This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students. 

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Description
Fluxgate sensors are magnetic field sensors that can measure DC and low frequency AC magnetic fields. They can measure much lower magnetic fields than other magnetic sensors like Hall effect sensors, magnetoresistive sensors etc. They also have high linearity, high sensitivity and low noise. The major application of fluxgate sensors

Fluxgate sensors are magnetic field sensors that can measure DC and low frequency AC magnetic fields. They can measure much lower magnetic fields than other magnetic sensors like Hall effect sensors, magnetoresistive sensors etc. They also have high linearity, high sensitivity and low noise. The major application of fluxgate sensors is in magnetometers for the measurement of earth's magnetic field. Magnetometers are used in navigation systems and electronic compasses. Fluxgate sensors can also be used to measure high DC currents. Integrated micro-fluxgate sensors have been developed in recent years. These sensors have much lower power consumption and area compared to their PCB counterparts. The output voltage of micro-fluxgate sensors is very low which makes the analog front end more complex and results in an increase in power consumption of the system. In this thesis a new analog front-end circuit for micro-fluxgate sensors is developed. This analog front-end circuit uses charge pump based excitation circuit and phase delay based read-out chain. With these two features the power consumption of analog front-end is reduced. The output is digital and it is immune to amplitude noise at the output of the sensor. Digital output is produced without using an ADC. A SPICE model of micro-fluxgate sensor is used to verify the operation of the analog front-end and the simulation results show very good linearity.
ContributorsPappu, Karthik (Author) / Bakkaloglu, Bertan (Thesis advisor) / Christen, Jennifer Blain (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there

Test cost has become a significant portion of device cost and a bottleneck in high volume manufacturing. Increasing integration density and shrinking feature sizes increased test time/cost and reduce observability. Test engineers have to put a tremendous effort in order to maintain test cost within an acceptable budget. Unfortunately, there is not a single straightforward solution to the problem. Products that are tested have several application domains and distinct customer profiles. Some products are required to operate for long periods of time while others are required to be low cost and optimized for low cost. Multitude of constraints and goals make it impossible to find a single solution that work for all cases. Hence, test development/optimization is typically design/circuit dependent and even process specific. Therefore, test optimization cannot be performed using a single test approach, but necessitates a diversity of approaches. This works aims at addressing test cost minimization and test quality improvement at various levels. In the first chapter of the work, we investigate pre-silicon strategies, such as design for test and pre-silicon statistical simulation optimization. In the second chapter, we investigate efficient post-silicon test strategies, such as adaptive test, adaptive multi-site test, outlier analysis, and process shift detection/tracking.
ContributorsYilmaz, Ender (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012
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Description
The first part describes Metal Semiconductor Field Effect Transistor (MESFET) based fundamental analog building blocks designed and fabricated in a single poly, 3-layer metal digital CMOS technology utilizing fully depletion mode MESFET devices. DC characteristics were measured by varying the power supply from 2.5V to 5.5V. The measured DC transfer

The first part describes Metal Semiconductor Field Effect Transistor (MESFET) based fundamental analog building blocks designed and fabricated in a single poly, 3-layer metal digital CMOS technology utilizing fully depletion mode MESFET devices. DC characteristics were measured by varying the power supply from 2.5V to 5.5V. The measured DC transfer curves of amplifiers show good agreement with the simulated ones with extracted models from the same process. The accuracy of the current mirror showing inverse operation is within ±15% for the current from 0 to 1.5mA with the power supply from 2.5 to 5.5V. The second part presents a low-power image recognition system with a novel MESFET device fabricated on a CMOS substrate. An analog image recognition system with power consumption of 2.4mW/cell and a response time of 6µs is designed, fabricated and characterized. The experimental results verified the accuracy of the extracted SPICE model of SOS MESFETs. The response times of 4µs and 6µs for one by four and one by eight arrays, respectively, are achieved with the line recognition. Each core cell for both arrays consumes only 2.4mW. The last part presents a CMOS low-power transceiver in MICS band is presented. The LNA core has an integrated mixer in a folded configuration. The baseband strip consists of a pseudo differential MOS-C band-pass filter achieving demodulation of 150kHz-offset BFSK signals. The SRO is used in a wakeup RX for the wake-up signal reception. The all digital frequency-locked loop drives a class AB power amplifier in a transmitter. The sensitivity of -85dBm in the wakeup RX is achieved with the power consumption of 320µW and 400µW at the data rates of 100kb/s and 200kb/s from 1.8V, respectively. The sensitivities of -70dBm and -98dBm in the data-link RX are achieved with NF of 40dB and 11dB at the data rate of 100kb/s while consuming only 600µW and 1.5mW at 1.2V and 1.8V, respectively.
ContributorsKim, Sung (Author) / Bakkaloglu, Bertan (Thesis advisor) / Christen, Jennifer Blain (Committee member) / Cao, Yu (Committee member) / Thornton, Trevor (Committee member) / Arizona State University (Publisher)
Created2011
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Description
The front end of almost all ADCs consists of a Sample and Hold Circuit in order to make sure a constant analog value is digitized at the end of ADC. The design of Track and Hold Circuit (THA) mainly focuses on following parameters: Input frequency, Sampling frequency, dynamic Range, hold

The front end of almost all ADCs consists of a Sample and Hold Circuit in order to make sure a constant analog value is digitized at the end of ADC. The design of Track and Hold Circuit (THA) mainly focuses on following parameters: Input frequency, Sampling frequency, dynamic Range, hold pedestal, feed through error. This thesis will discuss the importance of these parameters of a THA to the ADCs and commonly used architectures of THA. A new architecture with SiGe HBT transistors in BiCMOS 130 nm technology is presented here. The proposed topology without complicated circuitry achieves high Spurious Free Dynamic Range(SFDR) and Total Harmonic Distortion (THD).These are important figure of merits for any THA which gives a measure of non-linearity of the circuit. The proposed topology is implemented in IBM8HP 130 nm BiCMOS process combines typical emitter follower switch in bipolar THAs and output steering technique proposed in the previous work. With these techniques and the cascode transistor in the input which is used to isolate the switch from the input during the hold mode, better results have been achieved. The THA is designed to work with maximum input frequency of 250 MHz at sampling frequency of 500 MHz with input currents not more than 5mA achieving an SFDR of 78.49 dB. Simulation and results are presented, illustrating the advantages and trade-offs of the proposed topology.
ContributorsRao, Nishita Ramakrishna (Author) / Barnaby, Hugh (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012
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Description
ABSTRACT As the technology length shrinks down, achieving higher gain is becoming very difficult in deep sub-micron technologies. As the supply voltages drop, cascodes are very difficult to implement and cascade amplifiers are needed to achieve sufficient gain with required output swing. This sets the fundamental limit on the SNR

ABSTRACT As the technology length shrinks down, achieving higher gain is becoming very difficult in deep sub-micron technologies. As the supply voltages drop, cascodes are very difficult to implement and cascade amplifiers are needed to achieve sufficient gain with required output swing. This sets the fundamental limit on the SNR and hence the maximum resolution that can be achieved by ADC. With the RSD algorithm and the range overlap, the sub ADC can tolerate large comparator offsets leaving the linearity and accuracy requirement for the DAC and residue gain stage. Typically, the multiplying DAC requires high gain wide bandwidth op-amp and the design of this high gain op-amp becomes challenging in the deep submicron technologies. This work presents `A 12 bit 25MSPS 1.2V pipelined ADC using split CLS technique' in IBM 130nm 8HP process using only CMOS devices for the application of Large Hadron Collider (LHC). CLS technique relaxes the gain requirement of op-amp and improves the signal-to-noise ratio without increase in power or input sampling capacitor with rail-to-rail swing. An op-amp sharing technique has been incorporated with split CLS technique which decreases the number of op-amps and hence the power further. Entire pipelined converter has been implemented as six 2.5 bit RSD stages and hence decreases the latency associated with the pipelined architecture - one of the main requirements for LHC along with the power requirement. Two different OTAs have been designed to use in the split-CLS technique. Bootstrap switches and pass gate switches are used in the circuit along with a low power dynamic kick-back compensated comparator.
ContributorsSwaminathan, Visu Vaithiyanathan (Author) / Barnaby, Hugh (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012