Theses and Dissertations
This collection includes both ASU Theses and Dissertations, submitted by graduate students, and the Barrett, Honors College theses submitted by undergraduate students.
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Description
Nanolaminate composite materials consist of alternating layers of materials at the nanoscale (≤100 nm). Due to the nanometer scale thickness of their layers, these materials display unique and tailorable properties. This enables us to alter both mechanical attributes such as strength and wear properties, as well as functional characteristics such as biocompatibility, optical, and electronic properties. This dissertation focuses on understanding the mechanical behavior of the Al-SiC system. From a practical perspective, these materials exhibit a combination of high toughness and strength which is attractive for many applications. Scientifically, these materials are interesting due to the large elastic modulus mismatch between the layers. This, paired with the small layer thickness, allows a unique opportunity for scientists to study the plastic deformation of metals under extreme amounts of constraint.
Previous studies are limited in scope and a more diverse range of mechanical characterization is required to understand both the advantages and limitations of these materials. One of the major challenges with testing these materials is that they are only able to be made in thicknesses on the order of micrometers so the testing methods are limited to small volume techniques. This work makes use of both microscale testing techniques from the literature as well as novel methodologies. Using these techniques we are able to gain insight into aspects of the material’s mechanical behavior such as the effects of layer orientation, flaw dependent fracture, tension-compression asymmetry, fracture toughness as a function of layer thickness, and shear behavior as a function of layer thickness.
Previous studies are limited in scope and a more diverse range of mechanical characterization is required to understand both the advantages and limitations of these materials. One of the major challenges with testing these materials is that they are only able to be made in thicknesses on the order of micrometers so the testing methods are limited to small volume techniques. This work makes use of both microscale testing techniques from the literature as well as novel methodologies. Using these techniques we are able to gain insight into aspects of the material’s mechanical behavior such as the effects of layer orientation, flaw dependent fracture, tension-compression asymmetry, fracture toughness as a function of layer thickness, and shear behavior as a function of layer thickness.
ContributorsMayer, Carl Randolph (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiang, Hanqing (Committee member) / Molina-Aldareguia, Jon (Committee member) / Rajagopalan, Jagannathan (Committee member) / Arizona State University (Publisher)
Created2016
Description
Flexible conducting materials have been in the forefront of a rapidly transforming electronics industry, focusing on wearable devices for a variety of applications in recent times. Over the past few decades, bulky, rigid devices have been replaced with a surging demand for thin, flexible, light weight, ultra-portable yet high performance electronics. The interconnects available in the market today only satisfy a few of the desirable characteristics, making it necessary to compromise one feature over another. In this thesis, a method to prepare a thin, flexible, and stretchable inter-connect is presented with improved conductivity compared to previous achievements. It satisfies most mechanical and electrical conditions desired in the wearable electronics industry. The conducting composite, prepared with the widely available, low cost silicon-based organic polymer - polydimethylsiloxane (PDMS) and silver (Ag), is sandwiched between two cured PDMS layers. These protective layers improve the mechanical stability of the inter-connect. The structure can be stretched up to 120% of its original length which can further be enhanced to over 250% by cutting it into a serpentine shape without compromising its electrical stability. The inter-connect, around 500 µm thick, can be integrated into thin electronic packaging. The synthesis process of the composite material, along with its electrical and mechanical and properties are presented in detail. Testing methods and results for mechanical and electrical stability are also illustrated over extensive flexing and stretching cycles. The materials put into test, along with conductive silver (Ag) - polydimethylsiloxane (PDMS) composite in a sandwich structure, are copper foils, copper coated polyimide (PI) and aluminum (Al) coated polyethylene terephthalate (PET).
ContributorsNandy, Mayukh (Author) / Yu, Hongbin (Thesis advisor) / Chan, Candace (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2020