Matching Items (22)
Filtering by
- All Subjects: Electrical Engineering
- All Subjects: Aerospace Engineering
Description
This thesis presents approaches to develop micro seismometers and accelerometers based on molecular electronic transducers (MET) technology using MicroElectroMechanical Systems (MEMS) techniques. MET is a technology applied in seismic instrumentation that proves highly beneficial to planetary seismology. It consists of an electrochemical cell that senses the movement of liquid electrolyte between electrodes by converting it to the output current. MET seismometers have advantages of high sensitivity, low noise floor, small size, absence of fragile mechanical moving parts and independence on the direction of sensitivity axis. By using MEMS techniques, a micro MET seismometer is developed with inter-electrode spacing close to 1μm, which improves the sensitivity of fabricated device to above 3000 V/(m/s^2) under operating bias of 600 mV and input acceleration of 400 μG (G=9.81m/s^2) at 0.32 Hz. The lowered hydrodynamic resistance by increasing the number of channels improves the self-noise to -127 dB equivalent to 44 nG/√Hz at 1 Hz. An alternative approach to build the sensing element of MEMS MET seismometer using SOI process is also presented in this thesis. The significantly increased number of channels is expected to improve the noise performance. Inspired by the advantages of combining MET and MEMS technologies on the development of seismometer, a low frequency accelerometer utilizing MET technology with post-CMOS-compatible fabrication processes is developed. In the fabricated accelerometer, the complicated fabrication of mass-spring system in solid-state MEMS accelerometer is replaced with a much simpler post-CMOS-compatible process containing only deposition of a four-electrode MET structure on a planar substrate, and a liquid inertia mass of an electrolyte droplet encapsulated by oil film. The fabrication process does not involve focused ion beam milling which is used in the micro MET seismometer fabrication, thus the cost is lowered. Furthermore, the planar structure and the novel idea of using an oil film as the sealing diaphragm eliminate the complicated three-dimensional packaging of the seismometer. The fabricated device achieves 10.8 V/G sensitivity at 20 Hz with nearly flat response over the frequency range from 1 Hz to 50 Hz, and a low noise floor of 75 μG/√Hz at 20 Hz.
ContributorsHuang, Hai (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Dai, Lenore (Committee member) / Si, Jennie (Committee member) / Arizona State University (Publisher)
Created2014
Description
This research focuses on the benefits of using nanocomposites in aerospace structural components to prevent or delay the onset of unique composite failure modes, such as delamination. Analytical, numerical, and experimental analyses were conducted to provide a comprehensive understanding of how carbon nanotubes (CNTs) can provide additional structural integrity when they are used in specific hot spots within a structure. A multiscale approach was implemented to determine the mechanical and thermal properties of the nanocomposites, which were used in detailed finite element models (FEMs) to analyze interlaminar failures in T and Hat section stringers. The delamination that first occurs between the tow filler and the bondline between the stringer and skin was of particular interest. Both locations are considered to be hot spots in such structural components, and failures tend to initiate from these areas. In this research, nanocomposite use was investigated as an alternative to traditional methods of suppressing delamination. The stringer was analyzed under different loading conditions and assuming different structural defects. Initial damage, defined as the first drop in the load displacement curve was considered to be a useful variable to compare the different behaviors in this study and was detected via the virtual crack closure technique (VCCT) implemented in the FE analysis.
Experiments were conducted to test T section skin/stringer specimens under pull-off loading, replicating those used in composite panels as stiffeners. Two types of designs were considered: one using pure epoxy to fill the tow region and another that used nanocomposite with 5 wt. % CNTs. The response variable in the tests was the initial damage. Detailed analyses were conducted using FEMs to correlate with the experimental data. The correlation between both the experiment and model was satisfactory. Finally, the effects of thermal cure and temperature variation on nanocomposite structure behavior were studied, and both variables were determined to influence the nanocomposite structure performance.
Experiments were conducted to test T section skin/stringer specimens under pull-off loading, replicating those used in composite panels as stiffeners. Two types of designs were considered: one using pure epoxy to fill the tow region and another that used nanocomposite with 5 wt. % CNTs. The response variable in the tests was the initial damage. Detailed analyses were conducted using FEMs to correlate with the experimental data. The correlation between both the experiment and model was satisfactory. Finally, the effects of thermal cure and temperature variation on nanocomposite structure behavior were studied, and both variables were determined to influence the nanocomposite structure performance.
ContributorsHasan, Zeaid (Author) / Chattopadhyay, Aditi (Thesis advisor) / Dai, Lenore (Committee member) / Jiang, Hanqing (Committee member) / Rajadas, John (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2014
Description
This dissertation presents my work on development of deformable electronics using microelectromechanical systems (MEMS) based fabrication technologies. In recent years, deformable electronics are coming to revolutionize the functionality of microelectronics seamlessly with their application environment, ranging from various consumer electronics to bio-medical applications. Many researchers have studied this area, and a wide variety of devices have been fabricated. One traditional way is to directly fabricate electronic devices on flexible substrate through low-temperature processes. These devices suffered from constrained functionality due to the temperature limit. Another transfer printing approach has been developed recently. The general idea is to fabricate functional devices on hard and planar substrates using standard processes then transferred by elastomeric stamps and printed on desired flexible and stretchable substrates. The main disadvantages are that the transfer printing step may limit the yield. The third method is "flexible skins" which silicon substrates are thinned down and structured into islands and sandwiched by two layers of polymer. The main advantage of this method is post CMOS compatible. Based on this technology, we successfully fabricated a 3-D flexible thermal sensor for intravascular flow monitoring. The final product of the 3-D sensor has three independent sensing elements equally distributed around the wall of catheter (1.2 mm in diameter) with 120° spacing. This structure introduces three independent information channels, and cross-comparisons among all readings were utilized to eliminate experimental error and provide better measurement results. The novel fabrication and assembly technology can also be applied to other catheter based biomedical devices. A step forward inspired by the ancient art of folding, origami, which creating three-dimensional (3-D) structures from two-dimensional (2-D) sheets through a high degree of folding along the creases. Based on this idea, we developed a novel method to enable better deformability. One example is origami-enabled silicon solar cells. The solar panel can reach up to 644% areal compactness while maintain reasonable good performance (less than 30% output power density drop) upon 40 times cyclic folding/unfolding. This approach can be readily applied to other functional devices, ranging from sensors, displays, antenna, to energy storage devices.
ContributorsTang, Rui (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Pan, George (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2014
Description
In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain is a major concern that could affect the performance of the working devices or even lead to the failure of the devices. Therefore strain sensing techniques to create a contour of the strain distribution is desired.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
ContributorsLiang, Hanshuang (Author) / Yu, Hongbin (Thesis advisor) / Poon, Poh Chieh Benny (Committee member) / Jiang, Hanqing (Committee member) / Zhang, Yong-Hang (Committee member) / Arizona State University (Publisher)
Created2014
Description
Advanced composites are being widely used in aerospace applications due to their high stiffness, strength and energy absorption capabilities. However, the assurance of structural reliability is a critical issue because a damage event will compromise the integrity of composite structures and lead to ultimate failure. In this dissertation a novel homogenization based multiscale modeling framework using semi-analytical micromechanics is presented to simulate the response of textile composites. The novelty of this approach lies in the three scale homogenization/localization framework bridging between the constituent (micro), the fiber tow scale (meso), weave scale (macro), and the global response. The multiscale framework, named Multiscale Generalized Method of Cells (MSGMC), continuously bridges between the micro to the global scale as opposed to approaches that are top-down and bottom-up. This framework is fully generalized and capable of modeling several different weave and braids without reformulation. Particular emphasis in this dissertation is placed on modeling the nonlinearity and failure of both polymer matrix and ceramic matrix composites.
ContributorsLiu, Guang (Author) / Chattopadhyay, Aditi (Thesis advisor) / Mignolet, Marc (Committee member) / Jiang, Hanqing (Committee member) / Li, Jian (Committee member) / Rajadas, John (Committee member) / Arizona State University (Publisher)
Created2011
Description
This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were made of Ti/Pt strips with the thickness 0.12 µm and 0.02 µm. The resistance of the sensing element was measured at approximately 1.6-1.7 kohms;. A linear relation between the resistance and temperature was established over the temperature ranging from 22 degree Celsius to 80 degree Celsius and the temperature coefficient of resistance (TCR) was at approximately 0.12 %/degree Celsius. The first thermal flow sensor was one-dimensional (1-D) flexible shear stress sensor. The structure was sensing element sandwiched by a biocompatible polymer "poly-para-xylylene", also known as Parylene, which provided both insulation of electrodes and flexibility of the sensors. A constant-temperature (CT) circuit was designed as the read out circuit based on 0.6 µm CMOS (Complementary metal-oxide-semiconductor) process. The 1-D shear stress sensor suffered from a large measurement error. Because when the sensor was inserted into blood vessels, it was impossible to mount the sensor to the wall as calibrated in micro fluidic channels. According to the previous simulation work, the shear stress was varying and the sensor itself changed the shear stress distribution. We proposed a three-dimensional (3-D) thermal flow sensor, with three-axis of sensing elements integrated in one sensor. It was in the similar shape as a hexagonal prism with diagonal of 1000 µm. On the top of the sensor, there were five bond pads for external wires over 500 µm thick silicon substrate. In each nonadjacent side surface, there was a bended parylene branch with one sensing element. Based on the unique 3-D structure, the sensor was able to obtain data along three axes. With computational fluid dynamics (CFD) model, it is possible to locate the sensor in the blood vessels and give us a better understanding of shear stress distribution in the presence of time-varying component of blood flow and realize more accurate assessment of intravascular convective heat transfer.
ContributorsTang, Rui (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Pan, George (Committee member) / Arizona State University (Publisher)
Created2011
Description
Structural health management (SHM) is emerging as a vital methodology to help engineers improve the safety and maintainability of critical structures. SHM systems are designed to reliably monitor and test the health and performance of structures in aerospace, civil, and mechanical engineering applications. SHM combines multidisciplinary technologies including sensing, signal processing, pattern recognition, data mining, high fidelity probabilistic progressive damage models, physics based damage models, and regression analysis. Due to the wide application of carbon fiber reinforced composites and their multiscale failure mechanisms, it is necessary to emphasize the research of SHM on composite structures. This research develops a comprehensive framework for the damage detection, localization, quantification, and prediction of the remaining useful life of complex composite structures. To interrogate a composite structure, guided wave propagation is applied to thin structures such as beams and plates. Piezoelectric transducers are selected because of their versatility, which allows them to be used as sensors and actuators. Feature extraction from guided wave signals is critical to demonstrate the presence of damage and estimate the damage locations. Advanced signal processing techniques are employed to extract robust features and information. To provide a better estimate of the damage for accurate life estimation, probabilistic regression analysis is used to obtain a prediction model for the prognosis of complex structures subject to fatigue loading. Special efforts have been applied to the extension of SHM techniques on aerospace and spacecraft structures, such as UAV composite wings and deployable composite boom structures. Necessary modifications of the developed SHM techniques were conducted to meet the unique requirements of the aerospace structures. The developed SHM algorithms are able to accurately detect and quantify impact damages as well as matrix cracking introduced.
ContributorsLiu, Yingtao (Author) / Chattopadhyay, Aditi (Thesis advisor) / Rajadas, John (Committee member) / Dai, Lenore (Committee member) / Papandreou-Suppappola, Antonia (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2012
Description
This thesis focuses on the continued extension, validation, and application of combined thermal-structural reduced order models for nonlinear geometric problems. The first part of the thesis focuses on the determination of the temperature distribution and structural response induced by an oscillating flux on the top surface of a flat panel. This flux is introduced here as a simplified representation of the thermal effects of an oscillating shock on a panel of a supersonic/hypersonic vehicle. Accordingly, a random acoustic excitation is also considered to act on the panel and the level of the thermo-acoustic excitation is assumed to be large enough to induce a nonlinear geometric response of the panel. Both temperature distribution and structural response are determined using recently proposed reduced order models and a complete one way, thermal-structural, coupling is enforced. A steady-state analysis of the thermal problem is first carried out that is then utilized in the structural reduced order model governing equations with and without the acoustic excitation. A detailed validation of the reduced order models is carried out by comparison with a few full finite element (Nastran) computations. The computational expedience of the reduced order models allows a detailed parametric study of the response as a function of the frequency of the oscillating flux. The nature of the corresponding structural ROM equations is seen to be of a Mathieu-type with Duffing nonlinearity (originating from the nonlinear geometric effects) with external harmonic excitation (associated with the thermal moments terms on the panel). A dominant resonance is observed and explained. The second part of the thesis is focused on extending the formulation of the combined thermal-structural reduced order modeling method to include temperature dependent structural properties, more specifically of the elasticity tensor and the coefficient of thermal expansion. These properties were assumed to vary linearly with local temperature and it was found that the linear stiffness coefficients and the "thermal moment" terms then are cubic functions of the temperature generalized coordinates while the quadratic and cubic stiffness coefficients were only linear functions of these coordinates. A first validation of this reduced order modeling strategy was successfully carried out.
ContributorsMatney, Andrew (Author) / Mignolet, Marc (Thesis advisor) / Jiang, Hanqing (Committee member) / Spottswood, Stephen (Committee member) / Arizona State University (Publisher)
Created2011
Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
Description
Soft magnetic materials have been studied extensively in the recent past due to their applications in micro-transformers, micro-inductors, spin dependent memories etc. The unique features of these materials are the high frequency operability and high magnetic anisotropy. High uniaxial anisotropy is one of the most important properties for these materials. There are many methods to achieve high anisotropy energy (Hk) which include sputtering with presence of magnetic field, exchange bias and oblique angle sputtering.
This research project focuses on analyzing different growth techniques of thin films of Cobalt, Zirconium Tantalum Boron (CZTB) and the quality of the films resulted. The measurements include magnetic moment measurements using a Vibrating Sample Magnetometer, electrical measurements using 4 point resistivity methods and structural characterization using Scanning Electron Microscopy. Subtle changes in the growth mechanism result in different properties of these films and they are most suited for certain applications.
The growth methods presented in this research are oblique angled sputtering with localized magnetic field and oblique sputtering without presence of magnetic field. The uniaxial anisotropy can be controlled by changing the angle during sputtering. The resulting film of CZTB is tested for magnetic anisotropy and soft magnetism at room temperature by using Lakeshore 7500 Vibrating Sample Magnetometer. The results are presented, analyzed and explained using characterization techniques. Future work includes magnetic field presence during deposition, magnetic devices of this film with giga hertz range operating frequencies.
This research project focuses on analyzing different growth techniques of thin films of Cobalt, Zirconium Tantalum Boron (CZTB) and the quality of the films resulted. The measurements include magnetic moment measurements using a Vibrating Sample Magnetometer, electrical measurements using 4 point resistivity methods and structural characterization using Scanning Electron Microscopy. Subtle changes in the growth mechanism result in different properties of these films and they are most suited for certain applications.
The growth methods presented in this research are oblique angled sputtering with localized magnetic field and oblique sputtering without presence of magnetic field. The uniaxial anisotropy can be controlled by changing the angle during sputtering. The resulting film of CZTB is tested for magnetic anisotropy and soft magnetism at room temperature by using Lakeshore 7500 Vibrating Sample Magnetometer. The results are presented, analyzed and explained using characterization techniques. Future work includes magnetic field presence during deposition, magnetic devices of this film with giga hertz range operating frequencies.
ContributorsTummalapalli, Sridutt (Author) / Yu, Hongbin (Thesis advisor) / Jiang, Hanqing (Committee member) / Yu, Shimeng (Committee member) / Arizona State University (Publisher)
Created2015