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- All Subjects: Electrical Engineering
- Genre: Doctoral Dissertation
- Creators: Kitchen, Jennifer
Description
The continuing advancement of modulation standards with newer generations of cellular technology, promises ever increasing data rate and bandwidth efficiency. However, these modulation schemes present high peak to average power ratio (PAPR) even after applying crest factor reduction. Being the most power-hungry component in the radio frequency (RF) transmitter, power amplifiers (PA) for infrastructure applications, need to operate efficiently at the presence of these high PAPR signals while maintaining reasonable linearity performance which could be improved by moderate digital pre-distortion (DPD) techniques. This strict requirement of operating efficiently at average power level while being capable of delivering the peak power, made the load modulated PAs such as Doherty PA, Outphasing PA, various Envelope Tracking PAs, Polar transmitters and most recently the load modulated balanced PA, the prime candidates for such application. However, due to its simpler architecture and ability to deliver RF power efficiently with good linearity performance has made Doherty PA (DPA) the most popular solution and has been deployed almost exclusively for wireless infrastructure application all over the world.
Although DPAs has been very successful at amplifying the high PAPR signals, most recent advancements in cellular technology has opted for higher PAPR based signals at wider bandwidth. This lead to increased research and development work to innovate advanced Doherty architectures which are more efficient at back-off (BO) power levels compared to traditional DPAs. In this dissertation, three such advanced Doherty architectures and/or techniques are proposed to achieve high efficiency at further BO power level compared to traditional architecture using symmetrical devices for carrier and peaking PAs. Gallium Nitride (GaN) based high-electron-mobility (HEMT) technology has been used to design and fabricate the DPAs to validate the proposed advanced techniques for higher efficiency with good linearity performance at BO power levels.
Although DPAs has been very successful at amplifying the high PAPR signals, most recent advancements in cellular technology has opted for higher PAPR based signals at wider bandwidth. This lead to increased research and development work to innovate advanced Doherty architectures which are more efficient at back-off (BO) power levels compared to traditional DPAs. In this dissertation, three such advanced Doherty architectures and/or techniques are proposed to achieve high efficiency at further BO power level compared to traditional architecture using symmetrical devices for carrier and peaking PAs. Gallium Nitride (GaN) based high-electron-mobility (HEMT) technology has been used to design and fabricate the DPAs to validate the proposed advanced techniques for higher efficiency with good linearity performance at BO power levels.
ContributorsRuhul Hasin, Muhammad (Author) / Kitchen, Jennifer (Thesis advisor) / Aberle, James T., 1961- (Committee member) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2018
Description
The increased adoption of Internet-of-Things (IoT) for various applications like smart home, industrial automation, connected vehicles, medical instrumentation, etc. has resulted in a large scale distributed network of sensors, accompanied by their power supply regulator modules, control and data transfer circuitry. Depending on the application, the sensor location can be virtually anywhere and therefore they are typically powered by a localized battery. To ensure long battery-life without replacement, the power consumption of the sensor nodes, the supply regulator and, control and data transmission unit, needs to be very low. Reduction in power consumption in the sensor, control and data transmission is typically done by duty-cycled operation such that they are on periodically only for short bursts of time or turn on only based on a trigger event and are otherwise powered down. These approaches reduce their power consumption significantly and therefore the overall system power is dominated by the consumption in the always-on supply regulator.
Besides having low power consumption, supply regulators for such IoT systems also need to have fast transient response to load current changes during a duty-cycled operation. Supply regulation using low quiescent current low dropout (LDO) regulators helps in extending the battery life of such power aware always-on applications with very long standby time. To serve as a supply regulator for such applications, a 1.24 µA quiescent current NMOS low dropout (LDO) is presented in this dissertation. This LDO uses a hybrid bias current generator (HBCG) to boost its bias current and improve the transient response. A scalable bias-current error amplifier with an on-demand buffer drives the NMOS pass device. The error amplifier is powered with an integrated dynamic frequency charge pump to ensure low dropout voltage. A low-power relaxation oscillator (LPRO) generates the charge pump clocks. Switched-capacitor pole tracking (SCPT) compensation scheme is proposed to ensure stability up to maximum load current of 150 mA for a low-ESR output capacitor range of 1 - 47µF. Designed in a 0.25 µm CMOS process, the LDO has an output voltage range of 1V – 3V, a dropout voltage of 240 mV, and a core area of 0.11 mm2.
Besides having low power consumption, supply regulators for such IoT systems also need to have fast transient response to load current changes during a duty-cycled operation. Supply regulation using low quiescent current low dropout (LDO) regulators helps in extending the battery life of such power aware always-on applications with very long standby time. To serve as a supply regulator for such applications, a 1.24 µA quiescent current NMOS low dropout (LDO) is presented in this dissertation. This LDO uses a hybrid bias current generator (HBCG) to boost its bias current and improve the transient response. A scalable bias-current error amplifier with an on-demand buffer drives the NMOS pass device. The error amplifier is powered with an integrated dynamic frequency charge pump to ensure low dropout voltage. A low-power relaxation oscillator (LPRO) generates the charge pump clocks. Switched-capacitor pole tracking (SCPT) compensation scheme is proposed to ensure stability up to maximum load current of 150 mA for a low-ESR output capacitor range of 1 - 47µF. Designed in a 0.25 µm CMOS process, the LDO has an output voltage range of 1V – 3V, a dropout voltage of 240 mV, and a core area of 0.11 mm2.
ContributorsMagod Ramakrishna, Raveesh (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Kitchen, Jennifer (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2018
Description
There is an ever-increasing demand for higher bandwidth and data rate ensuing from exploding number of radio frequency integrated systems and devices. As stated in the Shannon-Hartley theorem, the maximum achievable data rate of a communication channel is linearly proportional to the system bandwidth. This is the main driving force behind pushing wireless systems towards millimeter-wave frequency range, where larger bandwidth is available at a higher carrier frequency. Observing the Moor’s law, highly scaled complementary metal–oxide–semiconductor (CMOS) technologies provide fast transistors with a high unity power gain frequency which enables operating at millimeter-wave frequency range. CMOS is the compelling choice for digital and signal processing modules which concurrently offers high computation speed, low power consumption, and mass integration at a high manufacturing yield. One of the main shortcomings of the sub-micron CMOS technologies is the low breakdown voltage of the transistors that limits the dynamic range of the radio frequency (RF) power blocks, especially with the power amplifiers. Low voltage swing restricts the achievable output power which translates into low signal to noise ratio and degraded linearity. Extensive research has been done on proposing new design and IC fabrication techniques with the goal of generating higher output power in CMOS technology. The prominent drawbacks of these solutions are an increased die area, higher cost per design, and lower overall efficiency due to lossy passive components. In this dissertation, CMOS compatible metal–semiconductor field-effect transistor (MESFETs) are utilized to put forward a new solution to enhance the power amplifier’s breakdown voltage, gain and maximum output power. Requiring no change to the conventional CMOS process flow, this low cost approach allows direct incorporation of high voltage power MESFETs into silicon. High voltage MESFETs were employed in a cascode structure to push the amplifier’s cutoff frequency and unity power gain frequency to the 5G and K-band frequency range. This dissertation begins with CMOS compatible MESFET modeling and fabrication steps, and culminates in the discussion of amplifier design and optimization methodology, parasitic de-embedding steps, simulation and measurement results, and high resistivity RF substrate characterization.
ContributorsHabibiMehr, Payam (Author) / Thornton, Trevor John (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Formicone, Gabriele (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2019
Description
Due to high level of integration in RF System on Chip (SOC), the test access points are limited to the baseband and RF inputs/outputs of the system. This limited access poses a big challenge particularly for advanced RF architectures where calibration of internal parameters is necessary and ensure proper operation. Therefore low-overhead built-in Self-Test (BIST) solution for advanced RF transceiver is proposed. In this dissertation. Firstly, comprehensive BIST solution for RF polar transceivers using on-chip resources is presented. In the receiver, phase and gain mismatches degrade sensitivity and error vector magnitude (EVM). In the transmitter, delay skew between the envelope and phase signals and the finite envelope bandwidth can create intermodulation distortion (IMD) that leads to violation of spectral mask requirements. Characterization and calibration of these parameters with analytical model would reduce the test time and cost considerably. Hence, a technique to measure and calibrate impairments of the polar transceiver in the loop-back mode is proposed.
Secondly, robust amplitude measurement technique for RF BIST application and BIST circuits for loop-back connection are discussed. Test techniques using analytical model are explained and BIST circuits are introduced.
Next, a self-compensating built-in self-test solution for RF Phased Array Mismatch is proposed. In the proposed method, a sinusoidal test signal with unknown amplitude is applied to the inputs of two adjacent phased array elements and measure the baseband output signal after down-conversion. Mathematical modeling of the circuit impairments and phased array behavior indicates that by using two distinct input amplitudes, both of which can remain unknown, it is possible to measure the important parameters of the phased array, such as gain and phase mismatch. In addition, proposed BIST system is designed and fabricated using IBM 180nm process and a prototype four-element phased-array PCB is also designed and fabricated for verifying the proposed method.
Finally, process independent gain measurement via BIST/DUT co-design is explained. Design methodology how to reduce performance impact significantly is discussed.
Simulation and hardware measurements results for the proposed techniques show that the proposed technique can characterize the targeted impairments accurately.
Secondly, robust amplitude measurement technique for RF BIST application and BIST circuits for loop-back connection are discussed. Test techniques using analytical model are explained and BIST circuits are introduced.
Next, a self-compensating built-in self-test solution for RF Phased Array Mismatch is proposed. In the proposed method, a sinusoidal test signal with unknown amplitude is applied to the inputs of two adjacent phased array elements and measure the baseband output signal after down-conversion. Mathematical modeling of the circuit impairments and phased array behavior indicates that by using two distinct input amplitudes, both of which can remain unknown, it is possible to measure the important parameters of the phased array, such as gain and phase mismatch. In addition, proposed BIST system is designed and fabricated using IBM 180nm process and a prototype four-element phased-array PCB is also designed and fabricated for verifying the proposed method.
Finally, process independent gain measurement via BIST/DUT co-design is explained. Design methodology how to reduce performance impact significantly is discussed.
Simulation and hardware measurements results for the proposed techniques show that the proposed technique can characterize the targeted impairments accurately.
ContributorsJeong, Jae Woong (Author) / Ozev, Sule (Thesis advisor) / Kitchen, Jennifer (Committee member) / Cao, Yu (Committee member) / Ogras, Umit Y. (Committee member) / Arizona State University (Publisher)
Created2015
Description
Rail clamp circuits are widely used for electrostatic discharge (ESD) protection in semiconductor products today. A step-by-step design procedure for the traditional RC and single-inverter-based rail clamp circuit and the design, simulation, implementation, and operation of two novel rail clamp circuits are described for use in the ESD protection of complementary metal-oxide-semiconductor (CMOS) circuits. The step-by-step design procedure for the traditional circuit is technology-node independent, can be fully automated, and aims to achieve a minimal area design that meets specified leakage and ESD specifications under all valid process, voltage, and temperature (PVT) conditions. The first novel rail clamp circuit presented employs a comparator inside the traditional circuit to reduce the value of the time constant needed. The second circuit uses a dynamic time constant approach in which the value of the time constant is dynamically adjusted after the clamp is triggered. Important metrics for the two new circuits such as ESD performance, latch-on immunity, clamp recovery time, supply noise immunity, fastest power-on time supported, and area are evaluated over an industry-standard PVT space using SPICE simulations and measurements on a fabricated 40 nm test chip.
ContributorsVenkatasubramanian, Ramachandran (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2016
Description
Photovoltaic (PV) systems are affected by converter losses, partial shading and other mismatches in the panels. This dissertation introduces a sub-panel maximum power point tracking (MPPT) architecture together with an integrated CMOS current sensor circuit on a chip to reduce the mismatch effects, losses and increase the efficiency of the PV system. The sub-panel MPPT increases the efficiency of the PV during the shading and replaces the bypass diodes in the panels with an integrated MPPT and DC-DC regulator. For the integrated MPPT and regulator, the research developed an integrated standard CMOS low power and high common mode range Current-to-Digital Converter (IDC) circuit and its application for DC-DC regulator and MPPT. The proposed charge based CMOS switched-capacitor circuit directly digitizes the output current of the DC-DC regulator without an analog-to-digital converter (ADC) and the need for high-voltage process technology. Compared to the resistor based current-sensing methods that requires current-to-voltage circuit, gain block and ADC, the proposed CMOS IDC is a low-power efficient integrated circuit that achieves high resolution, lower complexity, and lower power consumption. The IDC circuit is fabricated on a 0.7 um CMOS process, occupies 2mm x 2mm and consumes less than 27mW. The IDC circuit has been tested and used for boost DC-DC regulator and MPPT for photo-voltaic system. The DC-DC converter has an efficiency of 95%. The sub-module level power optimization improves the output power of a shaded panel by up to 20%, compared to panel MPPT with bypass diodes.
ContributorsMarti-Arbona, Edgar (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kitchen, Jennifer (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2014
Description
Several state of the art, monitoring and control systems, such as DC motor
controllers, power line monitoring and protection systems, instrumentation systems and battery monitors require direct digitization of a high voltage input signals. Analog-to-Digital Converters (ADCs) that can digitize high voltage signals require high linearity and low voltage coefficient capacitors. A built in self-calibration and digital-trim algorithm correcting static mismatches in Capacitive Digital-to-Analog Converter (CDAC) used in Successive Approximation Register Analog to Digital Converters (SARADCs) is proposed. The algorithm uses a dynamic error correction (DEC) capacitor to cancel the static errors occurring in each capacitor of the array as the first step upon power-up and eliminates the need for an extra calibration DAC. Self-trimming is performed digitally during normal ADC operation. The algorithm is implemented on a 14-bit high-voltage input range SAR ADC with integrated dynamic error correction capacitors. The IC is fabricated in 0.6-um high voltage compliant CMOS process, accepting up to 24Vpp differential input signal. The proposed approach achieves 73.32 dB Signal to Noise and Distortion Ratio (SNDR) which is an improvement of 12.03 dB after self-calibration at 400 kS/s sampling rate, consuming 90-mW from a +/-15V supply. The calibration circuitry occupies 28% of the capacitor DAC, and consumes less than 15mW during operation. Measurement results shows that this algorithm reduces INL from as high as 7 LSBs down to 1 LSB and it works even in the presence of larger mismatches exceeding 260 LSBs. Similarly, it reduces DNL errors from 10 LSBs down to 1 LSB. The ADC occupies an active area of 9.76 mm2.
controllers, power line monitoring and protection systems, instrumentation systems and battery monitors require direct digitization of a high voltage input signals. Analog-to-Digital Converters (ADCs) that can digitize high voltage signals require high linearity and low voltage coefficient capacitors. A built in self-calibration and digital-trim algorithm correcting static mismatches in Capacitive Digital-to-Analog Converter (CDAC) used in Successive Approximation Register Analog to Digital Converters (SARADCs) is proposed. The algorithm uses a dynamic error correction (DEC) capacitor to cancel the static errors occurring in each capacitor of the array as the first step upon power-up and eliminates the need for an extra calibration DAC. Self-trimming is performed digitally during normal ADC operation. The algorithm is implemented on a 14-bit high-voltage input range SAR ADC with integrated dynamic error correction capacitors. The IC is fabricated in 0.6-um high voltage compliant CMOS process, accepting up to 24Vpp differential input signal. The proposed approach achieves 73.32 dB Signal to Noise and Distortion Ratio (SNDR) which is an improvement of 12.03 dB after self-calibration at 400 kS/s sampling rate, consuming 90-mW from a +/-15V supply. The calibration circuitry occupies 28% of the capacitor DAC, and consumes less than 15mW during operation. Measurement results shows that this algorithm reduces INL from as high as 7 LSBs down to 1 LSB and it works even in the presence of larger mismatches exceeding 260 LSBs. Similarly, it reduces DNL errors from 10 LSBs down to 1 LSB. The ADC occupies an active area of 9.76 mm2.
ContributorsThirunakkarasu, Shankar (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Kozicki, Michael (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
Description
The demand for the higher data rate in the wireless telecommunication is increasing rapidly. Providing higher data rate in cellular telecommunication systems is limited because of the limited physical resources such as telecommunication frequency channels. Besides, interference with the other users and self-interference signal in the receiver are the other challenges in increasing the bandwidth of the wireless telecommunication system.
Full duplex wireless communication transmits and receives at the same time and the same frequency which was assumed impossible in the conventional wireless communication systems. Full duplex wireless communication, compared to the conventional wireless communication, doubles the channel efficiency and bandwidth. In addition, full duplex wireless communication system simplifies the reusing of the radio resources in small cells to eliminate the backhaul problem and simplifies the management of the spectrum. Finally, the full duplex telecommunication system reduces the costs of future wireless communication systems.
The main challenge in the full duplex wireless is the self-interference signal at the receiver which is very large compared to the receiver noise floor and it degrades the receiver performance significantly. In this dissertation, different techniques for the antenna interface and self-interference cancellation are proposed for the wireless full duplex transceiver. These techniques are designed and implemented on CMOS technology. The measurement results show that the full duplex wireless is possible for the short range and cellular wireless communication systems.
Full duplex wireless communication transmits and receives at the same time and the same frequency which was assumed impossible in the conventional wireless communication systems. Full duplex wireless communication, compared to the conventional wireless communication, doubles the channel efficiency and bandwidth. In addition, full duplex wireless communication system simplifies the reusing of the radio resources in small cells to eliminate the backhaul problem and simplifies the management of the spectrum. Finally, the full duplex telecommunication system reduces the costs of future wireless communication systems.
The main challenge in the full duplex wireless is the self-interference signal at the receiver which is very large compared to the receiver noise floor and it degrades the receiver performance significantly. In this dissertation, different techniques for the antenna interface and self-interference cancellation are proposed for the wireless full duplex transceiver. These techniques are designed and implemented on CMOS technology. The measurement results show that the full duplex wireless is possible for the short range and cellular wireless communication systems.
ContributorsAyati, Seyyed Amir (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Bliss, Daniel (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2017
Description
As wireless communication enters smartphone era, more complicated communication technologies are being used to transmit higher data rate. Power amplifier (PA) has to work in back-off region, while this inevitably reduces battery life for cellphones. Various techniques have been reported to increase PA efficiency, such as envelope elimination and restoration (EER) and envelope tracking (ET). However, state of the art ET supply modulators failed to address high efficiency, high slew rate, and accurate tracking concurrently.
In this dissertation, a linear-switch mode hybrid ET supply modulator utilizing adaptive biasing and gain enhanced current mirror operational transconductance amplifier (OTA) with class-AB output stage in parallel with a switching regulator is presented. In comparison to a conventional OTA design with similar quiescent current consumption, proposed approach improves positive and negative slew rate from 50 V/µs to 93.4 V/µs and -87 V/µs to -152.5 V/µs respectively, dc gain from 45 dB to 67 dB while consuming same amount of quiescent current. The proposed hybrid supply modulator achieves 83% peak efficiency, power added efficiency (PAE) of 42.3% at 26.2 dBm for a 10 MHz 7.24 dB peak-to-average power ratio (PAPR) LTE signal and improves PAE by 8% at 6 dB back off from 26.2 dBm power amplifier (PA) output power with respect to fixed supply. With a 10 MHz 7.24 dB PAPR QPSK LTE signal the ET PA system achieves adjacent channel leakage ratio (ACLR) of -37.7 dBc and error vector magnitude (EVM) of 4.5% at 26.2 dBm PA output power, while with a 10 MHz 8.15 dB PAPR 64QAM LTE signal the ET PA system achieves ACLR of -35.6 dBc and EVM of 6% at 26 dBm PA output power without digital pre-distortion (DPD). The proposed supply modulator core circuit occupies 1.1 mm2 die area, and is fabricated in a 0.18 µm CMOS technology.
In this dissertation, a linear-switch mode hybrid ET supply modulator utilizing adaptive biasing and gain enhanced current mirror operational transconductance amplifier (OTA) with class-AB output stage in parallel with a switching regulator is presented. In comparison to a conventional OTA design with similar quiescent current consumption, proposed approach improves positive and negative slew rate from 50 V/µs to 93.4 V/µs and -87 V/µs to -152.5 V/µs respectively, dc gain from 45 dB to 67 dB while consuming same amount of quiescent current. The proposed hybrid supply modulator achieves 83% peak efficiency, power added efficiency (PAE) of 42.3% at 26.2 dBm for a 10 MHz 7.24 dB peak-to-average power ratio (PAPR) LTE signal and improves PAE by 8% at 6 dB back off from 26.2 dBm power amplifier (PA) output power with respect to fixed supply. With a 10 MHz 7.24 dB PAPR QPSK LTE signal the ET PA system achieves adjacent channel leakage ratio (ACLR) of -37.7 dBc and error vector magnitude (EVM) of 4.5% at 26.2 dBm PA output power, while with a 10 MHz 8.15 dB PAPR 64QAM LTE signal the ET PA system achieves ACLR of -35.6 dBc and EVM of 6% at 26 dBm PA output power without digital pre-distortion (DPD). The proposed supply modulator core circuit occupies 1.1 mm2 die area, and is fabricated in a 0.18 µm CMOS technology.
ContributorsJing, Yue (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Song, Hongjiang (Committee member) / Arizona State University (Publisher)
Created2017
Description
A 4-phase, quasi-current-mode hysteretic buck converter with digital frequency synchronization, online comparator offset-calibration and digital current sharing control is presented. The switching frequency of the hysteretic converter is digitally synchronized to the input clock reference with less than ±1.5% error in the switching frequency range of 3-9.5MHz. The online offset calibration cancels the input-referred offset of the hysteretic comparator and enables ±1.1% voltage regulation accuracy. Maximum current-sharing error of ±3.6% is achieved by a duty-cycle-calibrated delay line based PWM generator, without affecting the phase synchronization timing sequence. In light load conditions, individual converter phases can be disabled, and the final stage power converter output stage is segmented for high efficiency. The DC-DC converter achieves 93% peak efficiency for Vi = 2V and Vo = 1.6V.
ContributorsSun, Ming (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Seo, Jae-Sun (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2017