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Description
To uncover the neural correlates to go-directed behavior, single unit action potentials are considered fundamental computing units and have been examined by different analytical methodologies under a broad set of hypotheses. Using a behaving rat performing a directional choice learning task, we aim to study changes in rat's cortical neural

To uncover the neural correlates to go-directed behavior, single unit action potentials are considered fundamental computing units and have been examined by different analytical methodologies under a broad set of hypotheses. Using a behaving rat performing a directional choice learning task, we aim to study changes in rat's cortical neural patterns while he improved his task performance accuracy from chance to 80% or higher. Specifically, simultaneous multi-channel single unit neural recordings from the rat's agranular medial (AGm) and Agranular lateral (AGl) cortices were analyzed using joint peristimulus time histogram (JPSTHs), which effectively unveils firing coincidences in neural action potentials. My results based on data from six rats revealed that coincidences of pair-wise neural action potentials are higher when rats were performing the task than they were not at the learning stage, and this trend abated after the rats learned the task. Another finding is that the coincidences at the learning stage are stronger than that when the rats learned the task especially when they were performing the task. Therefore, this coincidence measure is the highest when the rats were performing the task at the learning stage. This may suggest that neural coincidences play a role in the coordination and communication among populations of neurons engaged in a purposeful act. Additionally, attention and working memory may have contributed to the modulation of neural coincidences during the designed task.
ContributorsCheng, Bing (Author) / Si, Jennie (Thesis advisor) / Chae, Junseok (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface

Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface area in a light weight rugged form. Such a neutron detector could be suitable for deployment at ports of entry. The specific approach used in this research, uses a neutron converter layer which captures incident thermal neutrons, and then emits ionizing charged particles. These ionizing particles cause electron-hole pair generation within a single pixel's integrated sensing diode. The resulting charge is then amplified via a low-noise amplifier. This document begins by discussing the current state of the art in neutron detection and the associated challenges. Then, for the purpose of resolving some of these issues, recent design and modeling efforts towards developing an improved neutron detection system are described. Also presented is a low-noise active pixel sensor (APS) design capable of being implemented in low temperature indium gallium zinc oxide (InGaZnO) or amorphous silicon (a-Si:H) thin film transistor process compatible with plastic substrates. The low gain and limited scalability of this design are improved upon by implementing a new multi-stage self-resetting APS. For each APS design, successful radiation measurements are also presented using PiN diodes for charged particle detection. Next, detection array readout methodologies are modeled and analyzed, and use of a matched filter readout circuit is described as well. Finally, this document discusses detection diode integration with the designed TFT-based APSs.
ContributorsKunnen, George (Author) / Allee, David (Thesis advisor) / Garrity, Douglas (Committee member) / Gnade, Bruce (Committee member) / Holbert, Keith E. (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Photovoltaic (PV) systems are affected by converter losses, partial shading and other mismatches in the panels. This dissertation introduces a sub-panel maximum power point tracking (MPPT) architecture together with an integrated CMOS current sensor circuit on a chip to reduce the mismatch effects, losses and increase the efficiency of the

Photovoltaic (PV) systems are affected by converter losses, partial shading and other mismatches in the panels. This dissertation introduces a sub-panel maximum power point tracking (MPPT) architecture together with an integrated CMOS current sensor circuit on a chip to reduce the mismatch effects, losses and increase the efficiency of the PV system. The sub-panel MPPT increases the efficiency of the PV during the shading and replaces the bypass diodes in the panels with an integrated MPPT and DC-DC regulator. For the integrated MPPT and regulator, the research developed an integrated standard CMOS low power and high common mode range Current-to-Digital Converter (IDC) circuit and its application for DC-DC regulator and MPPT. The proposed charge based CMOS switched-capacitor circuit directly digitizes the output current of the DC-DC regulator without an analog-to-digital converter (ADC) and the need for high-voltage process technology. Compared to the resistor based current-sensing methods that requires current-to-voltage circuit, gain block and ADC, the proposed CMOS IDC is a low-power efficient integrated circuit that achieves high resolution, lower complexity, and lower power consumption. The IDC circuit is fabricated on a 0.7 um CMOS process, occupies 2mm x 2mm and consumes less than 27mW. The IDC circuit has been tested and used for boost DC-DC regulator and MPPT for photo-voltaic system. The DC-DC converter has an efficiency of 95%. The sub-module level power optimization improves the output power of a shaded panel by up to 20%, compared to panel MPPT with bypass diodes.
ContributorsMarti-Arbona, Edgar (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kitchen, Jennifer (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Modern day deep sub-micron SOC architectures often demand very low supply noise levels. As supply voltage decreases with decreasing deep sub-micron gate length, noise on the power supply starts playing a dominant role in noise-sensitive analog blocks, especially high precision ADC, PLL, and RF SOC's. Most handheld and portable applications

Modern day deep sub-micron SOC architectures often demand very low supply noise levels. As supply voltage decreases with decreasing deep sub-micron gate length, noise on the power supply starts playing a dominant role in noise-sensitive analog blocks, especially high precision ADC, PLL, and RF SOC's. Most handheld and portable applications and highly sensitive medical instrumentation circuits tend to use low noise regulators as on-chip or on board power supply. Nonlinearities associated with LNA's, mixers and oscillators up-convert low frequency noise with the signal band. Specifically, synthesizer and TCXO phase noise, LNA and mixer noise figure, and adjacent channel power ratios of the PA are heavily influenced by the supply noise and ripple. This poses a stringent requirement on a very low noise power supply with high accuracy and fast transient response. Low Dropout (LDO) regulators are preferred over switching regulators for these applications due to their attractive low noise and low ripple features. LDO's shield sensitive blocks from high frequency fluctuations on the power supply while providing high accuracy, fast response supply regulation.

This research focuses on developing innovative techniques to reduce the noise of any generic wideband LDO, stable with or without load capacitor. The proposed techniques include Switched RC Filtering to reduce the Bandgap Reference noise, Current Mode Chopping to reduce the Error Amplifier noise & MOS-R based RC filter to reduce the noise due to bias current. The residual chopping ripple was reduced using a Switched Capacitor notch filter. Using these techniques, the integrated noise of a wideband LDO was brought down to 15µV in the integration band of 10Hz to 100kHz. These techniques can be integrated into any generic LDO without any significant area overhead.
ContributorsMagod Ramakrishna, Raveesh (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
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Description
This work describes the development of automated flows to generate pad rings, mixed signal power grids, and mega cells in a multi-project test chip. There were three major design flows that were created to create the test chip. The first was the pad ring which was used as the staring

This work describes the development of automated flows to generate pad rings, mixed signal power grids, and mega cells in a multi-project test chip. There were three major design flows that were created to create the test chip. The first was the pad ring which was used as the staring block for creating the test chip. This flow put all of the signals for the chip in the order that was wanted along the outside of the die along with creation of the power ring that is used to supply the chip with a robust power source.

The second flow that was created was used to put together a flash block that is based off of a XILIX XCFXXP. This flow was somewhat similar to how the pad ring flow worked except that optimizations and a clock tree was added into the flow. There was a couple of design redoes due to timing and orientation constraints.

Finally, the last flow that was created was the top level flow which is where all of the components are combined together to create a finished test chip ready for fabrication. The main components that were used were the finished flash block, HERMES, test structures, and a clock instance along with the pad ring flow for the creation of the pad ring and power ring.

Also discussed is some work that was done on a previous multi-project test chip. The work that was done was the creation of power gaters that were used like switches to turn the power on and off for some flash modules. To control the power gaters the functionality change of some pad drivers was done so that they output a higher voltage than what is seen in the core of the chip.
ContributorsLieb, Christopher (Author) / Clark, Lawrence (Thesis advisor) / Holbert, Keith E. (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2015
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Description
Several state of the art, monitoring and control systems, such as DC motor

controllers, power line monitoring and protection systems, instrumentation systems and battery monitors require direct digitization of a high voltage input signals. Analog-to-Digital Converters (ADCs) that can digitize high voltage signals require high linearity and low voltage coefficient capacitors.

Several state of the art, monitoring and control systems, such as DC motor

controllers, power line monitoring and protection systems, instrumentation systems and battery monitors require direct digitization of a high voltage input signals. Analog-to-Digital Converters (ADCs) that can digitize high voltage signals require high linearity and low voltage coefficient capacitors. A built in self-calibration and digital-trim algorithm correcting static mismatches in Capacitive Digital-to-Analog Converter (CDAC) used in Successive Approximation Register Analog to Digital Converters (SARADCs) is proposed. The algorithm uses a dynamic error correction (DEC) capacitor to cancel the static errors occurring in each capacitor of the array as the first step upon power-up and eliminates the need for an extra calibration DAC. Self-trimming is performed digitally during normal ADC operation. The algorithm is implemented on a 14-bit high-voltage input range SAR ADC with integrated dynamic error correction capacitors. The IC is fabricated in 0.6-um high voltage compliant CMOS process, accepting up to 24Vpp differential input signal. The proposed approach achieves 73.32 dB Signal to Noise and Distortion Ratio (SNDR) which is an improvement of 12.03 dB after self-calibration at 400 kS/s sampling rate, consuming 90-mW from a +/-15V supply. The calibration circuitry occupies 28% of the capacitor DAC, and consumes less than 15mW during operation. Measurement results shows that this algorithm reduces INL from as high as 7 LSBs down to 1 LSB and it works even in the presence of larger mismatches exceeding 260 LSBs. Similarly, it reduces DNL errors from 10 LSBs down to 1 LSB. The ADC occupies an active area of 9.76 mm2.
ContributorsThirunakkarasu, Shankar (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Kozicki, Michael (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Switching Converters (SC) are an excellent choice for hand held devices due to their high power conversion efficiency. However, they suffer from two major drawbacks. The first drawback is that their dynamic response is sensitive to variations in inductor (L) and capacitor (C) values. A cost effective solution is implemented

Switching Converters (SC) are an excellent choice for hand held devices due to their high power conversion efficiency. However, they suffer from two major drawbacks. The first drawback is that their dynamic response is sensitive to variations in inductor (L) and capacitor (C) values. A cost effective solution is implemented by designing a programmable digital controller. Despite variations in L and C values, the target dynamic response can be achieved by computing and programming the filter coefficients for a particular L and C. Besides, digital controllers have higher immunity to environmental changes such as temperature and aging of components. The second drawback of SCs is their poor efficiency during low load conditions if operated in Pulse Width Modulation (PWM) mode. However, if operated in Pulse Frequency Modulation (PFM) mode, better efficiency numbers can be achieved. A mostly-digital way of detecting PFM mode is implemented. Besides, a slow serial interface to program the chip, and a high speed serial interface to characterize mixed signal blocks as well as to ship data in or out for debug purposes are designed. The chip is taped out in 0.18µm IBM's radiation hardened CMOS process technology. A test board is built with the chip, external power FETs and driver IC. At the time of this writing, PWM operation, PFM detection, transitions between PWM and PFM, and both serial interfaces are validated on the test board.
ContributorsMumma Reddy, Abhiram (Author) / Bakkaloglu, Bertan (Thesis advisor) / Ogras, Umit Y. (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Register file (RF) memory is important in low power system on chip (SOC) due to its

inherent low voltage stability. Moreover, designs increasingly use compiled instead of custom memory blocks, which frequently employ static, rather than pre-charged dynamic RFs. In this work, the various RFs designed for a microprocessor cache and

Register file (RF) memory is important in low power system on chip (SOC) due to its

inherent low voltage stability. Moreover, designs increasingly use compiled instead of custom memory blocks, which frequently employ static, rather than pre-charged dynamic RFs. In this work, the various RFs designed for a microprocessor cache and register files are discussed. Comparison between static and dynamic RF power dissipation and timing characteristics is also presented. The relative timing and power advantages of the designs are shown to be dependent on the memory aspect ratio, i.e. array width and height.
ContributorsVashishtha, Vinay (Author) / Clark, Lawrence T. (Thesis advisor) / Seo, Jae-Sun (Committee member) / Ogras, Umit Y. (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Class D Amplifiers are widely used in portable systems such as mobile phones to achieve high efficiency. The demands of portable electronics for low power consumption to extend battery life and reduce heat dissipation mandate efficient, high-performance audio amplifiers. The high efficiency of Class D amplifiers (CDAs) makes them particularly

Class D Amplifiers are widely used in portable systems such as mobile phones to achieve high efficiency. The demands of portable electronics for low power consumption to extend battery life and reduce heat dissipation mandate efficient, high-performance audio amplifiers. The high efficiency of Class D amplifiers (CDAs) makes them particularly attractive for portable applications. The Digital class D amplifier is an interesting solution to increase the efficiency of embedded systems. However, this solution is not good enough in terms of PWM stage linearity and power supply rejection. An efficient control is needed to correct the error sources in order to get a high fidelity sound quality in the whole audio range of frequencies. A fundamental analysis on various error sources due to non idealities in the power stage have been discussed here with key focus on Power supply perturbations driving the Power stage of a Class D Audio Amplifier. Two types of closed loop Digital Class D architecture for PSRR improvement have been proposed and modeled. Double sided uniform sampling modulation has been used. One of the architecture uses feedback around the power stage and the second architecture uses feedback into digital domain. Simulation & experimental results confirm that the closed loop PSRR & PS-IMD improve by around 30-40 dB and 25 dB respectively.
ContributorsChakraborty, Bijeta (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Ozev, Sule (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Semiconductor device scaling has kept up with Moore's law for the past decades and they have been scaling by a factor of half every one and half years. Every new generation of device technology opens up new opportunities and challenges and especially so for analog design. High speed and low

Semiconductor device scaling has kept up with Moore's law for the past decades and they have been scaling by a factor of half every one and half years. Every new generation of device technology opens up new opportunities and challenges and especially so for analog design. High speed and low gain is characteristic of these processes and hence a tradeoff that can enable to get back gain by trading speed is crucial. This thesis proposes a solution that increases the speed of sampling of a circuit by a factor of three while reducing the specifications on analog blocks and keeping the power nearly constant. The techniques are based on the switched capacitor technique called Correlated Level Shifting. A triple channel Cyclic ADC has been implemented, with each channel working at a sampling frequency of 3.33MS/s and a resolution of 14 bits. The specifications are compared with that based on a traditional architecture to show the superiority of the proposed technique.
ContributorsSivakumar, Balasubramanian (Author) / Farahani, Bahar Jalali (Thesis advisor) / Garrity, Douglas (Committee member) / Bakkaloglu, Bertan (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2012