimental validation of a control system for a new vibrotactile haptic display that is currently in development. In order to allow the vibrotactile haptic display to be used to represent motion, the control system must be able to change the image displayed at a rate of at least 30 frames/second. In order to achieve this, this thesis introduces and investigates the use of three improvements: threading, change filtering, and wave libraries. Through these methods, it is determined that an average of 40 frames/second can be achieved.
ContributorsKIM, KENDRA (Author) / Sodemann, Angela (Thesis advisor) / Robertson, John (Committee member) / Bansal, Ajay (Committee member) / Arizona State University (Publisher)
Created2018
157170-Thumbnail Image.png
Description
In this research, a new cutting edge wear estimator for micro-endmilling is developed and the reliabillity of the estimator is evaluated. The main concept of this estimator is the minimum chip thickness effect. This estimator predicts the cutting edge radius by detecting the drop in the chip production rate as

In this research, a new cutting edge wear estimator for micro-endmilling is developed and the reliabillity of the estimator is evaluated. The main concept of this estimator is the minimum chip thickness effect. This estimator predicts the cutting edge radius by detecting the drop in the chip production rate as the cutting edge of a micro- endmill slips over the workpiece when the minimum chip thickness becomes larger than the uncut chip thickness, thus transitioning from the shearing to the ploughing dominant regime. The chip production rate is investigated through simulation and experiment. The simulation and the experiment show that the chip production rate decreases when the minimum chip thickness becomes larger than the uncut chip thickness. Also, the reliability of this estimator is evaluated. The probability of correct estimation of the cutting edge radius is more than 80%. This cutting edge wear estimator could be applied to an online tool wear estimation system. Then, a large number of cutting edge wear data could be obtained. From the data, a cutting edge wear model could be developed in terms of the machine control parameters so that the optimum control parameters could be applied to increase the tool life and the machining quality as well by minimizing the cutting edge wear rate.

In addition, in order to find the stable condition of the machining, the stabillity lobe of the system is created by measuring the dynamic parameters. This process is needed prior to the cutting edge wear estimation since the chatter would affect the cutting edge wear and the chip production rate. In this research, a new experimental set-up for measuring the dynamic parameters is developed by using a high speed camera with microscope lens and a loadcell. The loadcell is used to measure the stiffness of the tool-holder assembly of the machine and the high speed camera is used to measure the natural frequency and the damping ratio. From the measured data, a stability lobe is created. Even though this new method needs further research, it could be more cost-effective than the conventional methods in the future.
ContributorsLee, Jue-Hyun (Author) / SODEMANN, ANGELA A (Thesis advisor) / Shuaib, Abdelrahman (Committee member) / Hsu, Keng (Committee member) / Artemiadis, Panagiotis (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2019
155687-Thumbnail Image.png
Description
Semiconductor manufacturing is one of the most complex manufacturing systems in today’s times. Since semiconductor industry is extremely consumer driven, market demands within this industry change rapidly. It is therefore very crucial for these industries to be able to predict cycle time very accurately in order to quote accurate delivery

Semiconductor manufacturing is one of the most complex manufacturing systems in today’s times. Since semiconductor industry is extremely consumer driven, market demands within this industry change rapidly. It is therefore very crucial for these industries to be able to predict cycle time very accurately in order to quote accurate delivery dates. Discrete Event Simulation (DES) models are often used to model these complex manufacturing systems in order to generate estimates of the cycle time distribution. However, building models and executing them consumes sufficient time and resources. The objective of this research is to determine the influence of input parameters on the cycle time distribution of a semiconductor or high volume electronics manufacturing system. This will help the decision makers to implement system changes to improve the predictability of their cycle time distribution without having to run simulation models. In order to understand how input parameters impact the cycle time, Design of Experiments (DOE) is performed. The response variables considered are the attributes of cycle time distribution which include the four moments and percentiles. The input to this DOE is the output from the simulation runs. Main effects, two-way and three-way interactions for these input variables are analyzed. The implications of these results to real world scenarios are explained which would help manufactures understand the effects of the interactions between the input factors on the estimates of cycle time distribution. The shape of the cycle time distributions is different for different types of systems. Also, DES requires substantial resources and time to run. In an effort to generalize the results obtained in semiconductor manufacturing analysis, a non- complex system is considered.
ContributorsSalvi, Tanushree Ashutosh (Author) / Bekki, Jennifer M (Thesis advisor) / Sodemann, Angela (Thesis advisor) / Shuaib, Abdelrahman (Committee member) / Ren, Yi (Committee member) / Arizona State University (Publisher)
Created2017
Description
With the growing popularity of 3d printing in recreational, research, and commercial enterprises new techniques and processes are being developed to improve the quality of parts created. Even so, the anisotropic properties is still a major hindrance of parts manufactured in this method. The goal is to produce parts that

With the growing popularity of 3d printing in recreational, research, and commercial enterprises new techniques and processes are being developed to improve the quality of parts created. Even so, the anisotropic properties is still a major hindrance of parts manufactured in this method. The goal is to produce parts that mimic the strength characteristics of a comparable part of the same design and materials created using injection molding. In achieving this goal the production cost can be reduced by eliminating the initial investment needed for the creation of expensive tooling. This initial investment reduction will allow for a wider variant of products in smaller batch runs to be made available. This thesis implements the use of ultraviolet (UV) illumination for an in-process laser local pre-deposition heating (LLPH). By comparing samples with and without the LLPH process it is determined that applied energy that is absorbed by the polymer is converted to an increase in the interlayer temperature, and resulting in an observed increase in tensile strength over the baseline test samples. The increase in interlayer bonding thus can be considered the dominating factor over polymer degradation.
ContributorsKusel, Scott Daniel (Author) / Hsu, Keng (Thesis advisor) / Sodemann, Angela (Committee member) / Kannan, Arunachala M (Committee member) / Arizona State University (Publisher)
Created2017