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The development of a Solid State Transformer (SST) that incorporates a DC-DC multiport converter to integrate both photovoltaic (PV) power generation and battery energy storage is presented in this dissertation. The DC-DC stage is based on a quad-active-bridge (QAB) converter which not only provides isolation for the load, but also

The development of a Solid State Transformer (SST) that incorporates a DC-DC multiport converter to integrate both photovoltaic (PV) power generation and battery energy storage is presented in this dissertation. The DC-DC stage is based on a quad-active-bridge (QAB) converter which not only provides isolation for the load, but also for the PV and storage. The AC-DC stage is implemented with a pulse-width-modulated (PWM) single phase rectifier. A unified gyrator-based average model is developed for a general multi-active-bridge (MAB) converter controlled through phase-shift modulation (PSM). Expressions to determine the power rating of the MAB ports are also derived. The developed gyrator-based average model is applied to the QAB converter for faster simulations of the proposed SST during the control design process as well for deriving the state-space representation of the plant. Both linear quadratic regulator (LQR) and single-input-single-output (SISO) types of controllers are designed for the DC-DC stage. A novel technique that complements the SISO controller by taking into account the cross-coupling characteristics of the QAB converter is also presented herein. Cascaded SISO controllers are designed for the AC-DC stage. The QAB demanded power is calculated at the QAB controls and then fed into the rectifier controls in order to minimize the effect of the interaction between the two SST stages. The dynamic performance of the designed control loops based on the proposed control strategies are verified through extensive simulation of the SST average and switching models. The experimental results presented herein show that the transient responses for each control strategy match those from the simulations results thus validating them.
ContributorsFalcones, Sixifo Daniel (Author) / Ayyanar, Raja (Thesis advisor) / Karady, George G. (Committee member) / Tylavsky, Daniel (Committee member) / Tsakalis, Konstantinos (Committee member) / Arizona State University (Publisher)
Created2011
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Description
The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated

The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated in advanced CMOS technologies requires understanding and analyzing the basic mechanisms that result in buildup of radiation-induced defects in specific sensitive regions. Extensive experimental studies have demonstrated that the sensitive regions are shallow trench isolation (STI) oxides. Nevertheless, very little work has been done to model the physical mechanisms that result in the buildup of radiation-induced defects and the radiation response of devices fabricated in these technologies. A comprehensive study of the physical mechanisms contributing to the buildup of radiation-induced oxide trapped charges and the generation of interface traps in advanced CMOS devices is presented in this dissertation. The basic mechanisms contributing to the buildup of radiation-induced defects are explored using a physical model that utilizes kinetic equations that captures total ionizing dose (TID) and dose rate effects in silicon dioxide (SiO2). These mechanisms are formulated into analytical models that calculate oxide trapped charge density (Not) and interface trap density (Nit) in sensitive regions of deep-submicron devices. Experiments performed on field-oxide-field-effect-transistors (FOXFETs) and metal-oxide-semiconductor (MOS) capacitors permit investigating TID effects and provide a comparison for the radiation response of advanced CMOS devices. When used in conjunction with closed-form expressions for surface potential, the analytical models enable an accurate description of radiation-induced degradation of transistor electrical characteristics. In this dissertation, the incorporation of TID effects in advanced CMOS devices into surface potential based compact models is also presented. The incorporation of TID effects into surface potential based compact models is accomplished through modifications of the corresponding surface potential equations (SPE), allowing the inclusion of radiation-induced defects (i.e., Not and Nit) into the calculations of surface potential. Verification of the compact modeling approach is achieved via comparison with experimental data obtained from FOXFETs fabricated in a 90 nm low-standby power commercial bulk CMOS technology and numerical simulations of fully-depleted (FD) silicon-on-insulator (SOI) n-channel transistors.
ContributorsSanchez Esqueda, Ivan (Author) / Barnaby, Hugh J (Committee member) / Schroder, Dieter (Thesis advisor) / Schroder, Dieter K. (Committee member) / Holbert, Keith E. (Committee member) / Gildenblat, Gennady (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Chalcogenide glass (ChG) materials have gained wide attention because of their applications in conductive bridge random access memory (CBRAM), phase change memories (PC-RAM), optical rewritable disks (CD-RW and DVD-RW), microelectromechanical systems (MEMS), microfluidics, and optical communications. One of the significant properties of ChG materials is the change in the resistivity

Chalcogenide glass (ChG) materials have gained wide attention because of their applications in conductive bridge random access memory (CBRAM), phase change memories (PC-RAM), optical rewritable disks (CD-RW and DVD-RW), microelectromechanical systems (MEMS), microfluidics, and optical communications. One of the significant properties of ChG materials is the change in the resistivity of the material when a metal such as Ag or Cu is added to it by diffusion. This study demonstrates the potential radiation-sensing capabilities of two metal/chalcogenide glass device configurations. Lateral and vertical device configurations sense the radiation-induced migration of Ag+ ions in germanium selenide glasses via changes in electrical resistance between electrodes on the ChG. Before irradiation, these devices exhibit a high-resistance `OFF-state' (in the order of 10E12) but following irradiation, with either 60-Co gamma-rays or UV light, their resistance drops to a low-resistance `ON-state' (around 10E3). Lateral devices have exhibited cyclical recovery with room temperature annealing of the Ag doped ChG, which suggests potential uses in reusable radiation sensor applications. The feasibility of producing inexpensive flexible radiation sensors has been demonstrated by studying the effects of mechanical strain and temperature stress on sensors formed on flexible polymer substrate. The mechanisms of radiation-induced Ag/Ag+ transport and reactions in ChG have been modeled using a finite element device simulator, ATLAS. The essential reactions captured by the simulator are radiation-induced carrier generation, combined with reduction/oxidation for Ag species in the chalcogenide film. Metal-doped ChGs are solid electrolytes that have both ionic and electronic conductivity. The ChG based Programmable Metallization Cell (PMC) is a technology platform that offers electric field dependent resistance switching mechanisms by formation and dissolution of nano sized conductive filaments in a ChG solid electrolyte between oxidizable and inert electrodes. This study identifies silver anode agglomeration in PMC devices following large radiation dose exposure and considers device failure mechanisms via electrical and material characterization. The results demonstrate that by changing device structural parameters, silver agglomeration in PMC devices can be suppressed and reliable resistance switching may be maintained for extremely high doses ranging from 4 Mrad(GeSe) to more than 10 Mrad (ChG).
ContributorsDandamudi, Pradeep (Author) / Kozicki, Michael N (Thesis advisor) / Barnaby, Hugh J (Committee member) / Holbert, Keith E. (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2013
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Description
This dissertation presents a new hybrid fault current limiter (FCL) topology that is primarily intended to protect single-phase power equipment. It can however be extended to protect three phase systems but would need three devices to protect each individual phase. In comparison against the existing fault current limiter technology, the

This dissertation presents a new hybrid fault current limiter (FCL) topology that is primarily intended to protect single-phase power equipment. It can however be extended to protect three phase systems but would need three devices to protect each individual phase. In comparison against the existing fault current limiter technology, the salient fea-tures of the proposed topology are: a) provides variable impedance that provides a 50% reduction in prospective fault current; b) near instantaneous response time which is with-in the first half cycle (1-4 ms); c) the use of semiconductor switches as the commutating switch which produces reduced leakage current, reduced losses, improved reliability, and a faster switch time (ns-µs); d) zero losses in steady-state operation; e) use of a Neodym-ium (NdFeB) permanent magnet as the limiting impedance which reduces size, cost, weight, eliminates DC biasing and cooling costs; f) use of Pulse Width Modulation (PWM) to control the magnitude of the fault current to a user's desired level. g) experi-mental test system is developed and tested to prove the concepts of the proposed FCL. This dissertation presents the proposed topology and its working principle backed up with numerical verifications, simulation results, and hardware implementation results. Conclu-sions and future work are also presented.
ContributorsPrigmore, Jay (Author) / Karady, George G. (Thesis advisor) / Ayyanar, Raja (Committee member) / Holbert, Keith E. (Committee member) / Hedman, Kory (Committee member) / Arizona State University (Publisher)
Created2013
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Description
This dissertation presents a novel current source converter topology that is primarily intended for single-phase photovoltaic (PV) applications. In comparison with the existing PV inverter technology, the salient features of the proposed topology are: a) the low frequency (double of line frequency) ripple that is common to single-phase inverters is

This dissertation presents a novel current source converter topology that is primarily intended for single-phase photovoltaic (PV) applications. In comparison with the existing PV inverter technology, the salient features of the proposed topology are: a) the low frequency (double of line frequency) ripple that is common to single-phase inverters is greatly reduced; b) the absence of low frequency ripple enables significantly reduced size pass components to achieve necessary DC-link stiffness and c) improved maximum power point tracking (MPPT) performance is readily achieved due to the tightened current ripple even with reduced-size passive components. The proposed topology does not utilize any electrolytic capacitors. Instead an inductor is used as the DC-link filter and reliable AC film capacitors are utilized for the filter and auxiliary capacitor. The proposed topology has a life expectancy on par with PV panels. The proposed modulation technique can be used for any current source inverter where an unbalanced three-phase operation is desires such as active filters and power controllers. The proposed topology is ready for the next phase of microgrid and power system controllers in that it accepts reactive power commands. This work presents the proposed topology and its working principle supported by with numerical verifications and hardware results. Conclusions and future work are also presented.
ContributorsBush, Craig R (Author) / Ayyanar, Raja (Thesis advisor) / Karam, Lina (Committee member) / Heydt, Gerald (Committee member) / Karady, George G. (Committee member) / Arizona State University (Publisher)
Created2013
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Description
The combined heat and power (CHP)-based distributed generation (DG) or dis-tributed energy resources (DERs) are mature options available in the present energy mar-ket, considered to be an effective solution to promote energy efficiency. In the urban en-vironment, the electricity, water and natural gas distribution networks are becoming in-creasingly interconnected with

The combined heat and power (CHP)-based distributed generation (DG) or dis-tributed energy resources (DERs) are mature options available in the present energy mar-ket, considered to be an effective solution to promote energy efficiency. In the urban en-vironment, the electricity, water and natural gas distribution networks are becoming in-creasingly interconnected with the growing penetration of the CHP-based DG. Subse-quently, this emerging interdependence leads to new topics meriting serious consideration: how much of the CHP-based DG can be accommodated and where to locate these DERs, and given preexisting constraints, how to quantify the mutual impacts on operation performances between these urban energy distribution networks and the CHP-based DG. The early research work was conducted to investigate the feasibility and design methods for one residential microgrid system based on existing electricity, water and gas infrastructures of a residential community, mainly focusing on the economic planning. However, this proposed design method cannot determine the optimal DG sizing and sit-ing for a larger test bed with the given information of energy infrastructures. In this con-text, a more systematic as well as generalized approach should be developed to solve these problems. In the later study, the model architecture that integrates urban electricity, water and gas distribution networks, and the CHP-based DG system was developed. The pro-posed approach addressed the challenge of identifying the optimal sizing and siting of the CHP-based DG on these urban energy networks and the mutual impacts on operation per-formances were also quantified. For this study, the overall objective is to maximize the electrical output and recovered thermal output of the CHP-based DG units. The electrici-ty, gas, and water system models were developed individually and coupled by the devel-oped CHP-based DG system model. The resultant integrated system model is used to constrain the DG's electrical output and recovered thermal output, which are affected by multiple factors and thus analyzed in different case studies. The results indicate that the designed typical gas system is capable of supplying sufficient natural gas for the DG normal operation, while the present water system cannot support the complete recovery of the exhaust heat from the DG units.
ContributorsZhang, Xianjun (Author) / Karady, George G. (Thesis advisor) / Ariaratnam, Samuel T. (Committee member) / Holbert, Keith E. (Committee member) / Si, Jennie (Committee member) / Arizona State University (Publisher)
Created2013
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Description
A fully automated logic design methodology for radiation hardened by design (RHBD) high speed logic using fine grained triple modular redundancy (TMR) is presented. The hardening techniques used in the cell library are described and evaluated, with a focus on both layout techniques that mitigate total ionizing dose (TID) and

A fully automated logic design methodology for radiation hardened by design (RHBD) high speed logic using fine grained triple modular redundancy (TMR) is presented. The hardening techniques used in the cell library are described and evaluated, with a focus on both layout techniques that mitigate total ionizing dose (TID) and latchup issues and flip-flop designs that mitigate single event transient (SET) and single event upset (SEU) issues. The base TMR self-correcting master-slave flip-flop is described and compared to more traditional hardening techniques. Additional refinements are presented, including testability features that disable the self-correction to allow detection of manufacturing defects. The circuit approach is validated for hardness using both heavy ion and proton broad beam testing. For synthesis and auto place and route, the methodology and circuits leverage commercial logic design automation tools. These tools are glued together with custom CAD tools designed to enable easy conversion of standard single redundant hardware description language (HDL) files into hardened TMR circuitry. The flow allows hardening of any synthesizable logic at clock frequencies comparable to unhardened designs and supports standard low-power techniques, e.g. clock gating and supply voltage scaling.
ContributorsHindman, Nathan (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Barnaby, Hugh (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Polymeric materials containing nanometer (nm) size particles are being introduced to provide compact shapes for low and medium voltage insulation equipment. The nanocomposites may provide superior electrical performance when compared with those available currently, such as lower dielectric losses and increased dielectric strength, tracking and erosion resistance, and surface hydrophobicity.

Polymeric materials containing nanometer (nm) size particles are being introduced to provide compact shapes for low and medium voltage insulation equipment. The nanocomposites may provide superior electrical performance when compared with those available currently, such as lower dielectric losses and increased dielectric strength, tracking and erosion resistance, and surface hydrophobicity. All of the above mentioned benefits can be achieved at a lower filler concentration (< 10%) than conventional microfillers (40-60%). Also, the uniform shapes of nanofillers provide a better electrical stress distribution as compared to irregular shaped microcomposites which can have high internal electric stress, which could be a problem for devices with active electrical parts. Improvement in electrical performance due to addition of nanofillers in an epoxy matrix has been evaluated in this work. Scanning Electron Microscopy (SEM) was done on the epoxy samples to confirm uniform dispersion of nano-sized fillers as good filler dispersion is essential to realize the above stated benefits. Dielectric spectroscopy experiments were conducted over a wide range of frequencies as a function of temperature to understand the role of space charge and interfaces in these materials. The experiment results demonstrate significant reduction in dielectric losses in samples containing nanofillers. High voltage experiments such as corona resistance tests were conducted over 500 hours to monitor degradation in the samples due to corona. These tests revealed improvements in partial discharge endurance of nanocomposite samples. These improvements could not be adequately explained using a macroscopic quantity such as thermal conductivity. Thermo gravimetric analysis (TGA) showed higher weight loss initiation temperatures for nanofilled samples which is in agreement with the corona resistance experimental results. Theoretical models have also been developed in this work to complement the results of the corona resistance experiment and the TGA analysis. Degradation model was developed to map the erosion path using Dijkstra's shortest path algorithm. A thermal model was developed to calculate the localized temperature distribution in the micro and nano-filled samples using the PDE toolbox in MATLAB. Both the models highlight the fact that improvement in nanocomposites is not limited to the filler concentrations that were tested experimentally.
ContributorsIyer, Ganpathy (Author) / Gorur, Ravi S (Thesis advisor) / Vittal, Vijay (Committee member) / Richert, Ranko (Committee member) / Karady, George G. (Committee member) / Arizona State University (Publisher)
Created2012
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Description
The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved

The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.
ContributorsMaurya, Satendra Kumar (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Vrudhula, Sarma (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2012
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Description
The field of flexible displays and electronics gained a big momentum within the recent years due to their ruggedness, thinness, and flexibility as well as low cost large area manufacturability. Amorphous silicon has been the dominant material used in the thin film transistor industry which could only utilize it as

The field of flexible displays and electronics gained a big momentum within the recent years due to their ruggedness, thinness, and flexibility as well as low cost large area manufacturability. Amorphous silicon has been the dominant material used in the thin film transistor industry which could only utilize it as N type thin film transistors (TFT). Amorphous silicon is an unstable material for low temperature manufacturing process and having only one kind of transistor means high power consumption for circuit operations. This thesis covers the three major researches done on flexible TFTs and flexible electronic circuits. First the characterization of both amorphous silicon TFTs and newly emerging mixed oxide TFTs were performed and the stability of these two materials is compared. During the research, both TFTs were stress tested under various biasing conditions and the threshold voltage was extracted to observe the shift in the threshold which shows the degradation of the material. Secondly, the design of the first flexible CMOS TFTs and CMOS gates were covered. The circuits were built using both inorganic and organic components (for nMOS and pMOS transistors respectively) and functionality tests were performed on basic gates like inverter, NAND and NOR gates and the working results are documented. Thirdly, a novel large area sensor structure is demonstrated under the Electronic Textile project section. This project is based on the concept that all the flexible electronics are flexible in only one direction and can not be used for conforming irregular shaped objects or create an electronic cloth for various applications like display or sensing. A laser detector sensor array is designed for proof of concept and is laid in strips that can be cut after manufacturing and weaved to each other to create a real flexible electronic textile. The circuit designed uses a unique architecture that pushes the data in a single line and reads the data from the same line and compares the signal to the original state to determine a sensor excitation. This architecture enables 2 dimensional addressing through an external controller while eliminating the need for 2 dimensional active matrix style electrical connections between the fibers.
ContributorsKaftanoglu, Korhan (Author) / Allee, David R. (Thesis advisor) / Kozicki, Michael N (Committee member) / Holbert, Keith E. (Committee member) / Kaminski, Jann P (Committee member) / Arizona State University (Publisher)
Created2012