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Description
Radio frequency (RF) transceivers require a disproportionately high effort in terms of test development time, test equipment cost, and test time. The relatively high test cost stems from two contributing factors. First, RF transceivers require the measurement of a diverse set of specifications, requiring multiple test set-ups and long test

Radio frequency (RF) transceivers require a disproportionately high effort in terms of test development time, test equipment cost, and test time. The relatively high test cost stems from two contributing factors. First, RF transceivers require the measurement of a diverse set of specifications, requiring multiple test set-ups and long test times, which complicates load-board design, debug, and diagnosis. Second, high frequency operation necessitates the use of expensive equipment, resulting in higher per second test time cost compared with mixed-signal or digital circuits. Moreover, in terms of the non-recurring engineering cost, the need to measure complex specfications complicates the test development process and necessitates a long learning process for test engineers. Test time is dominated by changing and settling time for each test set-up. Thus, single set-up test solutions are desirable. Loop-back configuration where the transmitter output is connected to the receiver input are used as the desirable test set- up for RF transceivers, since it eliminates the reliance on expensive instrumentation for RF signal analysis and enables measuring multiple parameters at once. In-phase and Quadrature (IQ) imbalance, non-linearity, DC offset and IQ time skews are some of the most detrimental imperfections in transceiver performance. Measurement of these parameters in the loop-back mode is challenging due to the coupling between the receiver (RX) and transmitter (TX) parameters. Loop-back based solutions are proposed in this work to resolve this issue. A calibration algorithm for a subset of the above mentioned impairments is also presented. Error Vector Magnitude (EVM) is a system-level parameter that is specified for most advanced communication standards. EVM measurement often takes extensive test development efforts, tester resources, and long test times. EVM is analytically related to system impairments, which are typically measured in a production test i environment. Thus, EVM test can be eliminated from the test list if the relations between EVM and system impairments are derived independent of the circuit implementation and manufacturing process. In this work, the focus is on the WLAN standard, and deriving the relations between EVM and three of the most detrimental impairments for QAM/OFDM based systems (IQ imbalance, non-linearity, and noise). Having low cost test techniques for measuring the RF transceivers imperfections and being able to analytically compute EVM from the measured parameters is a complete test solution for RF transceivers. These techniques along with the proposed calibration method can be used in improving the yield by widening the pass/fail boundaries for transceivers imperfections. For all of the proposed methods, simulation and hardware measurements prove that the proposed techniques provide accurate characterization of RF transceivers.
ContributorsNassery, Afsaneh (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Synchronous buck converters have become the obvious choice of design for high efficiency voltage down-conversion applications and find wide scale usage in today's IC industry. The use of digital control in synchronous buck converters is becoming increasingly popular because of its associated advantages over traditional analog counterparts in terms of

Synchronous buck converters have become the obvious choice of design for high efficiency voltage down-conversion applications and find wide scale usage in today's IC industry. The use of digital control in synchronous buck converters is becoming increasingly popular because of its associated advantages over traditional analog counterparts in terms of design flexibility, reduced use of off-chip components, and better programmability to enable advanced controls. They also demonstrate better immunity to noise, enhances tolerance to the process, voltage and temperature (PVT) variations, low chip area and as a result low cost. It enables processing in digital domain requiring a need of analog-digital interfacing circuit viz. Analog to Digital Converter (ADC) and Digital to Analog Converter (DAC). A Digital to Pulse Width Modulator (DPWM) acts as time domain DAC required in the control loop to modulate the ON time of the Power-MOSFETs. The accuracy and efficiency of the DPWM creates the upper limit to the steady state voltage ripple of the DC - DC converter and efficiency in low load conditions. This thesis discusses the prevalent architectures for DPWM in switched mode DC - DC converters. The design of a Hybrid DPWM is presented. The DPWM is 9-bit accurate and is targeted for a Synchronous Buck Converter with a switching frequency of 1.0 MHz. The design supports low power mode(s) for the buck converter in the Pulse Frequency Modulation (PFM) mode as well as other fail-safe features. The design implementation is digital centric making it robust across PVT variations and portable to lower technology nodes. Key target of the design is to reduce design time. The design is tested across large Process (+/- 3σ), Voltage (1.8V +/- 10%) and Temperature (-55.0 °C to 125 °C) and is in the process of tape-out.
ContributorsKumar, Amit (Author) / Bakkaloglu, Bertan (Thesis advisor) / Song, Hongjiang (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Doppler radar can be used to measure respiration and heart rate without contact and through obstacles. In this work, a Doppler radar architecture at 2.4 GHz and a new signal processing algorithm to estimate the respiration and heart rate are presented. The received signal is dominated by the transceiver noise,

Doppler radar can be used to measure respiration and heart rate without contact and through obstacles. In this work, a Doppler radar architecture at 2.4 GHz and a new signal processing algorithm to estimate the respiration and heart rate are presented. The received signal is dominated by the transceiver noise, LO phase noise and clutter which reduces the signal-to-noise ratio of the desired signal. The proposed architecture and algorithm are used to mitigate these issues and obtain an accurate estimate of the heart and respiration rate. Quadrature low-IF transceiver architecture is adopted to resolve null point problem as well as avoid 1/f noise and DC offset due to mixer-LO coupling. Adaptive clutter cancellation algorithm is used to enhance receiver sensitivity coupled with a novel Pattern Search in Noise Subspace (PSNS) algorithm is used to estimate respiration and heart rate. PSNS is a modified MUSIC algorithm which uses the phase noise to enhance Doppler shift detection. A prototype system was implemented using off-the-shelf TI and RFMD transceiver and tests were conduct with eight individuals. The measured results shows accurate estimate of the cardio pulmonary signals in low-SNR conditions and have been tested up to a distance of 6 meters.
ContributorsKhunti, Hitesh Devshi (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Bliss, Daniel (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
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Description
This thesis work mainly examined the stability and reliability issues of amorphous Indium Gallium Zinc Oxide (a-IGZO) thin film transistors under bias-illumination stress. Amorphous hydrogenated silicon has been the dominating material used in thin film transistors as a channel layer. However with the advent of modern high performance display technologies,

This thesis work mainly examined the stability and reliability issues of amorphous Indium Gallium Zinc Oxide (a-IGZO) thin film transistors under bias-illumination stress. Amorphous hydrogenated silicon has been the dominating material used in thin film transistors as a channel layer. However with the advent of modern high performance display technologies, it is required to have devices with better current carrying capability and better reproducibility. This brings the idea of new material for channel layer of these devices. Researchers have tried poly silicon materials, organic materials and amorphous mixed oxide materials as a replacement to conventional amorphous silicon layer. Due to its low price and easy manufacturing process, amorphous mixed oxide thin film transistors have become a viable option to replace the conventional ones in order to achieve high performance display circuits. But with new materials emerging, comes the challenge of reliability and stability issues associated with it. Performance measurement under bias stress and bias-illumination stress have been reported previously. This work proposes novel post processing low temperature long time annealing in optimum ambient in order to annihilate or reduce the defects and vacancies associated with amorphous material which lead to the instability or even the failure of the devices. Thin film transistors of a-IGZO has been tested for standalone illumination stress and bias-illumination stress before and after annealing. HP 4155B semiconductor parameter analyzer has been used to stress the devices and measure the output characteristics and transfer characteristics of the devices. Extra attention has been given about the effect of forming gas annealing on a-IGZO thin film. a-IGZO thin film deposited on silicon substrate has been tested for resistivity, mobility and carrier concentration before and after annealing in various ambient. Elastic Recoil Detection has been performed on the films to measure the amount of hydrogen atoms present in the film. Moreover, the circuit parameters of the thin film transistors has been extracted to verify the physical phenomenon responsible for the instability and failure of the devices. Parameters like channel resistance, carrier mobility, power factor has been extracted and variation of these parameters has been observed before and after the stress.
ContributorsRuhul Hasin, Muhammad (Author) / Alford, Terry L. (Thesis advisor) / Krause, Stephen (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary

Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary with process and requires calibration to make them reliable. This increases test cost and testing time. This challenge can be overcome by combining electrical stimulus based testing along with statistical analysis on MEMS response for electrical stimulus and also limited physical stimulus response data. This thesis proposes electrical stimulus based built in self test(BIST) which can be used to get MEMS data and later this data can be used for statistical analysis. A capacitive MEMS accelerometer is considered to test this BIST approach. This BIST circuit overhead is less and utilizes most of the standard readout circuit. This thesis discusses accelerometer response for electrical stimulus and BIST architecture. As a part of this BIST circuit, a second order sigma delta modulator has been designed. This modulator has a sampling frequency of 1MHz and bandwidth of 6KHz. SNDR of 60dB is achieved with 1Vpp differential input signal and 3.3V supply
ContributorsKundur, Vinay (Author) / Bakkaloglu, Bertan (Committee member) / Ozev, Sule (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there

Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there is not a single straightforward solution to the problem. Products that are tested have several application domains and distinct customer profiles. Some products are required to operate for long periods of time while others are required to be low cost and optimized for low cost. Multitude of constraints and goals make it impossible to find a single solution that work for all cases. Hence, test development/optimization is typically design/circuit dependent and even process specific. Therefore, test optimization cannot be performed using a single test approach, but necessitates a diversity of approaches. This works aims at addressing test cost minimization and test quality improvement at various levels. In the first chapter of the work, we investigate pre-silicon strategies, such as design for test and pre-silicon statistical simulation optimization. In the second chapter, we investigate efficient post-silicon test strategies, such as adaptive test, adaptive multi-site test, outlier analysis, and process shift detection/tracking.
ContributorsYilmaz, Ender (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012
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Description
The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured

The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured using CMOS and the final product is integrated on to a single chip. Amount spent on testing of the MEMS devices make up a considerable share of the total final cost of the device. In order to save the cost and time spent on testing, researchers have been trying to develop different methodologies. At present, MEMS devices are tested using mechanical stimuli to measure the device parameters and for calibration the device. This testing is necessary since the MEMS process is not a very well controlled process unlike CMOS. This is done using an ATE and the cost of using ATE (automatic testing equipment) contribute to 30-40% of the devices final cost. This thesis proposes an architecture which can use an Electrical Signal to stimulate the MEMS device and use the data from the MEMS response in approximating the calibration coefficients efficiently. As a proof of concept, we have designed a BIST (Built-in self-test) circuit for MEMS accelerometer. The BIST has an electrical stimulus generator, Capacitance-to-voltage converter, ∑ ∆ ADC. This thesis explains in detail the design of the Electrical stimulus generator. We have also designed a technique to correlate the parameters obtained from electrical stimuli to those obtained by mechanical stimuli. This method is cost effective since the additional circuitry needed to implement BIST is less since the technique utilizes most of the existing standard readout circuitry already present.
ContributorsJangala Naga, Naveen Sai (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2014
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Description
The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem

The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem to a transistor-level programmable hardware, is proposed. This approach enables fast system level validation and a reduction in post-Silicon bugs, minimizing design risk and cost. The unique features of the approach include 1) transistor-level programmability that emulates each transistor behavior in an analog design, achieving very fine granularity of reconfiguration; 2) programmable switches that are treated as a design component during analog transistor emulating, and optimized with the reconfiguration matrix; 3) compensation of AC performance degradation through boosting the bias current. Based on these principles, a digitally controlled PANDA platform is designed at 45nm node that can map AMS modules across 22nm to 90nm technology nodes. A systematic emulation approach to map any analog transistor to 45nm PANDA cell is proposed, which achieves transistor level matching accuracy of less than 5% for ID and less than 10% for Rout and Gm. Circuit level analog metrics of a voltage-controlled oscillator (VCO) emulated by PANDA, match to those of the original designs in 22nm and 90nm nodes with less than a 5% error. Several other 90nm and 22nm analog blocks are successfully emulated by the 45nm PANDA platform, including a folded-cascode operational amplifier and a sample-and-hold module (S/H). Further capabilities of PANDA are demonstrated by the first full-chip silicon of PANDA which is implemented on 65nm process This system consists of a 24×25 cell array, reconfigurable interconnect and configuration memory. The voltage and current reference circuits, op amps and a VCO with a phase interpolation circuit are emulated by PANDA.
ContributorsSuh, Jounghyuk (Author) / Bakkaloglu, Bertan (Thesis advisor) / Cao, Yu (Committee member) / Ozev, Sule (Committee member) / Kozicki, Michael (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Digital to analog converters (DACs) find widespread use in communications equipment. Most commercially available DAC's which are intended to be used in transmitter applications come in a dual configuration for carrying the in phase (I) and quadrature (Q) data and feature on chip digital mixing. Digital mixing offers many benefits

Digital to analog converters (DACs) find widespread use in communications equipment. Most commercially available DAC's which are intended to be used in transmitter applications come in a dual configuration for carrying the in phase (I) and quadrature (Q) data and feature on chip digital mixing. Digital mixing offers many benefits concerning I and Q matching but has one major drawback; the update rate of the DAC must be higher than the intermediate frequency (IF) which is most commonly a factor of 4. This drawback motivates the need for interpolation so that a low update rate can be used for components preceding the DACs. In this thesis the design of an interpolating DAC integrated circuit (IC) to be used in a transmitter application for generating a 100MHz IF is presented. Many of the transistor level implementations are provided. The tradeoffs in the design are analyzed and various options are discussed. This thesis provides a basic foundation for designing an IC of this nature and will give the reader insight into potential areas of further research. At the time of this writing the chip is in fabrication therefore this document does not contain test results.
ContributorsNixon, Cliff (Author) / Bakkaloglu, Bertan (Thesis advisor) / Arizona State University (Publisher)
Created2013
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Description
In-band full-duplex relays are envisioned as promising solution to increase the throughput of next generation wireless communications. Full-duplex relays, being able to transmit and receive at same carrier frequency, offers increased spectral efficiency compared to half-duplex relays that transmit and receive at different frequencies or times. The practical implementation of

In-band full-duplex relays are envisioned as promising solution to increase the throughput of next generation wireless communications. Full-duplex relays, being able to transmit and receive at same carrier frequency, offers increased spectral efficiency compared to half-duplex relays that transmit and receive at different frequencies or times. The practical implementation of full-duplex relays is limited by the strong self-interference caused by the coupling of relay's own transit signals to its desired received signals. Several techniques have been proposed in literature to mitigate the relay self-interference. In this thesis, the performance of in-band full-duplex multiple-input multiple-output (MIMO) relays is considered in the context of simultaneous communications and channel estimation. In particular, adaptive spatial transmit techniques is considered to protect the full-duplex radio's receive array. It is assumed that relay's transmit and receive antenna phase centers are physically distinct. This allows the radio to employ adaptive spatial transmit and receive processing to mitigate self-interference.

The performance of this protection is dependent upon numerous factors, including channel estimation accuracy, which is the focus of this thesis. In particular, the concentration is on estimating the self-interference channel. A novel approach of simultaneous signaling to estimate the self-interference channel in MIMO full-duplex relays is proposed. To achieve this simultaneous communications

and channel estimation, a full-rank pilot signal at a reduced relative power is transmitted simultaneously with a low rank communication waveform. The self-interference mitigation is investigated in the context of eigenvalue spread of spatial relay receive co-variance matrix. Performance is demonstrated by using simulations,

in which orthogonal-frequency division-multiplexing communications and pilot sequences are employed.
ContributorsSekhar, Kishore Kumar (Author) / Bliss, Daniel W (Thesis advisor) / Kitchen, Jennifer (Committee member) / Zhang, Junshan (Committee member) / Arizona State University (Publisher)
Created2014