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Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
Description
Semiconductor nanowires are featured by their unique one-dimensional structure which makes them promising for small scale electronic and photonic device applications. Among them, III-V material nanowires are particularly outstanding due to their good electronic properties. In bulk, these materials reveal electron mobility much higher than conventional silicon based devices, for example at room temperature, InAs field effect transistor (FET) has electron mobility of 40,000 cm2/Vs more than 10 times of Si FET. This makes such materials promising for high speed nanowire FETs. With small bandgap, such as 0.354 eV for InAs and 1.52 eV for GaAs, it does not need high voltage to turn on such devices which leads to low power consumption devices. Another feature of direct bandgap allows their applications of optoelectronic devices such as avalanche photodiodes. However, there are challenges to face up. Due to their large surface to volume ratio, nanowire devices typically are strongly affected by the surface states. Although nanowires can be grown into single crystal structure, people observe crystal defects along the wires which can significantly affect the performance of devices. In this work, FETs made of two types of III-V nanowire, GaAs and InAs, are demonstrated. These nanowires are grown by catalyst-free MOCVD growth method. Vertically nanowires are transferred onto patterned substrates for coordinate calibration. Then electrodes are defined by e-beam lithography followed by deposition of contact metals. Prior to metal deposition, however, the substrates are dipped in ammonium hydroxide solution to remove native oxide layer formed on nanowire surface. Current vs. source-drain voltage with different gate bias are measured at room temperature. GaAs nanowire FETs show photo response while InAs nanowire FETs do not show that. Surface passivation is performed on GaAs FETs by using ammonium surfide solution. The best results on current increase is observed with around 20-30 minutes chemical treatment time. Gate response measurements are performed at room temperature, from which field effect mobility as high as 1490 cm2/Vs is extracted for InAs FETs. One major contributor for this is stacking faults defect existing along nanowires. For InAs FETs, thermal excitations observed from temperature dependent results which leads us to investigate potential barriers.
ContributorsLiang, Hanshuang (Author) / Yu, Hongbin (Thesis advisor) / Ferry, David (Committee member) / Tracy, Clarence (Committee member) / Arizona State University (Publisher)
Created2011
Description
This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were made of Ti/Pt strips with the thickness 0.12 µm and 0.02 µm. The resistance of the sensing element was measured at approximately 1.6-1.7 kohms;. A linear relation between the resistance and temperature was established over the temperature ranging from 22 degree Celsius to 80 degree Celsius and the temperature coefficient of resistance (TCR) was at approximately 0.12 %/degree Celsius. The first thermal flow sensor was one-dimensional (1-D) flexible shear stress sensor. The structure was sensing element sandwiched by a biocompatible polymer "poly-para-xylylene", also known as Parylene, which provided both insulation of electrodes and flexibility of the sensors. A constant-temperature (CT) circuit was designed as the read out circuit based on 0.6 µm CMOS (Complementary metal-oxide-semiconductor) process. The 1-D shear stress sensor suffered from a large measurement error. Because when the sensor was inserted into blood vessels, it was impossible to mount the sensor to the wall as calibrated in micro fluidic channels. According to the previous simulation work, the shear stress was varying and the sensor itself changed the shear stress distribution. We proposed a three-dimensional (3-D) thermal flow sensor, with three-axis of sensing elements integrated in one sensor. It was in the similar shape as a hexagonal prism with diagonal of 1000 µm. On the top of the sensor, there were five bond pads for external wires over 500 µm thick silicon substrate. In each nonadjacent side surface, there was a bended parylene branch with one sensing element. Based on the unique 3-D structure, the sensor was able to obtain data along three axes. With computational fluid dynamics (CFD) model, it is possible to locate the sensor in the blood vessels and give us a better understanding of shear stress distribution in the presence of time-varying component of blood flow and realize more accurate assessment of intravascular convective heat transfer.
ContributorsTang, Rui (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Pan, George (Committee member) / Arizona State University (Publisher)
Created2011
Description
Structural health management (SHM) is emerging as a vital methodology to help engineers improve the safety and maintainability of critical structures. SHM systems are designed to reliably monitor and test the health and performance of structures in aerospace, civil, and mechanical engineering applications. SHM combines multidisciplinary technologies including sensing, signal processing, pattern recognition, data mining, high fidelity probabilistic progressive damage models, physics based damage models, and regression analysis. Due to the wide application of carbon fiber reinforced composites and their multiscale failure mechanisms, it is necessary to emphasize the research of SHM on composite structures. This research develops a comprehensive framework for the damage detection, localization, quantification, and prediction of the remaining useful life of complex composite structures. To interrogate a composite structure, guided wave propagation is applied to thin structures such as beams and plates. Piezoelectric transducers are selected because of their versatility, which allows them to be used as sensors and actuators. Feature extraction from guided wave signals is critical to demonstrate the presence of damage and estimate the damage locations. Advanced signal processing techniques are employed to extract robust features and information. To provide a better estimate of the damage for accurate life estimation, probabilistic regression analysis is used to obtain a prediction model for the prognosis of complex structures subject to fatigue loading. Special efforts have been applied to the extension of SHM techniques on aerospace and spacecraft structures, such as UAV composite wings and deployable composite boom structures. Necessary modifications of the developed SHM techniques were conducted to meet the unique requirements of the aerospace structures. The developed SHM algorithms are able to accurately detect and quantify impact damages as well as matrix cracking introduced.
ContributorsLiu, Yingtao (Author) / Chattopadhyay, Aditi (Thesis advisor) / Rajadas, John (Committee member) / Dai, Lenore (Committee member) / Papandreou-Suppappola, Antonia (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2012
Description
Electrospun nanofibers can be prepared from various kinds of inorganic substances by electro-spinning techniques. They have great potential in many applications including super capacitors, lithium ion batteries, filtration, catalyst and enzyme carriers, and sensors [1]. The traditional way to produce electrospun nanofibers is needle based electro-spinning [1]. However, electrospun nanofibers have not been widely used in practice because of low nanofiber production rates. One way to largely increase the electro-spinning productivity is needleless electro-spinning. In 2005, Jirsak et al. patented a rotating roller fiber generator for the mass production of nanofibers [2]. Elmarco Corporation commercialized this technique to manufacture nanofiber equipment for the production of all sorts of organic and inorganic nanofibers, and named it "NanospiderTM". For this project, my goal is to build a needleless electro-spinner to produce nanofibers as the separator of lithium ion batteries. The model of this project is based on the design of rotating roller fiber generator, and is adapted from a project at North Dakota State University in 2011 [3].
ContributorsQiao, Guanhao (Author) / Yu, Hongyu (Thesis director) / Jiang, Hanqing (Committee member) / Goryll, Michael (Committee member) / Barrett, The Honors College (Contributor) / Ira A. Fulton School of Engineering (Contributor)
Created2012-12
Description
A novel strain sensing procedure using an optical scanning methodology and diffraction grating is explored. The motivation behind this study is due to uneven thermal strain distribution across semiconductor chips that are composed of varying materials. Due to the unique properties of the materials and the different coefficients of thermal expansion (CTE), one can expect the material that experiences the highest strain to be the most likely failure point of the chip. As such, there is a need for a strain sensing technique that offers a very high strain sensitivity, a high spatial resolution while simultaneously achieving a large field of view. This study goes through the optical setup as well as the evolution of the optical grating in an effort to improve the strain sensitivity of this setup.
ContributorsChen, George (Co-author) / Ma, Teng (Co-author) / Liang, Hanshuang (Co-author) / Song, Zeming (Co-author) / Nguyen, Hoa (Co-author) / Yu, Hongbin (Thesis director) / Jiang, Hanqing (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2014-05
Description
Different environmental factors, such as ultraviolet radiation (UV), relative humidity (RH) and the presence of reducing gases (acetone and ethanol), play an important role in the daily life of human beings. UV is very important in a number of areas, such as astronomy, resin curing of polymeric materials, combustion engineering, water purification, flame detection and biological effects with more recent proposals like early missile plume detection, secure space-to-space communications and pollution monitoring. RH is a very common parameter in the environment. It is essential not only for human comfort, but also for a broad spectrum of industries and technologies. There is a substantial interest in the development of RH sensors for applications in monitoring moisture level at home, in clean rooms, cryogenic processes, medical and food science, and so on. The concentration of acetone and other ketone bodies in the exhaled air can serve as an express noninvasive diagnosis of ketosis. Meanwhile, driving under the influence of alcohol is a serious traffic violation and this kind of deviant behavior causes many accidents and deaths on the highway. Therefore, the detection of ethanol in breath is usually used as a quick and reliable screening method for the sobriety checkpoint. Traditionally, semiconductor metal oxide sensors are the major candidates employed in the sensing applications mentioned above. However, they suffer from the low sensitivity, poor selectivity and huge power consumption. In this dissertation, Zinc Oxide (ZnO) based Film Bulk Acoustic Resonator (FBAR) was developed to monitor UV, RH, acetone and ethanol in the environment. FBAR generally consists of a sputtered piezoelectric thin film (ZnO/AlN) sandwiched between two electrodes. It has been well developed both as filters and as high sensitivity mass sensors in recent years. FBAR offers high sensitivity and excellent selectivity for various environment monitoring applications. As the sensing signal is in the frequency domain, FABR has the potential to be incorporated in a wireless sensor network for remote sensing. This study extended our current knowledge of FBAR and pointed out feasible directions for future exploration.
ContributorsQiu, Xiaotun (Author) / Yu, Hongyu (Thesis advisor) / Christen, Jennifer Blain (Committee member) / Aberle, James T., 1961- (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2011
Description
This thesis examines the mechanical properties of an origami inspired structure and its equivalent cube counterpart to determine if this origami configuration is an effective load bearing and energy absorption structure. To test this, a folded paper model was created for visual realization and then 3D printed models were created to undergo compression testing using the Instron 4411. The data from testing was used to create stress-strain curves for each sample, which were then used to determine the maximum stress and toughness of each structure. The performance of these structures was also compared to other known material performance. The origami structure was found to outperform the equivalent cube in both maximum stress it could withstand before failure and toughness. These results are grounds for further research to be done to determine the validity of origami structures as viable alternatives to current material configurations.
ContributorsFong, Jessica (Author) / Jiang, Hanqing (Thesis director) / Kingsbury, Dallas (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
This research project will test the structural properties of a 3D printed origami inspired structure and compare them with a standard honeycomb structure. The models have equal face areas, model heights, and overall volume but wall thicknesses will be different. Stress-deformation curves were developed from static loading testing. The area under these curves was used to calculate the toughness of the structures. These curves were analyzed to see which structures take more load and which deform more before fracture. Furthermore, graphs of the Stress-Strain plots were produced. Using 3-D printed parts in tough resin printed with a Stereolithography (SLA) printer, the origami inspired structure withstood a larger load, produced a larger toughness and deformed more before failure than the equivalent honeycomb structure.
ContributorsMcGregor, Alexander (Author) / Jiang, Hanqing (Thesis director) / Kingsbury, Dallas (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
Origami and kirigami, the technique of generating three-dimensional (3D) structures from two-dimensional (2D) flat sheets, are now more and more involved in scientific and engineering fields. Therefore, the development of tools for their theoretical analysis becomes more and more important. Since much effort was paid on calculations based on pure mathematical consideration and only limited effort has been paid to include mechanical properties, the goal of my research is developing a method to analyze the mechanical behavior of origami and kirigami based structures. Mechanical characteristics, including nonlocal effect and fracture of the structures, as well as elasticity and plasticity of materials are studied. For calculation of relative simple structures and building of structures’ constitutive relations, analytical approaches were used. For more complex structures, finite element analysis (FEA), which is commonly applied as a numerical method for the analysis of solid structures, was utilized. The general study approach is not necessarily related to characteristic size of model. I believe the scale-independent method described here will pave a new way to understand the mechanical response of a variety of origami and kirigami based structures under given mechanical loading.
ContributorsLv, Cheng (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongbin (Committee member) / Wang, Liping (Committee member) / Mignolet, Marc (Committee member) / Hildreth, Owen (Committee member) / Arizona State University (Publisher)
Created2016