Matching Items (3)
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- All Subjects: Mechanical Engineering
- Genre: Masters Thesis
Description
ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been applied in multiple areas. This study discussed the possibility of applying nanofiber in heat pipe as new wick structure. In this study, a needleless electrospinning device with high productivity rate was built onsite to systematically investigate the effect of processing parameters on fiber properties as well as to generate nanofiber mat to evaluate its capability in electronics cooling. Polyethylene oxide (PEO) and Polyvinyl Alcohol (PVA) nanofibers were generated. Tensiometer was used for wettability measurement. The results show that independent parameters including spinneret type, working distance, solution concentration and polymer type are strongly correlated with fiber morphology compared to other parameters. The results also show that the fabricated nanofiber mat has high capillary pressure.
ContributorsSun, Tianwei (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongyu (Committee member) / Chen, Kangping (Committee member) / Arizona State University (Publisher)
Created2014
Description
There is a tremendous need for wireless biological signals acquisition for the microelectrode-based neural interface to reduce the mechanical impacts introduced by wire-interconnects system. Long wire connections impede the ability to continuously record the neural signal for chronic application from the rodent's brain. Furthermore, connecting and/or disconnecting Omnetics interconnects often introduces mechanical stress which causes blood vessel to rupture and leads to trauma to the brain tissue. Following the initial implantation trauma, glial tissue formation around the microelectrode and may possibly lead to the microelectrode signal degradation. The aim of this project is to design, develop, and test a compact and power efficient integrated system (IS) that is able to (a) wirelessly transmit triggering signal from the computer to the signal generator which supplies voltage waveforms that move the MEMS microelectrodes, (b) wirelessly transmit neural data from the brain to the external computer, and (c) provide an electrical interface for a closed loop control to continuously move the microelectrode till a proper quality of neural signal is achieved. One of the main challenges of this project is the limited data transmission rate of the commercially available wireless system to transmit 400 kbps of digitized neural signals/electrode, which include spikes, local field potential (LFP), and noise. A commercially available Bluetooth module is only capable to transmit at a total of 115 kbps data transfer rate. The approach to this challenge is to digitize the analog neural signal with a lower accuracy ADC to lower the data rate, so that is reasonable to wirelessly transfer neural data of one channel. In addition, due to the limited space and weight bearing capability to the rodent's head, a compact and power efficient integrated system is needed to reduce the packaged volume and power consumption. 3D SoP technology has been used to stack the PCBs in a 3D form-factor, proper routing designs and techniques are implemented to reduce the electrical routing resistances and the parasitic RC delay. It is expected that this 3D design will reduce the power consumption significantly in comparison to the 2D one. The progress of this project is divided into three different phases, which can be outlined as follow: a) Design, develop, and test Bluetooth wireless system to transmit the triggering signal from the computer to the signal generator. The system is designed for three moveable microelectrodes. b) Design, develop, and test Bluetooth wireless system to wirelessly transmit an amplified (200 gain) neural signal from one single electrode to an external computer. c) Design, develop, and test a closed loop control system that continuously moves a microelectrode in searching of an acceptable quality of neural spikes. The outcome of this project can be used not only for the need of neural application but also for a wider and general applications that requires customized signal generations and wireless data transmission.
ContributorsZhou, Li (Author) / Muthuswamy, Jitendran (Thesis advisor) / Sutanto, Jemmy (Thesis advisor) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2012
Description
Ordered buckling of stiff films on elastomeric substrates has many applications in the field of stretchable electronics. Mechanics plays a very important role in such systems. A full three dimensional finite element analysis studying the pattern of wrinkles formed on a stiff film bonded to a compliant substrate under the action of a compressive force has been widely studied. For thin films, this wrinkling pattern is usually sinusoidal, and for wide films the pattern depends on loading conditions. The present study establishes a relationship between the effect of the load applied at an angle to the stiff film. A systematic experimental and analytical study of these systems has been presented in the present study. The study is performed for two different loading conditions, one with the compressive force applied parallel to the film and the other with an angle included between the application of the force and the alignment of the stiff film. A geometric model closely resembling the experimental specimen studied is created and a three dimensional finite element analysis is carried out using ABAQUS (Version 6.7). The objective of the finite element simulations is to validate the results of the experimental study to be corresponding to the minimum total energy of the system. It also helps to establish a relation between the parameters of the buckling profile and the parameters (elastic and dimensional parameters) of the system. Two methods of non-linear analysis namely, the Newton-Raphson method and Arc-Length method are used. It is found that the Arc-Length method is the most cost effective in terms of total simulation time for large models (higher number of elements).The convergence of the results is affected by a variety of factors like the dimensional parameters of the substrate, mesh density of the model, length of the substrate and the film, the angle included. For narrow silicon films the buckling profile is observed to be sinusoidal and perpendicular to the direction of the silicon film. As the angle increases in wider stiff films the buckling profile is seen to transit from being perpendicular to the direction of the film to being perpendicular to the direction of the application of the pre-stress. This study improves and expands the application of the stiff film buckling to an angled loading condition.
ContributorsKondagari, Swathi Sri (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongyu (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2010