Matching Items (2)
Description
In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain is a major concern that could affect the performance of the working devices or even lead to the failure of the devices. Therefore strain sensing techniques to create a contour of the strain distribution is desired.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
ContributorsLiang, Hanshuang (Author) / Yu, Hongbin (Thesis advisor) / Poon, Poh Chieh Benny (Committee member) / Jiang, Hanqing (Committee member) / Zhang, Yong-Hang (Committee member) / Arizona State University (Publisher)
Created2014
Description
Energy return in footwear is associated with the damping behavior of midsole foams, which stems from the combination of cellular structure and polymeric material behavior. Recently, traditional ethyl vinyl acetate (EVA) foams have been replaced by BOOST(TM) foams, thereby reducing the energetic cost of running. These are bead foams made from expanded thermoplastic polyurethane (eTPU), which have a multi-scale structure consisting of fused porous beads, at the meso-scale, and thousands of small closed cells within the beads at the micro-scale. Existing predictive models coarsely describe the macroscopic behavior but do not take into account strain localizations and microstructural heterogeneities. Thus, enhancement in material performance and optimization requires a comprehensive understanding of the foam’s cellular structure at all length scales and its influence on mechanical response.
This dissertation focused on characterization and deformation behavior of eTPU bead foams with a unique graded cell structure at the micro and meso-scale. The evolution of the foam structure during compression was studied using a combination of in situ lab scale and synchrotron x-ray tomography using a four-dimensional (4D, deformation + time) approach. A digital volume correlation (DVC) method was developed to elucidate the role of cell structure on local deformation mechanisms. The overall mechanical response was also studied ex situ to probe the effect of cell size distribution on the force-deflection behavior. The radial variation in porosity and ligament thickness profoundly influenced the global mechanical behavior. The correlation of changes in void size and shape helped in identifying potentially weak regions in the microstructure. Strain maps showed the initiation of failure in cell structure and it was found to be influenced by the heterogeneities around the immediate neighbors in a cluster of voids. Poisson’s ratio evaluated from DVC was related to the microstructure of the bead foams. The 4D approach taken here provided an in depth and mechanistic understanding of the material behavior, both at the bead and plate levels, that will be invaluable in designing the next generation of high-performance footwear.
This dissertation focused on characterization and deformation behavior of eTPU bead foams with a unique graded cell structure at the micro and meso-scale. The evolution of the foam structure during compression was studied using a combination of in situ lab scale and synchrotron x-ray tomography using a four-dimensional (4D, deformation + time) approach. A digital volume correlation (DVC) method was developed to elucidate the role of cell structure on local deformation mechanisms. The overall mechanical response was also studied ex situ to probe the effect of cell size distribution on the force-deflection behavior. The radial variation in porosity and ligament thickness profoundly influenced the global mechanical behavior. The correlation of changes in void size and shape helped in identifying potentially weak regions in the microstructure. Strain maps showed the initiation of failure in cell structure and it was found to be influenced by the heterogeneities around the immediate neighbors in a cluster of voids. Poisson’s ratio evaluated from DVC was related to the microstructure of the bead foams. The 4D approach taken here provided an in depth and mechanistic understanding of the material behavior, both at the bead and plate levels, that will be invaluable in designing the next generation of high-performance footwear.
ContributorsSundaram Singaravelu, Arun Sundar (Author) / Chawla, Nikhilesh (Thesis advisor) / Emady, Heather (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2020