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Description
As the microelectronics industry continues to decrease the size of solder joints, each joint will have to carry a greater current density, making atom diffusion due to current flow, electromigration (EM), a problem of ever-increasing severity. The rate of EM damage depends on current density, operating temperature, and the original

As the microelectronics industry continues to decrease the size of solder joints, each joint will have to carry a greater current density, making atom diffusion due to current flow, electromigration (EM), a problem of ever-increasing severity. The rate of EM damage depends on current density, operating temperature, and the original microstructure of the solder joint, including void volume, grain orientation, and grain size. While numerous studies have investigated the post-mortem effects of EM and have tested a range of current densities and temperatures, none have been able to analyze how the same joint evolves from its initial to final microstructure. This thesis focuses on the study of EM, thermal aging, and thermal cycling in Sn-rich solder joints. Solder joints were either of controlled microstructure and orientation or had trace alloying element additions. Sn grain orientation has been linked to a solder joints’ susceptibility to EM damage, but the precise relationship between orientation and intermetallic (IMC) and void growth has not been deduced. In this research x-ray microtomography was used to nondestructively scan samples and generate 3D reconstructions of both surface and internal features such as interfaces, IMC particles, and voids within a solder joint. Combined with controlled fabrication techniques to create comparable samples and electron backscatter diffraction (EBSD) and energy-dispersive spectroscopy (EDS) analysis for grain orientation and composition analysis, this work shows how grain structure plays a critical role in EM damage and how it differs from damage accrued from thermal effects that occur simultaneously. Unique IMC growth and voiding behaviors are characterized and explained in relation to the solder microstructures that cause their formation and the possible IMC-suppression effects of trace alloying element addition are discussed.
ContributorsBranch Kelly, Marion (Author) / Chawla, Nikhilesh (Thesis advisor) / Ankit, Kumar (Committee member) / Antoniswamy, Aravindha (Committee member) / Arizona State University (Publisher)
Created2019
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Description
Vehicles traverse granular media through complex reactions with large numbers of small particles. Many approaches rely on empirical trends derived from wheeled vehicles in well-characterized media. However, the environments of numerous bodies such as Mars or the moon are primarily composed of fines called regolith which require different design considerations.

Vehicles traverse granular media through complex reactions with large numbers of small particles. Many approaches rely on empirical trends derived from wheeled vehicles in well-characterized media. However, the environments of numerous bodies such as Mars or the moon are primarily composed of fines called regolith which require different design considerations. This dissertation discusses research aimed at understanding the role and function of empirical, computational, and theoretical granular physics approaches as they apply to helical geometries, their envelope of applicability, and the development of new laws. First, a static Archimedes screw submerged in granular material (glass beads) is analyzed using two methods: Granular Resistive Force Theory (RFT), an empirically derived set of equations based on fluid dynamic superposition principles, and Discrete element method (DEM) simulations, a particle modeling software. Dynamic experiments further confirm the computational method with multi-body dynamics (MBD)-DEM co-simulations. Granular Scaling Laws (GSL), a set of physics relationships based on non-dimensional analysis, are utilized for the gravity-modified environments. A testing chamber to contain a lunar analogue, BP-1, is developed and built. An investigation of straight and helical grousered wheels in both silica sand and BP-1 is performed to examine general GSL applicability for lunar purposes. Mechanical power draw and velocity prediction by GSL show non-trivial but predictable deviation. BP-1 properties are characterized and applied to an MBD-DEM environment for the first time. MBD-DEM simulation results between Earth gravity and lunar gravity show good agreement with theoretical predictions for both power and velocity. The experimental deviation is further investigated and found to have a mass-dependant component driven by granular sinkage and engagement. Finally, a robust set of helical granular scaling laws (HGSL) are derived. The granular dynamics scaling of three-dimensional screw-driven mobility is reduced to a similar theory as wheeled scaling laws, provided the screw is radially continuous. The new laws are validated in BP-1 with results showing very close agreement to predictions. A gravity-variant version of these laws is validated with MBD-DEM simulations. The results of the dissertation suggest GSL, HGSL, and MBD-DEM give reasonable approximations for use in lunar environments to predict rover mobility given adequate granular engagement.
ContributorsThoesen, Andrew Lawrence (Author) / Marvi, Hamidreza (Thesis advisor) / Berman, Spring (Committee member) / Emady, Heather (Committee member) / Lee, Hyunglae (Committee member) / Klesh, Andrew (Committee member) / Arizona State University (Publisher)
Created2019
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Description
Traditionally nanoporous gold is created by selective dissolution of silver or copper from a binary silver-gold or copper-gold alloy. These alloys serve as prototypical model systems for a phenomenon referred to as stress-corrosion cracking. Stress-corrosion cracking is the brittle failure of a normally ductile material occurring in a

Traditionally nanoporous gold is created by selective dissolution of silver or copper from a binary silver-gold or copper-gold alloy. These alloys serve as prototypical model systems for a phenomenon referred to as stress-corrosion cracking. Stress-corrosion cracking is the brittle failure of a normally ductile material occurring in a corrosive environment under a tensile stress. Silver-gold can experience this type of brittle fracture for a range of compositions. The corrosion process in this alloy results in a bicontinuous nanoscale morphology composed of gold-rich ligaments and voids often referred to as nanoporous gold. Experiments have shown that monolithic nanoporous gold can sustain high speed cracks which can then be injected into parent-phase alloy. This work compares nanoporous gold created from ordered and disordered copper-gold using digital image analysis and electron backscatter diffraction. Nanoporous gold from both disordered copper-gold and silver-gold, and ordered copper-gold show that grain orientation and shape remain largely unchanged by the dealloying process. Comparing the morphology of the nanoporous gold from ordered and disordered copper-gold with digital image analysis, minimal differences are found between the two and it is concluded that they are not statistically significant. This reveals the robust nature of nanoporous gold morphology against small variations in surface diffusion and parent-phase crystal structure.
Then the corrosion penetration down the grain boundary is compared to the depth of crack injections in polycrystal silver-gold. Based on statistical comparison, the crack-injections penetrate into the parent-phase grain boundary beyond the corrosion-induced porosity. To compare crack injections to stress-corrosion cracking, single crystal silver-gold samples are employed. Due to the cleavage-like nature of the fracture surfaces, electron backscatter diffraction is possible and employed to compare the crystallography of stress-corrosion crack surfaces and crack-injection surfaces. From the crystallographic similarities of these fracture surfaces, it is concluded that stress-corrosion can occur via a series of crack-injection events. This relationship between crack injections and stress corrosion cracking is further examined using electrochemical data from polycrystal silver-gold samples during stress-corrosion cracking. The results support the idea that crack injection is a mechanism for stress-corrosion cracking.
ContributorsKarasz, Erin (Author) / Sieradzki, Karl (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Peralta, Pedro (Committee member) / Rajagopalan, Jagannathan (Committee member) / Arizona State University (Publisher)
Created2020