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With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is

With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
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Description

Lossy compression is a form of compression that slightly degrades a signal in ways that are ideally not detectable to the human ear. This is opposite to lossless compression, in which the sample is not degraded at all. While lossless compression may seem like the best option, lossy compression, which

Lossy compression is a form of compression that slightly degrades a signal in ways that are ideally not detectable to the human ear. This is opposite to lossless compression, in which the sample is not degraded at all. While lossless compression may seem like the best option, lossy compression, which is used in most audio and video, reduces transmission time and results in much smaller file sizes. However, this compression can affect quality if it goes too far. The more compression there is on a waveform, the more degradation there is, and once a file is lossy compressed, this process is not reversible. This project will observe the degradation of an audio signal after the application of Singular Value Decomposition compression, a lossy compression that eliminates singular values from a signal’s matrix.

ContributorsHirte, Amanda (Author) / Kosut, Oliver (Thesis director) / Bliss, Daniel (Committee member) / Electrical Engineering Program (Contributor, Contributor) / Barrett, The Honors College (Contributor)
Created2021-05
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Description
Programmable Metallization Cell (PMC) is a technology platform which utilizes mass transport in solid or liquid electrolyte coupled with electrochemical (redox) reactions to form or remove nanoscale metallic electrodeposits on or in the electrolyte. The ability to redistribute metal mass and form metallic nanostructure in or on a structure in

Programmable Metallization Cell (PMC) is a technology platform which utilizes mass transport in solid or liquid electrolyte coupled with electrochemical (redox) reactions to form or remove nanoscale metallic electrodeposits on or in the electrolyte. The ability to redistribute metal mass and form metallic nanostructure in or on a structure in situ, via the application of a bias on laterally placed electrodes, creates a large number of promising applications. A novel PMC-based lateral microwave switch was fabricated and characterized for use in microwave systems. It has demonstrated low insertion loss, high isolation, low voltage operation, low power and low energy consumption, and excellent linearity. Due to its non-volatile nature the switch operates with fewer biases and its simple planar geometry makes possible innovative device structures which can be potentially integrated into microwave power distribution circuits. PMC technology is also used to develop lateral dendritic metal electrodes. A lateral metallic dendritic network can be grown in a solid electrolyte (GeSe) or electrodeposited on SiO2 or Si using a water-mediated method. These dendritic electrodes grown in a solid electrolyte (GeSe) can be used to lower resistances for applications like self-healing interconnects despite its relatively low light transparency; while the dendritic electrodes grown using water-mediated method can be potentially integrated into solar cell applications, like replacing conventional Ag screen-printed top electrodes as they not only reduce resistances but also are highly transparent. This research effort also laid a solid foundation for developing dendritic plasmonic structures. A PMC-based lateral dendritic plasmonic structure is a device that has metallic dendritic networks grown electrochemically on SiO2 with a thin layer of surface metal nanoparticles in liquid electrolyte. These structures increase the distribution of particle sizes by connecting pre-deposited Ag nanoparticles into fractal structures and result in three significant effects, resonance red-shift, resonance broadening and resonance enhancement, on surface plasmon resonance for light trapping simultaneously, which can potentially enhance thin film solar cells' performance at longer wavelengths.
ContributorsRen, Minghan (Author) / Kozicki, Michael (Thesis advisor) / Schroder, Dieter (Committee member) / Roedel, Ronald (Committee member) / Barnaby, Hugh (Committee member) / Arizona State University (Publisher)
Created2011
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Description
In this thesis I introduce a new direction to computing using nonlinear chaotic dynamics. The main idea is rich dynamics of a chaotic system enables us to (1) build better computers that have a flexible instruction set, and (2) carry out computation that conventional computers are not good at it.

In this thesis I introduce a new direction to computing using nonlinear chaotic dynamics. The main idea is rich dynamics of a chaotic system enables us to (1) build better computers that have a flexible instruction set, and (2) carry out computation that conventional computers are not good at it. Here I start from the theory, explaining how one can build a computing logic block using a chaotic system, and then I introduce a new theoretical analysis for chaos computing. Specifically, I demonstrate how unstable periodic orbits and a model based on them explains and predicts how and how well a chaotic system can do computation. Furthermore, since unstable periodic orbits and their stability measures in terms of eigenvalues are extractable from experimental times series, I develop a time series technique for modeling and predicting chaos computing from a given time series of a chaotic system. After building a theoretical framework for chaos computing I proceed to architecture of these chaos-computing blocks to build a sophisticated computing system out of them. I describe how one can arrange and organize these chaos-based blocks to build a computer. I propose a brand new computer architecture using chaos computing, which shifts the limits of conventional computers by introducing flexible instruction set. Our new chaos based computer has a flexible instruction set, meaning that the user can load its desired instruction set to the computer to reconfigure the computer to be an implementation for the desired instruction set. Apart from direct application of chaos theory in generic computation, the application of chaos theory to speech processing is explained and a novel application for chaos theory in speech coding and synthesizing is introduced. More specifically it is demonstrated how a chaotic system can model the natural turbulent flow of the air in the human speech production system and how chaotic orbits can be used to excite a vocal tract model. Also as another approach to build computing system based on nonlinear system, the idea of Logical Stochastic Resonance is studied and adapted to an autoregulatory gene network in the bacteriophage λ.
ContributorsKia, Behnam (Author) / Ditto, William (Thesis advisor) / Huang, Liang (Committee member) / Lai, Ying-Cheng (Committee member) / Helms Tillery, Stephen (Committee member) / Arizona State University (Publisher)
Created2011
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Description
This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were

This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were made of Ti/Pt strips with the thickness 0.12 µm and 0.02 µm. The resistance of the sensing element was measured at approximately 1.6-1.7 kohms;. A linear relation between the resistance and temperature was established over the temperature ranging from 22 degree Celsius to 80 degree Celsius and the temperature coefficient of resistance (TCR) was at approximately 0.12 %/degree Celsius. The first thermal flow sensor was one-dimensional (1-D) flexible shear stress sensor. The structure was sensing element sandwiched by a biocompatible polymer "poly-para-xylylene", also known as Parylene, which provided both insulation of electrodes and flexibility of the sensors. A constant-temperature (CT) circuit was designed as the read out circuit based on 0.6 µm CMOS (Complementary metal-oxide-semiconductor) process. The 1-D shear stress sensor suffered from a large measurement error. Because when the sensor was inserted into blood vessels, it was impossible to mount the sensor to the wall as calibrated in micro fluidic channels. According to the previous simulation work, the shear stress was varying and the sensor itself changed the shear stress distribution. We proposed a three-dimensional (3-D) thermal flow sensor, with three-axis of sensing elements integrated in one sensor. It was in the similar shape as a hexagonal prism with diagonal of 1000 µm. On the top of the sensor, there were five bond pads for external wires over 500 µm thick silicon substrate. In each nonadjacent side surface, there was a bended parylene branch with one sensing element. Based on the unique 3-D structure, the sensor was able to obtain data along three axes. With computational fluid dynamics (CFD) model, it is possible to locate the sensor in the blood vessels and give us a better understanding of shear stress distribution in the presence of time-varying component of blood flow and realize more accurate assessment of intravascular convective heat transfer.
ContributorsTang, Rui (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Pan, George (Committee member) / Arizona State University (Publisher)
Created2011
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Description
The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem

The design and development of analog/mixed-signal (AMS) integrated circuits (ICs) is becoming increasingly expensive, complex, and lengthy. Rapid prototyping and emulation of analog ICs will be significant in the design and testing of complex analog systems. A new approach, Programmable ANalog Device Array (PANDA) that maps any AMS design problem to a transistor-level programmable hardware, is proposed. This approach enables fast system level validation and a reduction in post-Silicon bugs, minimizing design risk and cost. The unique features of the approach include 1) transistor-level programmability that emulates each transistor behavior in an analog design, achieving very fine granularity of reconfiguration; 2) programmable switches that are treated as a design component during analog transistor emulating, and optimized with the reconfiguration matrix; 3) compensation of AC performance degradation through boosting the bias current. Based on these principles, a digitally controlled PANDA platform is designed at 45nm node that can map AMS modules across 22nm to 90nm technology nodes. A systematic emulation approach to map any analog transistor to 45nm PANDA cell is proposed, which achieves transistor level matching accuracy of less than 5% for ID and less than 10% for Rout and Gm. Circuit level analog metrics of a voltage-controlled oscillator (VCO) emulated by PANDA, match to those of the original designs in 22nm and 90nm nodes with less than a 5% error. Several other 90nm and 22nm analog blocks are successfully emulated by the 45nm PANDA platform, including a folded-cascode operational amplifier and a sample-and-hold module (S/H). Further capabilities of PANDA are demonstrated by the first full-chip silicon of PANDA which is implemented on 65nm process This system consists of a 24×25 cell array, reconfigurable interconnect and configuration memory. The voltage and current reference circuits, op amps and a VCO with a phase interpolation circuit are emulated by PANDA.
ContributorsSuh, Jounghyuk (Author) / Bakkaloglu, Bertan (Thesis advisor) / Cao, Yu (Committee member) / Ozev, Sule (Committee member) / Kozicki, Michael (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Structural health management (SHM) is emerging as a vital methodology to help engineers improve the safety and maintainability of critical structures. SHM systems are designed to reliably monitor and test the health and performance of structures in aerospace, civil, and mechanical engineering applications. SHM combines multidisciplinary technologies including sensing, signal

Structural health management (SHM) is emerging as a vital methodology to help engineers improve the safety and maintainability of critical structures. SHM systems are designed to reliably monitor and test the health and performance of structures in aerospace, civil, and mechanical engineering applications. SHM combines multidisciplinary technologies including sensing, signal processing, pattern recognition, data mining, high fidelity probabilistic progressive damage models, physics based damage models, and regression analysis. Due to the wide application of carbon fiber reinforced composites and their multiscale failure mechanisms, it is necessary to emphasize the research of SHM on composite structures. This research develops a comprehensive framework for the damage detection, localization, quantification, and prediction of the remaining useful life of complex composite structures. To interrogate a composite structure, guided wave propagation is applied to thin structures such as beams and plates. Piezoelectric transducers are selected because of their versatility, which allows them to be used as sensors and actuators. Feature extraction from guided wave signals is critical to demonstrate the presence of damage and estimate the damage locations. Advanced signal processing techniques are employed to extract robust features and information. To provide a better estimate of the damage for accurate life estimation, probabilistic regression analysis is used to obtain a prediction model for the prognosis of complex structures subject to fatigue loading. Special efforts have been applied to the extension of SHM techniques on aerospace and spacecraft structures, such as UAV composite wings and deployable composite boom structures. Necessary modifications of the developed SHM techniques were conducted to meet the unique requirements of the aerospace structures. The developed SHM algorithms are able to accurately detect and quantify impact damages as well as matrix cracking introduced.
ContributorsLiu, Yingtao (Author) / Chattopadhyay, Aditi (Thesis advisor) / Rajadas, John (Committee member) / Dai, Lenore (Committee member) / Papandreou-Suppappola, Antonia (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2012
Description
This research investigated using impedance as a minimally invasive oral cancer-screening tool by modeling healthy and diseased tissue. This research developed an ultra-structurally based tissue model for oral mucosa that is versatile enough to be easily modified to mimic the passive electrical impedance responses of multiple benign and cancerous tissue

This research investigated using impedance as a minimally invasive oral cancer-screening tool by modeling healthy and diseased tissue. This research developed an ultra-structurally based tissue model for oral mucosa that is versatile enough to be easily modified to mimic the passive electrical impedance responses of multiple benign and cancerous tissue types. This new model provides answers to biologically meaningful questions related to the impedance response of healthy and diseased tissues. This model breaks away from the old empirical top down "black box" Thèvinin equivalent model. The new tissue model developed here was created from a bottom up perspective resulting in a model that is analogous to having a "Transparent Box" where each network element relating to a specific structural component is known. This new model was developed starting with sub cellular ultra-structural components such as membranes, proteins and electrolytes. These components formed the basic network elements and topology of the organelles. The organelle networks combine to form the cell networks. The cell networks combine to make networks of cell layers and the cell layers were combined into tissue networks. This produced the complete "Transparent Box" model for normal tissue. This normal tissue model was modified for disease based on the ultra-structural pathology of each disease. The diseased tissues evaluated include cancers type one through type three; necrotic-inflammation, hyperkeratosis and the compound condition of hyperkeratosis over cancer type two. The impedance responses for each of the disease were compared side by side with the response of normal healthy tissue. Comparative evidence from the models showed the structural changes in cancer produce a unique identifiable impedance "finger print." The evaluation of the "Transparent Box" model for normal tissues and diseased tissues show clear support for using comparative impedance measurements as a clinical tool for oral cancer screening.
ContributorsPelletier, Peter Robert (Author) / Kozicki, Michael (Thesis advisor) / Towe, Bruce (Committee member) / Saraniti, Marco (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Power supply management is important for MEMS (Micro-Electro-Mechanical-Systems) bio-sensing and chemical sensing applications. The dissertation focuses on discussion of accessibility to different power sources and supply tuning in sensing applications. First, the dissertation presents a high efficiency DC-DC converter for a miniaturized Microbial Fuel Cell (MFC). The miniaturized MFC produces

Power supply management is important for MEMS (Micro-Electro-Mechanical-Systems) bio-sensing and chemical sensing applications. The dissertation focuses on discussion of accessibility to different power sources and supply tuning in sensing applications. First, the dissertation presents a high efficiency DC-DC converter for a miniaturized Microbial Fuel Cell (MFC). The miniaturized MFC produces up to approximately 10µW with an output voltage of 0.4-0.7V. Such a low voltage, which is also load dependent, prevents the MFC to directly drive low power electronics. A PFM (Pulse Frequency Modulation) type DC-DC converter in DCM (Discontinuous Conduction Mode) is developed to address the challenges and provides a load independent output voltage with high conversion efficiency. The DC-DC converter, implemented in UMC 0.18µm technology, has been thoroughly characterized, coupled with the MFC. At 0.9V output, the converter has a peak efficiency of 85% with 9µW load, highest efficiency over prior publication. Energy could be harvested wirelessly and often has profound impacts on system performance. The dissertation reports a side-by-side comparison of two wireless and passive sensing systems: inductive and electromagnetic (EM) couplings for an application of in-situ and real-time monitoring of wafer cleanliness in semiconductor facilities. The wireless system, containing the MEMS sensor works with battery-free operations. Two wireless systems based on inductive and EM couplings have been implemented. The working distance of the inductive coupling system is limited by signal-to-noise-ratio (SNR) while that of the EM coupling is limited by the coupled power. The implemented on-wafer transponders achieve a working distance of 6 cm and 25 cm with a concentration resolution of less than 2% (4 ppb for a 200 ppb solution) for inductive and EM couplings, respectively. Finally, the supply tuning is presented in bio-sensing application to mitigate temperature sensitivity. The FBAR (film bulk acoustic resonator) based oscillator is an attractive method in label-free sensing application. Molecular interactions on FBAR surface induce mass change, which results in resonant frequency shift of FBAR. While FBAR has a high-Q to be sensitive to the molecular interactions, FBAR has finite temperature sensitivity. A temperature compensation technique is presented that improves the temperature coefficient of a 1.625 GHz FBAR-based oscillator from -118 ppm/K to less than 1 ppm/K by tuning the supply voltage of the oscillator. The tuning technique adds no additional component and has a large frequency tunability of -4305 ppm/V.
ContributorsZhang, Xu (Author) / Chae, Junseok (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Kozicki, Michael (Committee member) / Phillips, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
High-Resistivity Silicon (HRS) substrates are important for low-loss, high-performance microwave and millimeter wave devices in high-frequency telecommunication systems. The highest resistivity of up to ~10,000 ohm.cm is Float Zone (FZ) grown Si which is produced in small quantities and moderate wafer diameter. The more common Czochralski (CZ) Si can achieve

High-Resistivity Silicon (HRS) substrates are important for low-loss, high-performance microwave and millimeter wave devices in high-frequency telecommunication systems. The highest resistivity of up to ~10,000 ohm.cm is Float Zone (FZ) grown Si which is produced in small quantities and moderate wafer diameter. The more common Czochralski (CZ) Si can achieve resistivities of around 1000 ohm.cm, but the wafers contain oxygen that can lead to thermal donor formation with donor concentration significantly higher (~1015 cm-3) than the dopant concentration (~1012-1013 cm-3) of such high-resistivity Si leading to resistivity changes and possible type conversion of high-resistivity p-type silicon. In this research capacitance-voltage (C-V) characterization is employed to study the donor formation and type conversion of p-type High-resistivity Silicon-On-Insulator (HRSOI) wafers and the challenges involved in C-V characterization of HRSOI wafers using a Schottky contact are highlighted. The maximum capacitance of bulk or Silicon-On-Insulator (SOI) wafers is governed by the gate/contact area. During C-V characterization of high-resistivity SOI wafers with aluminum contacts directly on the Si film (Schottky contact); it was observed that the maximum capacitance is much higher than that due to the contact area, suggesting bias spreading due to the distributed transmission line of the film resistance and the buried oxide capacitance. In addition, an "S"-shape C-V plot was observed in the accumulation region. The effects of various factors, such as: frequency, contact and substrate sizes, gate oxide, SOI film thickness, film and substrate doping, carrier lifetime, contact work-function, temperature, light, annealing temperature and radiation on the C-V characteristics of HRSOI wafers are studied. HRSOI wafers have the best crosstalk prevention capability compared to other types of wafers, which plays a major role in system-on-chip configuration to prevent coupling between high frequency digital and sensitive analog circuits. Substrate crosstalk in HRSOI and various factors affecting the crosstalk, such as: substrate resistivity, separation between devices, buried oxide (BOX) thickness, radiation, temperature, annealing, light, and device types are discussed. Also various ways to minimize substrate crosstalk are studied and a new characterization method is proposed. Owing to their very low doping concentrations and the presence of oxygen in CZ wafers, HRS wafers pose a challenge in resistivity measurement using conventional techniques such as four-point probe and Hall measurement methods. In this research the challenges in accurate resistivity measurement using four-point probe, Hall method, and C-V profile are highlighted and a novel approach to extract resistivity of HRS wafers based on Impedance Spectroscopy measurements using polymer dielectrics such as Polystyrene and Poly Methyl Methacrylate (PMMA) is proposed.
ContributorsNayak, Pinakpani (Author) / Schroder, Dieter K. (Thesis advisor) / Vasileska, Dragica (Committee member) / Kozicki, Michael (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2012