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Description
A modeling platform for predicting total ionizing dose (TID) and dose rate response of commercial commercial-off-the-shelf (COTS) linear bipolar circuits and technologies is introduced. Tasks associated with the modeling platform involve the development of model to predict the excess current response in a bipolar transistor given inputs of interface (NIT)

A modeling platform for predicting total ionizing dose (TID) and dose rate response of commercial commercial-off-the-shelf (COTS) linear bipolar circuits and technologies is introduced. Tasks associated with the modeling platform involve the development of model to predict the excess current response in a bipolar transistor given inputs of interface (NIT) and oxide defects (NOT) which are caused by ionizing radiation exposure. Existing models that attempt to predict this excess base current response are derived and discussed in detail. An improved model is proposed which modifies the existing model and incorporates the impact of charged interface trap defects on radiation-induced excess base current. The improved accuracy of the new model in predicting excess base current response in lateral PNP (LPNP) is then verified with Technology Computer Aided Design (TCAD) simulations. Finally, experimental data and compared with the improved and existing model calculations.
ContributorsTolleson, Blayne S. (Author) / Barnaby, Hugh J (Thesis advisor) / Gonzalez-Velo, Yago (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2017
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Description
ABSTRACT

Programmable metallization cell (PMC) technology uses the mechanism of metal ion transport in solid electrolytes and electrochemical redox reactions to form metallic electrodeposits. When a positive bias is applied from anode to cathode, atoms at the anode are oxidized to ions and dissolve in the solid electrolyte. They

ABSTRACT

Programmable metallization cell (PMC) technology uses the mechanism of metal ion transport in solid electrolytes and electrochemical redox reactions to form metallic electrodeposits. When a positive bias is applied from anode to cathode, atoms at the anode are oxidized to ions and dissolve in the solid electrolyte. They travel to the cathode under the influence of an electric field, where they are reduced to form electrodeposits. These electrodeposits are filamentary in nature and grow in different patterns. Devices that make use of the principle of filament growth have applications in memory, RF switching, and hardware security.

The solid electrolyte under investigation is tungsten trioxide with copper deposited on top. For a standard PMC, these layers are heated in a convection oven to dope the electrolyte. Once the heating process is completed, electrodes are deposited on top of the electrolyte and biased to grow the filaments. What is investigated is the rate of dendritic growth to applied field on the PMC and the composition of the electrolyte. Also investigated are modified three-terminal PMC capacitance change devices. These devices have a buried sensing electrode that senses the increasing capacitance as the filaments grow and increase the upper electrode area.

The rate of dendritic growth in the tungsten trioxide and copper electrolyte of different chemistries and applied field to the PMC devices is the important parameter. The rate of dendritic growth is related to the change of capacitance. Through sensing the change in capacitance over time the modified PMC device will function as an odometer device that can be attached to chips. The attachment of these devices to chips, help in preventing illegal recycling of old chips by marking those chips as old. This will prevent would-be attackers from inserting modified chips in systems that will enable them to by-pass any software security precautions.
ContributorsKrishnan, Anand (Author) / Kozicki, Michael N (Thesis advisor) / Barnaby, Hugh J (Committee member) / Gonzalez-Velo, Yago (Committee member) / Arizona State University (Publisher)
Created2019
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Description
Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these

Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these devices attractive for various More-Than-Moore applications. Existing literature lacks a comprehensive study of electrodeposit growth kinetics in lateral PMCs. Moreover, the morphology of electrodeposit growth in larger, planar devices is also not understood. Despite the variety of applications, lateral PMCs are not embraced by the semiconductor industry due to incompatible materials and high operating voltages needed for such devices. In this work, a numerical model based on the basic processes in PMCs – cation drift and redox reactions – is proposed, and the effect of various materials parameters on the electrodeposit growth kinetics is reported. The morphology of the electrodeposit growth and kinetics of the electrodeposition process are also studied in devices based on Ag-Ge30Se70 materials system. It was observed that the electrodeposition process mainly consists of two regimes of growth – cation drift limited regime and mixed regime. The electrodeposition starts in cation drift limited regime at low electric fields and transitions into mixed regime as the field increases. The onset of mixed regime can be controlled by applied voltage which also affects the morphology of electrodeposit growth. The numerical model was then used to successfully predict the device kinetics and onset of mixed regime. The problem of materials incompatibility with semiconductor manufacturing was solved by proposing a novel device structure. A bilayer structure using semiconductor foundry friendly materials was suggested as a candidate for solid electrolyte. The bilayer structure consists of a low resistivity oxide shunt layer on top of a high resistivity ion carrying oxide layer. Devices using Cu2O as the low resistivity shunt on top of Cu doped WO3 oxide were fabricated. The bilayer devices provided orders of magnitude improvement in device performance in the context of operating voltage and switching time. Electrical and materials characterization revealed the structure of bilayers and the mechanism of electrodeposition in these devices.
ContributorsChamele, Ninad (Author) / Kozicki, Michael (Thesis advisor) / Barnaby, Hugh (Committee member) / Newman, Nathan (Committee member) / Gonzalez-Velo, Yago (Committee member) / Arizona State University (Publisher)
Created2020