Theses and dissertations

This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students. 

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Mechanical and Thermal Properties of Copper Slag Concrete

Description
In this investigation, copper slag was used as a coarse aggregate in four different mixes of concrete, consisting of 0%, 25%, 50%, and 100% copper slag by volume. Locally available Salt river aggregate was used as a control, and mixes were tested for density, strength, thermal conductivity, specific heat capacity,…

In this investigation, copper slag was used as a coarse aggregate in four different mixes of concrete, consisting of 0%, 25%, 50%, and 100% copper slag by volume. Locally available Salt river aggregate was used as a control, and mixes were tested for density, strength, thermal conductivity, specific heat capacity, and thermal diffusivity. Density was shown to increase with increasing copper slag content, increasing an average of 2298 kg/m^3, 2522 kg/m^3, and 2652 kg/m^3 in the 25%, 50%, and 100% mixes. This represents a 15% increase in density from 0% to 100%. Compressive strength testing indicated that the presence of copper slag in concrete provides no definitive strength benefit over Salt River aggregate. This result was expected, as concrete's strength is primarily derived from the cement matrix and not the aggregate. Thermal conductivity showed a decreasing trend with increasing copper slag content. Th control mix had an average conductivity of 0.660 W/m*K, and the 25%, 50%, and 100% mixes had conductivities of 0.649 W/m*K, 0.647 W/m*K, and 0.519 W/m*K, respectively. This represents 21% drop in thermal conductivity over the control. This result was also expected, as materials formed at higher temperatures, like copper slag, tend to have lower thermal conductivities. Specific heat capacity testing yielded results that were statistically indeterminate, though unlike strength testing this arose from inaccurate assumptions made during testing. This also prevented accurate thermal diffusivity results, as diffusivity is a function of density, thermal conductivity, and specific heat capacity. However, given the trends of the first two parameters, it is plausible to say that diffusivity in copper slag concrete would be lower than that of the control ix. All of these results were plugged into ASU's Pavement Temperature Model to see what effect they had in mitigating the UHI effect.
ContributorsLaughlin, Colin (Author) / Kaloush, Kamil (Thesis director) / Phelan, Patrick (Committee member) / Witczak, Kenneth (Committee member) / Barrett, The Honors College (Contributor)
Created2012-05
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Design and Additive Manufacturing of Copper Heat Sinks for Microelectronics Cooling

Description
Thermal management is a critical aspect of microelectronics packaging and often centers around preventing central processing units (CPUs) and graphics processing units (GPUs) from overheating. As the need for power going into these processors increases, so too does the need for more effective thermal management strategies. One such strategy is…

Thermal management is a critical aspect of microelectronics packaging and often centers around preventing central processing units (CPUs) and graphics processing units (GPUs) from overheating. As the need for power going into these processors increases, so too does the need for more effective thermal management strategies. One such strategy is to utilize additive manufacturing to fabricate heat sinks with bio-inspired and cellular structures and is the focus of this thesis. In this study, a process was developed for manufacturing the copper alloy CuNi2SiCr on the 100w Concept Laser Mlab laser powder bed fusion 3D printer to obtain parts that were 94% dense, while dealing with challenges of low absorptivity in copper and its high potential for oxidation. The developed process was then used to manufacture and test heat sinks with traditional pin and fin designs to establish a baseline cooling effect, as determined from tests conducted on a substrate, CPU and heat spreader assembly. Two additional heat sinks were designed, the first of these being bio-inspired and the second incorporating Triply Periodic Minimal Surface (TPMS) cellular structures, with the aim of trying to improve the cooling effect relative to commercial heat sinks. The results showed that the pure copper commercial pin-design heat sink outperformed the additive manufactured (AM) pin-design heat sink under both natural and forced convection conditions due to its approximately tenfold higher thermal conductivity, but that the gap in performance could be bridged using the bio-inspired and Schwarz-P heat sink designs developed in this work and is an encouraging indicator that further improvements could be obtained with improved alloys, heat treatments and even more innovative designs.
ContributorsYaple, Jordan Marie (Author) / Bhate, Dhruv (Thesis advisor) / Azeredo, Bruno (Committee member) / Phelan, Patrick (Committee member) / Arizona State University (Publisher)
Created2021