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- All Subjects: Semiconductors
- Creators: Ponce, Fernando A.
- Creators: Simonson, Mark
Description
The work contained in this dissertation is focused on the optical properties of direct band gap semiconductors which crystallize in a wurtzite structure: more specifically, the III-nitrides and ZnO. By using cathodoluminescence spectroscopy, many of their properties have been investigated, including band gaps, defect energy levels, carrier lifetimes, strain states, exciton binding energies, and effects of electron irradiation on luminescence. Part of this work is focused on p-type Mg-doped GaN and InGaN. These materials are extremely important for the fabrication of visible light emitting diodes and diode lasers and their complex nature is currently not entirely understood. The luminescence of Mg-doped GaN films has been correlated with electrical and structural measurements in order to understand the behavior of hydrogen in the material. Deeply-bound excitons emitting near 3.37 and 3.42 eV are observed in films with a significant hydrogen concentration during cathodoluminescence at liquid helium temperatures. These radiative transitions are unstable during electron irradiation. Our observations suggest a hydrogen-related nature, as opposed to a previous assignment of stacking fault luminescence. The intensity of the 3.37 eV transition can be correlated with the electrical activation of the Mg acceptors. Next, the acceptor energy level of Mg in InGaN is shown to decrease significantly with an increase in the indium composition. This also corresponds to a decrease in the resistivity of these films. In addition, the hole concentration in multiple quantum well light emitting diode structures is much more uniform in the active region when Mg-doped InGaN (instead of Mg-doped GaN) is used. These results will help improve the efficiency of light emitting diodes, especially in the green/yellow color range. Also, the improved hole transport may prove to be important for the development of photovoltaic devices. Cathodoluminescence studies have also been performed on nanoindented ZnO crystals. Bulk, single crystal ZnO was indented using a sub-micron spherical diamond tip on various surface orientations. The resistance to deformation (the "hardness") of each surface orientation was measured, with the c-plane being the most resistive. This is due to the orientation of the easy glide planes, the c-planes, being positioned perpendicularly to the applied load. The a-plane oriented crystal is the least resistive to deformation. Cathodoluminescence imaging allows for the correlation of the luminescence with the regions located near the indentation. Sub-nanometer shifts in the band edge emission have been assigned to residual strain the crystals. The a- and m-plane oriented crystals show two-fold symmetry with regions of compressive and tensile strain located parallel and perpendicular to the ±c-directions, respectively. The c-plane oriented crystal shows six-fold symmetry with regions of tensile strain extending along the six equivalent a-directions.
ContributorsJuday, Reid (Author) / Ponce, Fernando A. (Thesis advisor) / Drucker, Jeff (Committee member) / Mccartney, Martha R (Committee member) / Menéndez, Jose (Committee member) / Shumway, John (Committee member) / Arizona State University (Publisher)
Created2013
Description
This dissertation is on the study of structural and optical properties of some III-V and II-VI compound semiconductors. The first part of this dissertation is a study of the deformation mechanisms associated with nanoindentation and nanoscratching of InP, GaN, and ZnO crystals. The second part is an investigation of some fundamental issues regarding compositional fluctuations and microstructure in GaInNAs and InAlN alloys. In the first part, the microstructure of (001) InP scratched in an atomic force microscope with a small diamond tip has been studied as a function of applied normal force and crystalline direction in order to understand at the nanometer scale the deformation mechanisms in the zinc-blende structure. TEM images show deeper dislocation propagation for scratches along <110> compared to <100>. High strain fields were observed in <100> scratches, indicating hardening due to locking of dislocations gliding on different slip planes. Reverse plastic flow have been observed in <110> scratches in the form of pop-up events that result from recovery of stored elastic strain. In a separate study, nanoindentation-induced plastic deformation has been studied in c-, a-, and m-plane ZnO single crystals and c-plane GaN respectively, to study the deformation mechanism in wurtzite hexagonal structures. TEM results reveal that the prime deformation mechanism is slip on basal planes and in some cases, on pyramidal planes, and strain built up along particular directions. No evidence of phase transformation or cracking was observed in both materials. CL imaging reveals quenching of near band-edge emission by dislocations. In the second part, compositional inhomogeneity in quaternary GaInNAs and ternary InAlN alloys has been studied using TEM. It is shown that exposure to antimony during growth of GaInNAs results in uniform chemical composition in the epilayer, as antimony suppresses the surface mobility of adatoms that otherwise leads to two-dimensional growth and elemental segregation. In a separate study, compositional instability is observed in lattice-matched InAlN films grown on GaN, for growth beyond a certain thickness. Beyond 200 nm of thickness, two sub-layers with different indium content are observed, the top one with lower indium content.
ContributorsHuang, Jingyi (Author) / Ponce, Fernando A. (Thesis advisor) / Carpenter, Ray W (Committee member) / Smith, David J. (Committee member) / Yu, Hongbin (Committee member) / Treacy, Michael Mj (Committee member) / Arizona State University (Publisher)
Created2013
Description
Group III-nitride semiconductors have wide application in optoelectronic devices. Spontaneous and piezoelectric polarization effects have been found to be critical for electric and optical properties of group III-nitrides. In this dissertation, firstly, the crystal orientation dependence of the polarization is calculated and in-plane polarization is revealed. The in-plane polarization is sensitive to the lateral characteristic dimension determined by the microstructure. Specific semi-polar plane growth is suggested for reducing quantum-confined Stark effect. The macroscopic electrostatic field from the polarization discontinuity in the heterostructures is discussed, b ased on that, the band diagram of InGaN/GaN quantum well/barrier and AlGaN/GaN heterojunction is obtained from the self-consistent solution of Schrodinger and Poisson equations. New device design such as triangular quantum well with the quenched polarization field is proposed. Electron holography in the transmission electron microscopy is used to examine the electrostatic potential under polarization effects. The measured potential energy profiles of heterostructure are compared with the band simulation, and evidences of two-dimensional hole gas (2DHG) in a wurtzite AlGaN/ AlN/ GaN superlattice, as well as quasi two-dimensional electron gas (2DEG) in a zinc-blende AlGaN/GaN are found. The large polarization discontinuity of AlN/GaN is the main source of the 2DHG of wurtzite nitrides, while the impurity introduced during the growth of AlGaN layer provides the donor states that to a great extent balance the free electrons in zinc-blende nitrides. It is also found that the quasi-2DEG concentration in zinc-blende AlGaN/GaN is about one order of magnitude lower than the wurtzite AlGaN/GaN, due to the absence of polarization. Finally, the InAlN/GaN lattice-matched epitaxy, which ideally has a zero piezoelectric polarization and strong spontaneous polarization, is experimentally studied. The breakdown in compositional homogeneity is triggered by threading dislocations with a screw component propagating from the GaN underlayer, which tend to open up into V-grooves at a certain thickness of the InxAl1-xN layer. The V-grooves coalesce at 200 nm and are filled with material that exhibits a significant drop in indium content and a broad luminescence peak. The structural breakdown is due to heterogeneous nucleation and growth at the facets of the V-grooves.
ContributorsWei, Qiyuan (Author) / Ponce, Fernando A. (Thesis advisor) / Tsen, Kong-Thon (Committee member) / Shumway, John (Committee member) / Menéndez, Jose (Committee member) / Smith, David (Committee member) / Arizona State University (Publisher)
Created2012
Description
III-nitride alloys are wide band gap semiconductors with a broad range of applications in optoelectronic devices such as light emitting diodes and laser diodes. Indium gallium nitride light emitting diodes have been successfully produced over the past decade. But the progress of green emission light emitting devices has been limited by the incorporation of indium in the alloy, mainly due to phase separation. This difficulty could be addressed by studying the growth and thermodynamics of these alloys. Knowledge of thermodynamic phase stabilities and of pressure - temperature - composition phase diagrams is important for an understanding of the boundary conditions of a variety of growth techniques. In this dissertation a study of the phase separation of indium gallium nitride is conducted using a regular solution model of the ternary alloy system. Graphs of Gibbs free energy of mixing were produced for a range of temperatures. Binodal and spinodal decomposition curves show the stable and unstable regions of the alloy in equilibrium. The growth of gallium nitride and indium gallium nitride was attempted by the reaction of molten gallium - indium alloy with ammonia at atmospheric pressure. Characterization by X-ray diffraction, photoluminescence, and secondary electron microscopy show that the samples produced by this method contain only gallium nitride in the hexagonal phase. The instability of indium nitride at the temperatures required for activation of ammonia accounts for these results. The photoluminescence spectra show a correlation between the intensity of a broad green emission, related to native defects, and indium composition used in the molten alloy. A different growth method was used to grow two columnar-structured gallium nitride films using ammonium chloride and gallium as reactants and nitrogen and ammonia as carrier gasses. Investigation by X-ray diffraction and spatially-resolved cathodoluminescence shows the film grown at higher temperature to be primarily hexagonal with small quantities of cubic crystallites, while the one grown at lower temperature to be pure hexagonal. This was also confirmed by low temperature photoluminescence measurements. The results presented here show that cubic and hexagonal crystallites can coexist, with the cubic phase having a much sharper and stronger luminescence. Controlled growth of the cubic phase GaN crystallites can be of use for high efficiency light detecting and emitting devices. The ammonolysis of a precursor was used to grow InGaN powders with different indium composition. High purity hexagonal GaN and InN were obtained. XRD spectra showed complete phase separation for samples with x < 30%, with ~ 9% indium incorporation in the 30% sample. The presence of InGaN in this sample was confirmed by PL measurements, where luminescence from both GaN and InGaN band edge are observed. The growth of higher indium compositions samples proved to be difficult, with only the presence of InN in the sample. Nonetheless, by controlling parameters like temperature and time may lead to successful growth of this III-nitride alloy by this method.
ContributorsHill, Arlinda (Author) / Ponce, Fernando A. (Thesis advisor) / Chamberlin, Ralph V (Committee member) / Sankey, Otto F (Committee member) / Smith, David J. (Committee member) / Tsen, Kong-Thon (Committee member) / Arizona State University (Publisher)
Created2011
Description
The purpose of this thesis was to design a market entrance strategy for Company X to enter the microcontroller (MCU) market within the Internet of Things (IoT). The five IoT segments are automotive; medical; retail; industrial; and military, aerospace, and government. To reach a final decision, we will research the markets, analyze make versus buy scenarios, and deliver a financial analysis on the chosen strategy. Based on the potential financial benefits and compatibility with Company X's current business model, we recommend that Company X enter the automotive segment through mergers & acquisitions (M&A). After analyzing the supply chain structure of the automotive IoT, we advise Company X to acquire Freescale Semiconductor for $46.98 per share.
ContributorsBradley, Rachel (Co-author) / Fankhauser, Elisa (Co-author) / McCoach, Robert (Co-author) / Zheng, Weilin (Co-author) / Simonson, Mark (Thesis director) / Hertzel, Mike (Committee member) / Barrett, The Honors College (Contributor) / Department of Finance (Contributor) / Department of Supply Chain Management (Contributor) / School of Accountancy (Contributor) / School of International Letters and Cultures (Contributor) / WPC Graduate Programs (Contributor)
Created2015-05
Description
Company X is one of the world's largest semiconductor companies in the world, having a current market capitalization of 177.44 Billion USD, an enterprise value of 173.6 Billion USD, and generated 52.7 billion USD in revenue in fiscal year 2013. Recently, Company X has been looking to expand its Foundry business. The Foundry business in the semiconductor business is the actual process of making the chips. This process can be approached in several different ways by companies who need their chips built. A company, like TSMC, can be considered a pure-play company and only makes chips for other companies. A fabless company, like Apple, creates its own chip design and then allows another company to build them. It also uses other chip designs for its products, but outsources the building to another company. Lastly, the integrated device manufacturing companies like Samsung or Company X both design and build the chip. The foundry industry is a rather novel market for Company X because it owns less than 1 percent of the market. However, the industry itself is rather large, generating a total of 40 billion dollars in revenue annually, with expectations to have increasing year over year growth into the foreseeable future. The industry is fairly concentrated with TSMC being the top competitor, owning roughly 50 percent of the market with Samsung and Global Foundries lagging behind as notable competitors. It is a young industry and there is potential opportunity for companies that want to get into the business. For Company X, it is not only another market to get into, but also an added business segment to supplant their business segments that are forecasted to do poorly in the near future. This thesis will analyze the financial opportunity for Company X in the foundry space. Our final product is a series of P&L's which illustrate our findings. The results of our analysis were presented and defended in front of a panel of Company X managers and executives.
ContributorsJones, Trevor (Author) / Matiski, Matthew (Co-author) / Green, Alex (Co-author) / Simonson, Mark (Thesis director) / Hertzel, Michael (Committee member) / Department of Finance (Contributor) / W. P. Carey School of Business (Contributor) / Barrett, The Honors College (Contributor)
Created2015-05
Description
Our thesis project aims to evaluate a major semiconductor company's (The Company) substrate supplier strategy in order to find the ideal number of suppliers that minimizes fixed cost and supplier power. With The Company spending roughly $2.2 billion annually on substrates, supplier strategy has a significant impact on their costs. As a general rule in micro processing, the circuitry of the processor becomes twice as dense every two years. The substrate, being the pathway through which the process or with the motherboard, must become more advanced as well, although the technology does not grow at nearly the same speed. Leading the way in their industry, The Company is at the forefront of technology and produces the world's most advanced processing units. The suppliers The Company purchases from must be innovators in their own respective fields in order to be capable of handling such "bleeding-edge" technology; this requires a supplier to make a commitment to continuously work towards meeting The Company's constantly changing technological requirements. The ultimate goal of this project is to determine the ideal number of substrate suppliers that balances the effects of production costs and buying power to give the company the best overall purchase price.
ContributorsWright, Brian (Author) / Hertzel, Michael (Thesis director) / Simonson, Mark (Committee member) / Shirts, John (Committee member) / Barrett, The Honors College (Contributor)
Created2012-05
Description
We gathered and analyzed key data from a wide-range of competitors in the foundry, fabless, and Integrated design manufacturing business. After detecting a downward trend in the return of invested capital (ROIC) and higher capital intensity of Company X, we searched for alternatives to turn this around. We conclude that, to decrease the net PPE of Company X, a sale-leaseback transaction would help Company X reduce their balance sheet and provided financing to advance their manufacturing capabilities.
ContributorsBhat, Arjun Khandige (Co-author) / Brock, Ethan (Co-author) / Gamperl, Max (Co-author) / Gupta, Viraj (Co-author) / Macha, Sanketh (Co-author) / Simonson, Mark (Thesis director) / Duran, Juan Carlos (Committee member) / Department of Finance (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
The work contained in this dissertation is focused on the structural and optical properties of III-V semiconductor structures for solar cell applications. By using transmission electron microscopy, many of their structural properties have been investigated, including morphology, defects, and strain relaxation. The optical properties of the semiconductor structures have been studied by photoluminescence and cathodoluminescence.
Part of this work is focused on InAs quantum dots (QDs) embedded in AlGaAs matrices. This QD system is important for the realization of intermediate-band solar cells, which has three light absorption paths for high efficiency photovoltaics. The suppression of plastic strain relaxation in the QDs shows a significant improvement of the optoelectronic properties. A partial capping followed by a thermal annealing step is used to achieve spool-shaped QDs with a uniform height following the thickness of the capping layer. This step keeps the height of the QDs below a critical value that is required for plastic relaxation. The spool-shaped QDs exhibit two photoluminescence peaks that are attributed to ground and excited state transitions. The luminescence peak width is associated with the QD diameter distribution. An InAs cover layer formed during annealing is found responsible for the loss of the confinement of the excited states in smaller QDs.
The second part of this work is focused on the investigation of the InxGa1-xN thin films having different bandgaps for double-junction solar cells. InxGa1-xN films with x ≤ 0.15 were grown by metal organic chemical vapor deposition. The defects in films with different indium contents have been studied. Their effect on the optical properties of the film have been investigated by cathodoluminescence. InxGa1-xN films with indium contents higher than 20% were grown by molecular beam epitaxy. The strain relaxation in the films has been measured from electron diffraction patterns taken in cross-sectional TEM specimens. Moiré fringes in some of the films reveal interfacial strain relaxation that is explained by a critical thickness model.
Part of this work is focused on InAs quantum dots (QDs) embedded in AlGaAs matrices. This QD system is important for the realization of intermediate-band solar cells, which has three light absorption paths for high efficiency photovoltaics. The suppression of plastic strain relaxation in the QDs shows a significant improvement of the optoelectronic properties. A partial capping followed by a thermal annealing step is used to achieve spool-shaped QDs with a uniform height following the thickness of the capping layer. This step keeps the height of the QDs below a critical value that is required for plastic relaxation. The spool-shaped QDs exhibit two photoluminescence peaks that are attributed to ground and excited state transitions. The luminescence peak width is associated with the QD diameter distribution. An InAs cover layer formed during annealing is found responsible for the loss of the confinement of the excited states in smaller QDs.
The second part of this work is focused on the investigation of the InxGa1-xN thin films having different bandgaps for double-junction solar cells. InxGa1-xN films with x ≤ 0.15 were grown by metal organic chemical vapor deposition. The defects in films with different indium contents have been studied. Their effect on the optical properties of the film have been investigated by cathodoluminescence. InxGa1-xN films with indium contents higher than 20% were grown by molecular beam epitaxy. The strain relaxation in the films has been measured from electron diffraction patterns taken in cross-sectional TEM specimens. Moiré fringes in some of the films reveal interfacial strain relaxation that is explained by a critical thickness model.
ContributorsXie, Hong'en (Author) / Ponce, Fernando A. (Thesis advisor) / Crozier, Peter A. (Committee member) / Mccartney, Martha R (Committee member) / Arizona State University (Publisher)
Created2016
Description
Light Emitting Diodes even with their longer life, robust build and low power consumption, they are still plagued by some problems the most significant of which are the current droop and thermal droop. Current droop causes a lowering in the Internal Quantum Efficiency with increased current injection while thermal droop lowers the whole Internal Quantum Efficiency curve with increase in temperature. The focus here was understanding effects of thermal droop and develop a method to control it.
Shockley Read Hall recombination plays a dominant role in the thermal droop effect when the current injection is low. Since the blue light emitting diode is based on Gallium Nitride, we need to take into consideration the effect of piezoelectric polarization in the quantum wells. The effects of the piezoelectric fields were studied based on the Gallium Nitride plane orientations. It was found in a Gallium Nitride light emitting diodes simulation study that more the number of quantum wells, lower would be the Radiative recombination rate. The problem of exacerbated spatial separation of electron hole wavefunctions in a thick single quantum well structure lead to the development of a dual well structure where one well assisted the other during high temperature operations. The Electron Blocking Layer was reduced in thickness and was made only 10 nm thick with a 5 nm Gallium Nitride buffer between it and the active region wells. The main reason for reducing the electron blocking layer thickness was to reduce the valance band offset and improve hole transport into the active region. Three different dual well designs were simulated of 3nm, 6nm and 9nm wide wells. The output parameters like the Power Spectral Density, Electron bound density, Light Output Power and Electron-Hole wavefunction overlaps were calculated. It was found that one of the wells acted as an assisting well where it had very little radiative recombination activity in it at room temperature.
As the temperature increased, it was observed that the electrons in the main well started to overflow out of it and into the assisting well where the radiative recombination rate increased significantly. This lead to a boost in Internal Quantum Efficiency.
Shockley Read Hall recombination plays a dominant role in the thermal droop effect when the current injection is low. Since the blue light emitting diode is based on Gallium Nitride, we need to take into consideration the effect of piezoelectric polarization in the quantum wells. The effects of the piezoelectric fields were studied based on the Gallium Nitride plane orientations. It was found in a Gallium Nitride light emitting diodes simulation study that more the number of quantum wells, lower would be the Radiative recombination rate. The problem of exacerbated spatial separation of electron hole wavefunctions in a thick single quantum well structure lead to the development of a dual well structure where one well assisted the other during high temperature operations. The Electron Blocking Layer was reduced in thickness and was made only 10 nm thick with a 5 nm Gallium Nitride buffer between it and the active region wells. The main reason for reducing the electron blocking layer thickness was to reduce the valance band offset and improve hole transport into the active region. Three different dual well designs were simulated of 3nm, 6nm and 9nm wide wells. The output parameters like the Power Spectral Density, Electron bound density, Light Output Power and Electron-Hole wavefunction overlaps were calculated. It was found that one of the wells acted as an assisting well where it had very little radiative recombination activity in it at room temperature.
As the temperature increased, it was observed that the electrons in the main well started to overflow out of it and into the assisting well where the radiative recombination rate increased significantly. This lead to a boost in Internal Quantum Efficiency.
ContributorsDas, Shiladitya (Author) / Zhao, Yuji (Thesis advisor) / Vasileska, Dragica (Committee member) / Ning, Cun-Zheng (Committee member) / Arizona State University (Publisher)
Created2017