This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students. 

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Electromigration, the net atomic diffusion associated with the momentum transfer from electrons moving through a material, is a major cause of device and component failure in microelectronics. The deleterious effects from electromigration rise with increased current density, a parameter that will only continue to increase as our electronic devices get

Electromigration, the net atomic diffusion associated with the momentum transfer from electrons moving through a material, is a major cause of device and component failure in microelectronics. The deleterious effects from electromigration rise with increased current density, a parameter that will only continue to increase as our electronic devices get smaller and more compact. Understanding the dynamic diffusional pathways and mechanisms of these electromigration-induced and propagated defects can further our attempts at mitigating these failure modes. This dissertation provides insight into the relationships between these defects and parameters of electric field strength, grain boundary misorientation, grain size, void size, eigenstrain, varied atomic mobilities, and microstructure.First, an existing phase-field model was modified to investigate the various defect modes associated with electromigration in an equiaxed non-columnar microstructure. Of specific interest was the effect of grain boundary misalignment with respect to current flow and the mechanisms responsible for the changes in defect kinetics. Grain size, magnitude of externally applied electric field, and the utilization of locally distinct atomic mobilities were other parameters investigated. Networks of randomly distributed grains, a common microstructure of interconnects, were simulated in both 2- and 3-dimensions displaying the effects of 3-D capillarity on diffusional dynamics. Also, a numerical model was developed to study the effect of electromigration on void migration and coalescence. Void migration rates were found to be slowed from compressive forces and the nature of the deformation concurrent with migration was examined through the lens of chemical potential. Void migration was also validated with previously reported theoretical explanations. Void coalescence and void budding were investigated and found to be dependent on the magnitude of interfacial energy and electric field strength. A grasp on the mechanistic pathways of electromigration-induced defect evolution is imperative to the development of reliable electronics, especially as electronic devices continue to miniaturize. This dissertation displays a working understanding of the mechanistic pathways interconnects can fail due to electromigration, as well as provide direction for future research and understanding.
ContributorsFarmer, William McHann (Author) / Ankit, Kumar (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Jiao, Yang (Committee member) / McCue, Ian (Committee member) / Arizona State University (Publisher)
Created2022
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Description
Semantic image segmentation has been a key topic in applications involving image processing and computer vision. Owing to the success and continuous research in the field of deep learning, there have been plenty of deep learning-based segmentation architectures that have been designed for various tasks. In this thesis, deep-learning architectures

Semantic image segmentation has been a key topic in applications involving image processing and computer vision. Owing to the success and continuous research in the field of deep learning, there have been plenty of deep learning-based segmentation architectures that have been designed for various tasks. In this thesis, deep-learning architectures for a specific application in material science; namely the segmentation process for the non-destructive study of the microstructure of Aluminum Alloy AA 7075 have been developed. This process requires the use of various imaging tools and methodologies to obtain the ground-truth information. The image dataset obtained using Transmission X-ray microscopy (TXM) consists of raw 2D image specimens captured from the projections at every beam scan. The segmented 2D ground-truth images are obtained by applying reconstruction and filtering algorithms before using a scientific visualization tool for segmentation. These images represent the corrosive behavior caused by the precipitates and inclusions particles on the Aluminum AA 7075 alloy. The study of the tools that work best for X-ray microscopy-based imaging is still in its early stages.

In this thesis, the underlying concepts behind Convolutional Neural Networks (CNNs) and state-of-the-art Semantic Segmentation architectures have been discussed in detail. The data generation and pre-processing process applied to the AA 7075 Data have also been described, along with the experimentation methodologies performed on the baseline and four other state-of-the-art Segmentation architectures that predict the segmented boundaries from the raw 2D images. A performance analysis based on various factors to decide the best techniques and tools to apply Semantic image segmentation for X-ray microscopy-based imaging was also conducted.
ContributorsBarboza, Daniel (Author) / Turaga, Pavan (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Jayasuriya, Suren (Committee member) / Arizona State University (Publisher)
Created2020