Matching Items (3)
Filtering by

Clear all filters

149939-Thumbnail Image.png
Description
The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated

The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated in advanced CMOS technologies requires understanding and analyzing the basic mechanisms that result in buildup of radiation-induced defects in specific sensitive regions. Extensive experimental studies have demonstrated that the sensitive regions are shallow trench isolation (STI) oxides. Nevertheless, very little work has been done to model the physical mechanisms that result in the buildup of radiation-induced defects and the radiation response of devices fabricated in these technologies. A comprehensive study of the physical mechanisms contributing to the buildup of radiation-induced oxide trapped charges and the generation of interface traps in advanced CMOS devices is presented in this dissertation. The basic mechanisms contributing to the buildup of radiation-induced defects are explored using a physical model that utilizes kinetic equations that captures total ionizing dose (TID) and dose rate effects in silicon dioxide (SiO2). These mechanisms are formulated into analytical models that calculate oxide trapped charge density (Not) and interface trap density (Nit) in sensitive regions of deep-submicron devices. Experiments performed on field-oxide-field-effect-transistors (FOXFETs) and metal-oxide-semiconductor (MOS) capacitors permit investigating TID effects and provide a comparison for the radiation response of advanced CMOS devices. When used in conjunction with closed-form expressions for surface potential, the analytical models enable an accurate description of radiation-induced degradation of transistor electrical characteristics. In this dissertation, the incorporation of TID effects in advanced CMOS devices into surface potential based compact models is also presented. The incorporation of TID effects into surface potential based compact models is accomplished through modifications of the corresponding surface potential equations (SPE), allowing the inclusion of radiation-induced defects (i.e., Not and Nit) into the calculations of surface potential. Verification of the compact modeling approach is achieved via comparison with experimental data obtained from FOXFETs fabricated in a 90 nm low-standby power commercial bulk CMOS technology and numerical simulations of fully-depleted (FD) silicon-on-insulator (SOI) n-channel transistors.
ContributorsSanchez Esqueda, Ivan (Author) / Barnaby, Hugh J (Committee member) / Schroder, Dieter (Thesis advisor) / Schroder, Dieter K. (Committee member) / Holbert, Keith E. (Committee member) / Gildenblat, Gennady (Committee member) / Arizona State University (Publisher)
Created2011
151252-Thumbnail Image.png
Description
Semiconductor device scaling has kept up with Moore's law for the past decades and they have been scaling by a factor of half every one and half years. Every new generation of device technology opens up new opportunities and challenges and especially so for analog design. High speed and low

Semiconductor device scaling has kept up with Moore's law for the past decades and they have been scaling by a factor of half every one and half years. Every new generation of device technology opens up new opportunities and challenges and especially so for analog design. High speed and low gain is characteristic of these processes and hence a tradeoff that can enable to get back gain by trading speed is crucial. This thesis proposes a solution that increases the speed of sampling of a circuit by a factor of three while reducing the specifications on analog blocks and keeping the power nearly constant. The techniques are based on the switched capacitor technique called Correlated Level Shifting. A triple channel Cyclic ADC has been implemented, with each channel working at a sampling frequency of 3.33MS/s and a resolution of 14 bits. The specifications are compared with that based on a traditional architecture to show the superiority of the proposed technique.
ContributorsSivakumar, Balasubramanian (Author) / Farahani, Bahar Jalali (Thesis advisor) / Garrity, Douglas (Committee member) / Bakkaloglu, Bertan (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2012
149546-Thumbnail Image.png
Description
In this work, a high resolution analog-to-digital converter (ADC) for use in harsh environments is presented. The ADC is implemented in bulk CMOS technology and is intended for space exploration, mining and automotive applications with a range of temperature variation in excess of 250°C. A continuous time (CT) sigma delta

In this work, a high resolution analog-to-digital converter (ADC) for use in harsh environments is presented. The ADC is implemented in bulk CMOS technology and is intended for space exploration, mining and automotive applications with a range of temperature variation in excess of 250°C. A continuous time (CT) sigma delta modulator employing a cascade of integrators with feed forward (CIFF) architecture in a single feedback loop topology is used for implementing the ADC. In order to enable operation in the intended application environments, an RC time constant tuning engine is proposed. The tuning engine is used to maintain linearity of a 10 ksps 20 bit continuous time sigma delta ADC designed for spectroscopy applications in space. The proposed circuit which is based on master slave architecture automatically selects on chip resistors to control RC time constants to an accuracy range of ±5% to ±1%. The tuning range, tuning accuracy and circuit non-idealities are analyzed theoretically. To verify the concept, an experimental chip was fabricated in JAZZ .18µm 1.8V CMOS technology. The tuning engine which occupies an area of .065mm2; consists of only an integrator, a comparator and a shift register. It can achieve a signal to noise and distortion ratio (SNDR) greater than 120dB over a ±40% tuning range.
ContributorsAnabtawi, Nijad (Author) / Barnaby, Hugh (Thesis advisor) / Vermeire, Bert (Committee member) / Gildenblat, Gennady (Committee member) / Chae, Junseok (Committee member) / Arizona State University (Publisher)
Created2011