Theses and Dissertations
This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students.
Displaying 1 - 10 of 12
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- Creators: Adams, James
Description
Electromigration in metal interconnects is the most pernicious failure mechanism in semiconductor integrated circuits (ICs). Early electromigration investigations were primarily focused on aluminum interconnects for silicon-based ICs. An alternative metallization compatible with gallium arsenide (GaAs) was required in the development of high-powered radio frequency (RF) compound semiconductor devices operating at higher current densities and elevated temperatures. Gold-based metallization was implemented on GaAs devices because it uniquely forms a very low resistance ohmic contact and gold interconnects have superior electrical and thermal conductivity properties. Gold (Au) was also believed to have improved resistance to electromigration due to its higher melting temperature, yet electromigration reliability data on passivated Au interconnects is scarce and inadequate in the literature. Therefore, the objective of this research was to characterize the electromigration lifetimes of passivated Au interconnects under precisely controlled stress conditions with statistically relevant quantities to obtain accurate model parameters essential for extrapolation to normal operational conditions. This research objective was accomplished through measurement of electromigration lifetimes of large quantities of passivated electroplated Au interconnects utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with a current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C avoided electrical overstress and severe Joule-heated temperature gradients. Temperature coefficients of resistance (TCRs) were measured to determine accurate Joule-heated Au interconnect film temperatures. A failure criterion of 50% resistance degradation was selected to prevent thermal runaway and catastrophic metal ruptures that are problematic of open circuit failure tests. Test structure design was optimized to reduce resistance variation and facilitate failure analysis. Characterization of the Au microstructure yielded a median grain size of 0.91 ìm. All Au lifetime distributions followed log-normal distributions and Black's model was found to be applicable. An activation energy of 0.80 ± 0.05 eV was measured from constant current electromigration tests at multiple temperatures. A current density exponent of 1.91 was extracted from multiple current densities at a constant temperature. Electromigration-induced void morphology along with these model parameters indicated grain boundary diffusion is dominant and the void nucleation mechanism controlled the failure time.
ContributorsKilgore, Stephen (Author) / Adams, James (Thesis advisor) / Schroder, Dieter (Thesis advisor) / Krause, Stephen (Committee member) / Gaw, Craig (Committee member) / Arizona State University (Publisher)
Created2013
Description
This report will review the mechanical and microstructural properties of the refractory element rhenium (Re) deposited using Laser Additive Manufacturing (LAM). With useable structural strength over 2200 °C, existing applications up to 2760 °C, very high strength, ductility and chemical resistance, interest in Re is understandable. This study includes data about tensile properties including tensile data up to 1925 °C, fracture modes, fatigue and microstructure including deformation systems and potential applications of that information. The bulk mechanical test data will be correlated with nanoindentation and crystallographic examination. LAM properties are compared to the existing properties found in the literature for other manufacturing processes. The literature indicates that Re has three significant slip systems but also twins as part of its deformation mechanisms. While it follows the hcp metal characteristics for deformation, it has interesting and valuable extremes such as high work hardening, potentially high strength, excellent wear resistance and superior elevated temperature strength. These characteristics are discussed in detail.
ContributorsAdams, Robbie (Author) / Chawla, Nikhilesh (Thesis advisor) / Adams, James (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
Description
In 2022, integrated circuit interconnects will approach 10 nm and the diffusion barrier layers needed to ensure long lasting devices will be at 1 nm. This dimension means the interconnect will be dominated by the interface and it has been shown the interface is currently eroding device performance. The standard interconnect system has three layers - a Copper metal core, a Tantalum Adhesion layer and a Tantalum Nitride Diffusion Barrier Layer. An alternate interconnect schema is a Tantalum Nitride barrier layer and Silver as a metal. The adhesion layer is removed from the system along with changing to an alternate, low resistivity metal. First principles are used to assess the interface of the Silver and Tantalum Nitride. Several stoichiometric 1:1 Tantalum Nitride polymorphs are assessed and it is found that the Fe2P crystal structure is actually the most stable crystal structure which is at odds with the published phase diagram for ambient crystal structure. The surface stability of Fe2P-TaN is assessed and the absorption enthalpy of Silver adatoms is calculated. Finally, the thermodynamic stability of the TaN-Ag interconnect system is assessed.
ContributorsGrumski, Michael (Author) / Adams, James (Thesis advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Arizona State University (Publisher)
Created2012
Description
The goal of the paper was to examine the fatigue mechanisms of polymers and silicone based elastomers. The mechanisms of fatigue due to crazing: the alignment of polymer chains to the stress axis, and shear banding: the localized orientation of the polymer by the shear stresses from two planes, were discussed in depth in this paper. Crazing only occurs in tensile stress, is initiated on the surface of the material, and only occurs in brittle polymers. Crazing also accounts for a 40-60% decrease in density, causing localized weakening of the material and a concentration in stress. This is due to a decrease in effective cross sectional area. The mechanism behind discontinuous growth bands was also discussed to be the cause of cyclic crazing. Shear banding only occurs in ductile polymers and can result in the failure of polymers via necking. Furthermore, the high fatigue resistance of silicone elastomers was discussed in this paper. This conclusion was made because of the lack of fatigue mechanisms (crazing, discontinuous growth bands, and shears banding) in the observed elastomer's microstructure after the samples had undergone fatigue tests. This was done through an analysis of room temperature vulcanized silicone adhesives, a heat-curing silicone elastomer, and a self-curing transparent silicone rubber. Fatigue of room temperature vulcanized silicon was observed, however this was reasoned to be the failure of the adhesion of the elastomer to the steel substrate instead of the microstructure itself. Additionally, the significance of fatigue in real world applications was discussed using SouthWest Airlines Flight 812 as an example.
ContributorsWong, Christopher Stanley (Author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Anwar, Shahriar (Committee member) / Materials Science and Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
Description
Analysis of 4 lesson plans for primary education in which 3D printers are used either to build components or are directly used by students. Provides critique on how proper investment and utilization of this new technology can enrich education and misuse can waste time, money, and even reduce the quality of education.
ContributorsPrzeslica, Michael Cody (Author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2014-05
Description
The transition to lead-free solder in the electronics industry has benefitted the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing. Characterizing the copper oxidation underneath the surface treatment is challenging but necessary for product reliability and failure analysis. Currently, FIB-SEM, which is time-consuming and expensive, is what is used to understand and analyze the surface treatment-copper oxide(s)-copper system. This project's goals were to determine a characterization methodology that cuts both characterization time and cost in half for characterizing copper oxidation beneath a surface treatment and to determine which protective surface treatment is the best as defined by multiple criterion such as cost, sustainability, and reliability. Two protective surface treatments, organic solderability preservative (OSP) and chromium zincate, were investigated, and multiple characterization techniques were researched. Six techniques were tested, and three were deemed promising. Through our studies, it was determined that the best surface treatment was organic solderability preservative (OSP) and the ideal characterization methodology would be using FIB-SEM to calibrate a QCM model, along with using SERA to confirm the QCM model results. The methodology we propose would result in a 91% reduction in characterization cost and a 92% reduction in characterization time. Future work includes further calibration of the QCM model using more FIB/SEM data points and eventually creating a model for oxide layer thickness as a function of exposure time and processing temperature using QCM as the primary data source. In doing my Capstone project for Intel, a large electronics manufacturing company, I feel it is important to remember the effects of our tools and industry on the environment and to consider the product life cycle in terms other than monetary gain and raw material recycling. To this end I will be discussing how lead is and was used in manufacturing, how it is disposed of, and how this effects the environment including plant, animal, and insect life, as well as ground water contamination. Since the ban was enacted several years ago, I will compare how lead-free alternatives currently in use compare in environmental impact and possibly raise the question of whether we have simply traded one evil for another.
ContributorsBranch Kelly, Marion Zoe (Author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2015-05
Description
The financial feasibility of NextPotential's X-doped photocatalyst is uncertain, the outcome depends on how much the material cost becomes reduced due to mass production techniques. If carbon taxes continue on the current trend the photocatalyst is highly likely to become financially feasible. Without carbon taxes, it is still likely the photocatalyst will achieve economical feasibility. The land area required by the photocatalyst is a feasible size. The minimal environmental downsides are that more land will be used and water will be used, but both of these are minimal compared to the benefit of eliminating carbon emissions.
ContributorsMcmullan, Kyle Jonathan (Co-author) / Lahpai, Mun (Co-author) / Donnelly, Connor (Co-author) / Puzhaev, Boris (Co-author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2015-05
Description
The transition to lead-free solder in the electronics industry has benefited the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing. Characterizing the copper oxidation underneath the surface treatment is challenging but necessary for product reliability and failure analysis. Currently, FIB-SEM, which is time-consuming and expensive, is what is used to understand and analyze the surface treatment-copper oxide(s)-copper system. This project's goals were to determine a characterization methodology that cuts both characterization time and cost in half for characterizing copper oxidation beneath a surface treatment and to determine which protective surface treatment is the best as defined by multiple criterion such as cost, sustainability, and reliability. Two protective surface treatments, organic solderability preservative (OSP) and chromium zincate, were investigated, and multiple characterization techniques were researched. Six techniques were tested, and three were deemed promising. Through our studies, it was determined that the best surface treatment was organic solderability preservative (OSP) and the ideal characterization methodology would be using FIB-SEM to calibrate a QCM model, along with using SERA to confirm the QCM model results. The methodology we propose would result in a 91% reduction in characterization cost and a 92% reduction in characterization time. Future work includes further calibration of the QCM model using more FIB/SEM data points and eventually creating a model for oxide layer thickness as a function of exposure time and processing temperature using QCM as the primary data source. An additional short essay on the role of SEM on the continuing miniaturization of integrated circuits is included at the end. This paper explores the intertwined histories of the scanning electron microscope and the integrated circuit, highlighting how advances in SEM influence integrated circuit advances.
ContributorsSmith, Bethany Blair (Co-author) / Marion, Branch Kelly (Co-author) / Cruz, Hernandez (Co-author) / Kimberly, McGuiness (Co-author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2015-05
Description
Graphene has the ability to advance many common fields, including: membranes, composites and coatings, energy, and electronics. For membranes, graphene will be used as a filter for desalination plants which will reduce the cost of desalination and greatly increase water security in developing countries. For composites and coatings, graphene's strength, flexibility, and lightweight will be instrumental in producing the next generation of athletic wear and sports equipment. Graphene's use in energy comes from its theorized ability to charge a phone battery in seconds or an electric car in minutes. Finally, for electronics, graphene will be used to create faster transistors, flexible electronics, and fully integrated wearable technology.
ContributorsSiegel, Adam (Author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Materials Science and Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
A novel approach, the Invariant Based Theory of Composites and the "Trace" method it proposes, has the potential to reduce aerospace composite development times and costs by over 30% thus reinvigorating the development process and encouraging composite technology growth. The "trace" method takes advantage of inherent stiffness properties of laminates, specifically carbon fiber, to make predictions of material properties used to derive design allowables. The advantages of the "trace" theory may not necessarily be specific to the aerospace industry, however many automotive manufacturers are facing environmental, social and political pressure to increase the gas mileage in their vehicles and reduce their carbon footprint. Therefore, the use of lighter materials, such as carbon fiber composites, to replace heavier metals in cars is inevitable yet as of now few auto manufacturers implement composites in their cars. The high material, testing and development costs, much like the aerospace industry, have been prohibitive to widespread use of these materials but progress is being made in overcoming those challenges. The "trace" method, while initially intended for quasi-isotropic, aerospace grade carbon-fiber laminates, still yields reasonable, and correctable, results for types of laminates as well such as with woven fabrics and thermoplastic matrices, much of which are being used in these early stages of automotive composite development. Despite the varying use of materials, the "trace" method could potentially boost automotive composites in a similar way to the aerospace industry by reducing testing time and costs and perhaps even playing a role in establishing emerging simulations of these materials.
ContributorsBrown, William Ross (Author) / Adams, James (Thesis director) / Anwar, Shahriar (Committee member) / Krause, Stephen (Committee member) / Materials Science and Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05