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Description
Radio frequency (RF) transceivers require a disproportionately high effort in terms of test development time, test equipment cost, and test time. The relatively high test cost stems from two contributing factors. First, RF transceivers require the measurement of a diverse set of specifications, requiring multiple test set-ups and long test

Radio frequency (RF) transceivers require a disproportionately high effort in terms of test development time, test equipment cost, and test time. The relatively high test cost stems from two contributing factors. First, RF transceivers require the measurement of a diverse set of specifications, requiring multiple test set-ups and long test times, which complicates load-board design, debug, and diagnosis. Second, high frequency operation necessitates the use of expensive equipment, resulting in higher per second test time cost compared with mixed-signal or digital circuits. Moreover, in terms of the non-recurring engineering cost, the need to measure complex specfications complicates the test development process and necessitates a long learning process for test engineers. Test time is dominated by changing and settling time for each test set-up. Thus, single set-up test solutions are desirable. Loop-back configuration where the transmitter output is connected to the receiver input are used as the desirable test set- up for RF transceivers, since it eliminates the reliance on expensive instrumentation for RF signal analysis and enables measuring multiple parameters at once. In-phase and Quadrature (IQ) imbalance, non-linearity, DC offset and IQ time skews are some of the most detrimental imperfections in transceiver performance. Measurement of these parameters in the loop-back mode is challenging due to the coupling between the receiver (RX) and transmitter (TX) parameters. Loop-back based solutions are proposed in this work to resolve this issue. A calibration algorithm for a subset of the above mentioned impairments is also presented. Error Vector Magnitude (EVM) is a system-level parameter that is specified for most advanced communication standards. EVM measurement often takes extensive test development efforts, tester resources, and long test times. EVM is analytically related to system impairments, which are typically measured in a production test i environment. Thus, EVM test can be eliminated from the test list if the relations between EVM and system impairments are derived independent of the circuit implementation and manufacturing process. In this work, the focus is on the WLAN standard, and deriving the relations between EVM and three of the most detrimental impairments for QAM/OFDM based systems (IQ imbalance, non-linearity, and noise). Having low cost test techniques for measuring the RF transceivers imperfections and being able to analytically compute EVM from the measured parameters is a complete test solution for RF transceivers. These techniques along with the proposed calibration method can be used in improving the yield by widening the pass/fail boundaries for transceivers imperfections. For all of the proposed methods, simulation and hardware measurements prove that the proposed techniques provide accurate characterization of RF transceivers.
ContributorsNassery, Afsaneh (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Photovoltaic (PV) module nameplates typically provide the module's electrical characteristics at standard test conditions (STC). The STC conditions are: irradiance of 1000 W/m2, cell temperature of 25oC and sunlight spectrum at air mass 1.5. However, modules in the field experience a wide range of environmental conditions which affect their electrical

Photovoltaic (PV) module nameplates typically provide the module's electrical characteristics at standard test conditions (STC). The STC conditions are: irradiance of 1000 W/m2, cell temperature of 25oC and sunlight spectrum at air mass 1.5. However, modules in the field experience a wide range of environmental conditions which affect their electrical characteristics and render the nameplate data insufficient in determining a module's overall, actual field performance. To make sound technical and financial decisions, designers and investors need additional performance data to determine the energy produced by modules operating under various field conditions. The angle of incidence (AOI) of sunlight on PV modules is one of the major parameters which dictate the amount of light reaching the solar cells. The experiment was carried out at the Arizona State University- Photovoltaic Reliability Laboratory (ASU-PRL). The data obtained was processed in accordance with the IEC 61853-2 model to obtain relative optical response of the modules (response which does not include the cosine effect). The results were then compared with theoretical models for air-glass interface and also with the empirical model developed by Sandia National Laboratories. The results showed that all modules with glass as the superstrate had identical optical response and were in agreement with both the IEC 61853-2 model and other theoretical and empirical models. The performance degradation of module over years of exposure in the field is dependent upon factors such as environmental conditions, system configuration, etc. Analyzing the degradation of power and other related performance parameters over time will provide vital information regarding possible degradation rates and mechanisms of the modules. An extensive study was conducted by previous ASU-PRL students on approximately 1700 modules which have over 13 years of hot- dry climatic field condition. An analysis of the results obtained in previous ASU-PRL studies show that the major degradation in crystalline silicon modules having glass/polymer construction is encapsulant discoloration (causing short circuit current drop) and solder bond degradation (causing fill factor drop due to series resistance increase). The power degradation for crystalline silicon modules having glass/glass construction was primarily attributed to encapsulant delamination (causing open-circuit voltage drop).
ContributorsVasantha Janakeeraman, Suryanarayana (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary

Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary with process and requires calibration to make them reliable. This increases test cost and testing time. This challenge can be overcome by combining electrical stimulus based testing along with statistical analysis on MEMS response for electrical stimulus and also limited physical stimulus response data. This thesis proposes electrical stimulus based built in self test(BIST) which can be used to get MEMS data and later this data can be used for statistical analysis. A capacitive MEMS accelerometer is considered to test this BIST approach. This BIST circuit overhead is less and utilizes most of the standard readout circuit. This thesis discusses accelerometer response for electrical stimulus and BIST architecture. As a part of this BIST circuit, a second order sigma delta modulator has been designed. This modulator has a sampling frequency of 1MHz and bandwidth of 6KHz. SNDR of 60dB is achieved with 1Vpp differential input signal and 3.3V supply
ContributorsKundur, Vinay (Author) / Bakkaloglu, Bertan (Committee member) / Ozev, Sule (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there

Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there is not a single straightforward solution to the problem. Products that are tested have several application domains and distinct customer profiles. Some products are required to operate for long periods of time while others are required to be low cost and optimized for low cost. Multitude of constraints and goals make it impossible to find a single solution that work for all cases. Hence, test development/optimization is typically design/circuit dependent and even process specific. Therefore, test optimization cannot be performed using a single test approach, but necessitates a diversity of approaches. This works aims at addressing test cost minimization and test quality improvement at various levels. In the first chapter of the work, we investigate pre-silicon strategies, such as design for test and pre-silicon statistical simulation optimization. In the second chapter, we investigate efficient post-silicon test strategies, such as adaptive test, adaptive multi-site test, outlier analysis, and process shift detection/tracking.
ContributorsYilmaz, Ender (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012
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Description
The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured

The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured using CMOS and the final product is integrated on to a single chip. Amount spent on testing of the MEMS devices make up a considerable share of the total final cost of the device. In order to save the cost and time spent on testing, researchers have been trying to develop different methodologies. At present, MEMS devices are tested using mechanical stimuli to measure the device parameters and for calibration the device. This testing is necessary since the MEMS process is not a very well controlled process unlike CMOS. This is done using an ATE and the cost of using ATE (automatic testing equipment) contribute to 30-40% of the devices final cost. This thesis proposes an architecture which can use an Electrical Signal to stimulate the MEMS device and use the data from the MEMS response in approximating the calibration coefficients efficiently. As a proof of concept, we have designed a BIST (Built-in self-test) circuit for MEMS accelerometer. The BIST has an electrical stimulus generator, Capacitance-to-voltage converter, ∑ ∆ ADC. This thesis explains in detail the design of the Electrical stimulus generator. We have also designed a technique to correlate the parameters obtained from electrical stimuli to those obtained by mechanical stimuli. This method is cost effective since the additional circuitry needed to implement BIST is less since the technique utilizes most of the existing standard readout circuitry already present.
ContributorsJangala Naga, Naveen Sai (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2014
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Description
This is a two-part thesis: Part 1 of this thesis tests and validates the methodology and mathematical models of the International Electrotechnical Commission (IEC) 61853-2 standard for the measurement of angle of incidence (AOI) effects on photovoltaic modules. Flat-plate photovoltaic modules in the field operate under a wide range of

This is a two-part thesis: Part 1 of this thesis tests and validates the methodology and mathematical models of the International Electrotechnical Commission (IEC) 61853-2 standard for the measurement of angle of incidence (AOI) effects on photovoltaic modules. Flat-plate photovoltaic modules in the field operate under a wide range of environmental conditions. The purpose of IEC 61853-2 is to characterize photovoltaic modules' performance under specific environmental conditions. Part 1 of this report focuses specifically on AOI. To accurately test and validate IEC 61853-2 standard for measuring AOI, meticulous experimental setup and test procedures were followed. Modules of five different photovoltaic technology types with glass superstrates were tested. Test results show practically identical relative light transmission plots for all five test modules. The experimental results were compared to theoretical and empirical models for relative light transmission of air-glass interface. IEC 61853-2 states "for the flat glass superstrate modules, the AOI test does not need to be performed; rather, the data of a flat glass air interface can be used." The results obtained in this thesis validate this statement. This work was performed in collaboration with another Master of Science student (Surynarayana Janakeeraman) and the test results are presented in two masters theses. Part 2 of this thesis is to develop non-intrusive techniques to accurately measure the quantum efficiency (QE) of a single-junction crystalline silicon cell within a commercial module. This thesis will describe in detail all the equipment and conditions necessary to measure QE and discuss the factors which may influence this measurement. The ability to utilize a non-intrusive test to measure quantum efficiency of a cell within a module is extremely beneficial for reliability testing of commercial modules. Detailed methodologies for this innovative test procedure are not widely available in industry because equipment and measurement techniques have not been explored extensively. This paper will provide a literature review describing relevant theories and measurement techniques related to measuring the QE of a cell within a module. The testing methodology and necessary equipment will be described in detail. Results and conclusions provide the overall accuracy of the measurements and discuss the parameters affecting these measurements.
ContributorsKnisely, Brett (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2013
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Description
The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem

The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem to a transistor-level programmable hardware, is proposed. This approach enables fast system level validation and a reduction in post-Silicon bugs, minimizing design risk and cost. The unique features of the approach include 1) transistor-level programmability that emulates each transistor behavior in an analog design, achieving very fine granularity of reconfiguration; 2) programmable switches that are treated as a design component during analog transistor emulating, and optimized with the reconfiguration matrix; 3) compensation of AC performance degradation through boosting the bias current. Based on these principles, a digitally controlled PANDA platform is designed at 45nm node that can map AMS modules across 22nm to 90nm technology nodes. A systematic emulation approach to map any analog transistor to 45nm PANDA cell is proposed, which achieves transistor level matching accuracy of less than 5% for ID and less than 10% for Rout and Gm. Circuit level analog metrics of a voltage-controlled oscillator (VCO) emulated by PANDA, match to those of the original designs in 22nm and 90nm nodes with less than a 5% error. Several other 90nm and 22nm analog blocks are successfully emulated by the 45nm PANDA platform, including a folded-cascode operational amplifier and a sample-and-hold module (S/H). Further capabilities of PANDA are demonstrated by the first full-chip silicon of PANDA which is implemented on 65nm process This system consists of a 24×25 cell array, reconfigurable interconnect and configuration memory. The voltage and current reference circuits, op amps and a VCO with a phase interpolation circuit are emulated by PANDA.
ContributorsSuh, Jounghyuk (Author) / Bakkaloglu, Bertan (Thesis advisor) / Cao, Yu (Committee member) / Ozev, Sule (Committee member) / Kozicki, Michael (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Flow measurement has always been one of the most critical processes in many industrial and clinical applications. The dynamic behavior of flow helps to define the state of a process. An industrial example would be that in an aircraft, where the rate of airflow passing the aircraft is used to

Flow measurement has always been one of the most critical processes in many industrial and clinical applications. The dynamic behavior of flow helps to define the state of a process. An industrial example would be that in an aircraft, where the rate of airflow passing the aircraft is used to determine the speed of the plane. A clinical example would be that the flow of a patient's breath which could help determine the state of the patient's lungs. This project is focused on the flow-meter that are used for airflow measurement in human lungs. In order to do these measurements, resistive-type flow-meters are commonly used in respiratory measurement systems. This method consists of passing the respiratory flow through a fluid resistive component, while measuring the resulting pressure drop, which is linearly related to volumetric flow rate. These types of flow-meters typically have a low frequency response but are adequate for most applications, including spirometry and respiration monitoring. In the case of lung parameter estimation methods, such as the Quick Obstruction Method, it becomes important to have a higher frequency response in the flow-meter so that the high frequency components in the flow are measurable. The following three types of flow-meters were: a. Capillary type b. Screen Pneumotach type c. Square Edge orifice type To measure the frequency response, a sinusoidal flow is generated with a small speaker and passed through the flow-meter that is connected to a large, rigid container. True flow is proportional to the derivative of the pressure inside the container. True flow is then compared with the measured flow, which is proportional to the pressure drop across the flow-meter. In order to do the characterization, two LabVIEW data acquisition programs have been developed, one for transducer calibration, and another one that records flow and pressure data for frequency response testing of the flow-meter. In addition, a model that explains the behavior exhibited by the flow-meter has been proposed and simulated. This model contains a fluid resistor and inductor in series. The final step in this project was to approximate the frequency response data to the developed model expressed as a transfer function.
ContributorsHu, Jianchen (Author) / Macia, Narciso (Thesis advisor) / Pollat, Scott (Committee member) / Rogers, Bradley (Committee member) / Arizona State University (Publisher)
Created2013
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Description
The research objective is fully differential op-amp with common mode feedback, which are applied in filter, band gap, Analog Digital Converter (ADC) and so on as a fundamental component in analog circuit. Having modeled various defect and analyzed corresponding probability, defect library could be built after reduced defect simulation.Based on

The research objective is fully differential op-amp with common mode feedback, which are applied in filter, band gap, Analog Digital Converter (ADC) and so on as a fundamental component in analog circuit. Having modeled various defect and analyzed corresponding probability, defect library could be built after reduced defect simulation.Based on the resolution of microscope scan tool, all these defects are categorized into four groups of defects by both function and location, bias circuit defect, first stage amplifier defect, output stage defect and common mode feedback defect, separately. Each fault result is attributed to one of these four region defects.Therefore, analog testing algorithm and automotive tool could be generated to assist testing engineers to meet the demand of large numbers of chips.
ContributorsLu, Zhijian (Author) / Ozev, Sule (Thesis advisor) / Kiaei, Sayfe (Committee member) / Ogras, Umit Y. (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Mobile platforms are becoming highly heterogeneous by combining a powerful multiprocessor system-on-chip (MpSoC) with numerous resources including display, memory, power management IC (PMIC), battery and wireless modems into a compact package. Furthermore, the MpSoC itself is a heterogeneous resource that integrates many processing elements such as CPU cores, GPU, video,

Mobile platforms are becoming highly heterogeneous by combining a powerful multiprocessor system-on-chip (MpSoC) with numerous resources including display, memory, power management IC (PMIC), battery and wireless modems into a compact package. Furthermore, the MpSoC itself is a heterogeneous resource that integrates many processing elements such as CPU cores, GPU, video, image, and audio processors. As a result, optimization approaches targeting mobile computing needs to consider the platform at various levels of granularity.

Platform energy consumption and responsiveness are two major considerations for mobile systems since they determine the battery life and user satisfaction, respectively. In this work, the models for power consumption, response time, and energy consumption of heterogeneous mobile platforms are presented. Then, these models are used to optimize the energy consumption of baseline platforms under power, response time, and temperature constraints with and without introducing new resources. It is shown, the optimal design choices depend on dynamic power management algorithm, and adding new resources is more energy efficient than scaling existing resources alone. The framework is verified through actual experiments on Qualcomm Snapdragon 800 based tablet MDP/T. Furthermore, usage of the framework at both design and runtime optimization is also presented.
ContributorsGupta, Ujjwala (Author) / Ogras, Umit Y. (Thesis advisor) / Ozev, Sule (Committee member) / Chakrabarti, Chaitali (Committee member) / Arizona State University (Publisher)
Created2014