Matching Items (4)
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- All Subjects: Thermal conductivity
- Creators: Wang, Robert
- Resource Type: Text
Description
The thermal conductivity of cadmium sulfide (CdS) colloidal nanocrystals (NCs) and magic-sized clusters (MSCs) have been investigated in this work. It is well documented in the literature that the thermal conductivity of colloidal nanocrystal assemblies decreases as diameter decreases. However, the extrapolation of this size dependence does not apply to magic-sized clusters. Magic-sized clusters have an anomalously high thermal conductivity relative to the extrapolated size-dependence trend line for the colloidal nanocrystals. This anomalously high thermal conductivity could probably result from the monodispersity of magic-sized clusters. To support this conjecture, a method of deliberately eliminating the monodispersity of MSCs by mixing them with colloidal nanocrystals was performed. Experiment results showed that mixtures of nanocrystals and MSCs have a lower thermal conductivity that falls approximately on the extrapolated trendline for colloidal nanocrystal thermal conductivity as a function of size.
ContributorsSun, Ming-Hsien (Author) / Wang, Robert (Thesis advisor) / Rykaczewski, Konrad (Committee member) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2022
Description
Thermal management of electronics is critical to meet the increasing demand for high power and performance. Thermal interface materials (TIMs) play a key role in dissipating heat away from the microelectronic chip and hence are a crucial component in electronics cooling. Challenges persist with overcoming the interfacial boundary resistance and filler particle connectivity in TIMs to achieve thermal percolation while maintaining mechanical compliance. Gallium-based liquid metal (LM) capsules offer a unique set of thermal-mechanical characteristics that make them suitable candidates for high-performance TIM fillers. This dissertation research focuses on resolving the fundamental challenges posed by integration of LM fillers in polymer matrix. First, the rupture mechanics of LM capsules under pressure is identified as a key factor that dictates the thermal connectivity between LM-based fillers. This mechanism of oxide “popping” in LM particle beds independent of the matrix material provides insights in overcoming the particle-particle connectivity challenges. Second, the physical barrier introduced due to the polymer matrix needs to be overcome to achieve thermal percolation. Matrix fluid viscosity impacts thermal transport, with high viscosity uncured matrix inhibiting the thermal bridging of fillers. In addition, incorporation of solid metal co-fillers that react with LM fillers is adopted to facilitate popping of LM oxide in uncured polymer to overcome this matrix barrier. Solid silver metal additives are used to rupture the LM oxide, form inter-metallic alloy (IMC), and act as thermal anchors within the matrix. This results in the formation of numerous thermal percolation paths and hence enhances heat transport within the composite. Further, preserving this microstructure of interconnected multiphase filler system with thermally conductive percolation pathways in a cured polymer matrix is critical to designing high-performing TIM pads. Viscosity of the precursor polymer solution prior to curing plays a major role in the resulting thermal conductivity. A multipronged strategy is developed that synergistically combines reactive solid and liquid fillers, a polymer matrix with low pre-cure viscosity, and mechanical compression during thermal curing. The results of this dissertation aim to provide fundamental insights into the integration of LMs in polymer composites and give design knobs to develop high thermally conducting soft composites.
ContributorsUppal, Aastha (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert (Thesis advisor) / Kwon, Beomjin (Committee member) / Choksi, Gaurang (Committee member) / Phelan, Patrick (Committee member) / Arizona State University (Publisher)
Created2022
Description
When air is supplied to a conditioned space, the temperature and humidity of the air often contribute to the comfort and health of the occupants within the space. However, the vapor compression system, which is the standard air conditioning configuration, requires air to reach the dew point for dehumidification to occur, which can decrease system efficiency and longevity in low temperature applications.
To improve performance, some systems dehumidify the air before cooling. One common dehumidifier is the desiccant wheel, in which solid desiccant absorbs moisture out of the air while rotating through circular housing. This system improves performance, especially when the desiccant is regenerated with waste or solar heat; however, the heat of regeneration is very large, as the water absorbed during dehumidification must be evaporated. N-isopropylacrylamide (NIPAAm), a sorbent that oozes water when raised above a certain temperature, could potentially replace traditional desiccants in dehumidifiers. The heat of regeneration for NIPAAm consists of some sensible heat to bring the sorbent to the regeneration temperature, plus some latent heat to offset any liquid water that is evaporated as it is exuded from the NIPAAm. This means the NIPAAm regeneration heat has the potential to be much lower than that of a traditional desiccant.
Models were created for a standard vapor compression air conditioning system, two desiccant systems, and two theoretical NIPAAm systems. All components were modeled for simplified steady state operation. For a moderate percent of water evaporated during regeneration, it was found that the NIPAAm systems perform better than standard vapor compression. When compared to the desiccant systems, the NIPAAm systems performed better at almost all percent evaporation values. The regeneration heat was modeled as if supplied by an electric heater. If a cheaper heat source were utilized, the case for NIPAAm would be even stronger.
Future work on NIPAAm dehumidification should focus on lowering the percent evaporation from the 67% value found in literature. Additionally, the NIPAAm cannot exceed the lower critical solution temperature during dehumidification, indicating that a NIPAAm dehumidification system should be carefully designed such that the sorbent temperature is kept sufficiently low during dehumidification.
To improve performance, some systems dehumidify the air before cooling. One common dehumidifier is the desiccant wheel, in which solid desiccant absorbs moisture out of the air while rotating through circular housing. This system improves performance, especially when the desiccant is regenerated with waste or solar heat; however, the heat of regeneration is very large, as the water absorbed during dehumidification must be evaporated. N-isopropylacrylamide (NIPAAm), a sorbent that oozes water when raised above a certain temperature, could potentially replace traditional desiccants in dehumidifiers. The heat of regeneration for NIPAAm consists of some sensible heat to bring the sorbent to the regeneration temperature, plus some latent heat to offset any liquid water that is evaporated as it is exuded from the NIPAAm. This means the NIPAAm regeneration heat has the potential to be much lower than that of a traditional desiccant.
Models were created for a standard vapor compression air conditioning system, two desiccant systems, and two theoretical NIPAAm systems. All components were modeled for simplified steady state operation. For a moderate percent of water evaporated during regeneration, it was found that the NIPAAm systems perform better than standard vapor compression. When compared to the desiccant systems, the NIPAAm systems performed better at almost all percent evaporation values. The regeneration heat was modeled as if supplied by an electric heater. If a cheaper heat source were utilized, the case for NIPAAm would be even stronger.
Future work on NIPAAm dehumidification should focus on lowering the percent evaporation from the 67% value found in literature. Additionally, the NIPAAm cannot exceed the lower critical solution temperature during dehumidification, indicating that a NIPAAm dehumidification system should be carefully designed such that the sorbent temperature is kept sufficiently low during dehumidification.
ContributorsKocher, Jordan Daniel (Author) / Wang, Robert (Thesis advisor) / Phelan, Patrick (Committee member) / Parrish, Kristen (Committee member) / Arizona State University (Publisher)
Created2019
Description
Nanostructured materials show signicant enhancement in the thermoelectric g-
ure of merit (zT) due to quantum connement eects. Improving the eciency of
thermoelectric devices allows for the development of better, more economical waste
heat recovery systems. Such systems may be used as bottoming or co-generation
cycles in conjunction with conventional power cycles to recover some of the wasted
heat. Thermal conductivity measurement systems are an important part of the char-
acterization processes of thermoelectric materials. These systems must possess the
capability of accurately measuring the thermal conductivity of both bulk and thin-lm
samples at dierent ambient temperatures.
This paper discusses the construction, validation, and improvement of a thermal
conductivity measurement platform based on the 3-Omega technique. Room temperature
measurements of thermal conductivity done on control samples with known properties
such as undoped bulk silicon (Si), bulk gallium arsenide (GaAs), and silicon dioxide
(SiO2) thin lms yielded 150 W=m􀀀K, 50 W=m􀀀K, and 1:46 W=m􀀀K respectively.
These quantities were all within 8% of literature values. In addition, the thermal
conductivity of bulk SiO2 was measured as a function of temperature in a Helium-
4 cryostat from 75K to 250K. The results showed good agreement with literature
values that all fell within the error range of each measurement. The uncertainty in
the measurements ranged from 19% at 75K to 30% at 250K. Finally, the system
was used to measure the room temperature thermal conductivity of a nanocomposite
composed of cadmium selenide, CdSe, nanocrystals in an indium selenide, In2Se3,
matrix as a function of the concentration of In2Se3. The observed trend was in
qualitative agreement with the expected behavior.
i
ure of merit (zT) due to quantum connement eects. Improving the eciency of
thermoelectric devices allows for the development of better, more economical waste
heat recovery systems. Such systems may be used as bottoming or co-generation
cycles in conjunction with conventional power cycles to recover some of the wasted
heat. Thermal conductivity measurement systems are an important part of the char-
acterization processes of thermoelectric materials. These systems must possess the
capability of accurately measuring the thermal conductivity of both bulk and thin-lm
samples at dierent ambient temperatures.
This paper discusses the construction, validation, and improvement of a thermal
conductivity measurement platform based on the 3-Omega technique. Room temperature
measurements of thermal conductivity done on control samples with known properties
such as undoped bulk silicon (Si), bulk gallium arsenide (GaAs), and silicon dioxide
(SiO2) thin lms yielded 150 W=m􀀀K, 50 W=m􀀀K, and 1:46 W=m􀀀K respectively.
These quantities were all within 8% of literature values. In addition, the thermal
conductivity of bulk SiO2 was measured as a function of temperature in a Helium-
4 cryostat from 75K to 250K. The results showed good agreement with literature
values that all fell within the error range of each measurement. The uncertainty in
the measurements ranged from 19% at 75K to 30% at 250K. Finally, the system
was used to measure the room temperature thermal conductivity of a nanocomposite
composed of cadmium selenide, CdSe, nanocrystals in an indium selenide, In2Se3,
matrix as a function of the concentration of In2Se3. The observed trend was in
qualitative agreement with the expected behavior.
i
ContributorsJaber, Abbas (Author) / Wang, Robert (Thesis advisor) / Wang, Liping (Committee member) / Rykaczewski, Konrad (Committee member) / Arizona State University (Publisher)
Created2014