Theses and Dissertations
This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students.
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- Creators: Jiang, Hanqing
Description
Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material, manufacturing process, use condition, as well as, the inherent variabilities present in the system, greatly influence product reliability. Accurate reliability analysis requires an integrated approach to concurrently account for all these factors and their synergistic effects. Such an integrated and robust methodology can be used in design and development of new and advanced microelectronics systems and can provide significant improvement in cycle-time, cost, and reliability. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks of (1) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, (2) Finite Element analysis (FEM) to predict system response needed for life prediction, and (3) development of a probabilistic methodology to predict the reliability, as well as, the sensitivity of the system to various parameters and the variabilities. These tasks and the predictive capabilities of IMPRPK in microelectronic reliability analysis are discussed.
ContributorsFallah-Adl, Ali (Author) / Tasooji, Amaneh (Thesis advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Jiang, Hanqing (Committee member) / Mahajan, Ravi (Committee member) / Arizona State University (Publisher)
Created2013
Description
In the last several years, there has been a significant growth in research in the field of power harvesting, the process of capturing the energy surrounding a system and converting it into usable electrical energy. This concept has received particular interest in recent years with the ever-increasing production of portable and wireless electronic devices. Many of these devices that are currently in production utilize electrochemical batteries as a power source, which while effective, maintain the drawback of having a finite energy supply, thus requiring periodic replacement. The concept of power harvesting, however, works to solve these issues through electronics that are designed to capture ambient energy surrounding them convert it into usable electronic energy. The use of power harvesting in energy scavenging devices allows for the possible development of devices that are self-powered and do not require their power sources to be replaced. Several models have been developed by Soldano et al [3] and Liao et al [2] that have been proven accurate at predicting the power output of a piezoelectric power harvester in a cantileaver beam configuration. The work in this paper will expand further on the model developed by Liao et al [2], and as its main goal will use a modified form of that model to predict the optimal dimensions for a beam power harvester to achieve the maximum power output possible. The model will be updated b replacing the mode shape function used to approximate the deflection of the beam with the true defletion, which is based on the complex wavenumber that incorporates the complex Young's modulus of the material used. Other changes to account for this replacement will also be presented, along with numerical results of the final model.
ContributorsWinterstein, Joshua (Author) / Liao, Yabin (Thesis director) / Jiang, Hanqing (Committee member) / Chen, Kangping (Committee member) / Barrett, The Honors College (Contributor)
Created2012-05
Description
ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been applied in multiple areas. This study discussed the possibility of applying nanofiber in heat pipe as new wick structure. In this study, a needleless electrospinning device with high productivity rate was built onsite to systematically investigate the effect of processing parameters on fiber properties as well as to generate nanofiber mat to evaluate its capability in electronics cooling. Polyethylene oxide (PEO) and Polyvinyl Alcohol (PVA) nanofibers were generated. Tensiometer was used for wettability measurement. The results show that independent parameters including spinneret type, working distance, solution concentration and polymer type are strongly correlated with fiber morphology compared to other parameters. The results also show that the fabricated nanofiber mat has high capillary pressure.
ContributorsSun, Tianwei (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongyu (Committee member) / Chen, Kangping (Committee member) / Arizona State University (Publisher)
Created2014