Matching Items (3)
Description
Semiconductor devices are generally analyzed with relatively simple equations or with detailed computer simulations. Most text-books use these simple equations and show device diagrams that are frequently very simplified and occasionally incorrect. For example, the carrier densities near the pinch-off point in MOSFETs and JFETs and the minority carrier density in the base near the reverse-biased base-collector junction are frequently assumed to be zero or near zero. Also the channel thickness at the pinch-off point is often shown to approach zero. None of these assumptions can be correct. The research in thesis addresses these points. I simulated the carrier densities, potentials, electric fields etc. of MOSFETs, BJTs and JFETs at and near the pinch-off regions to determine exactly what happens there. I also simulated the behavior of the quasi-Fermi levels. For MOSFETs, the channel thickness expands slightly before the pinch-off point and then spreads out quickly in a triangular shape and the space-charge region under the channel actually shrinks as the potential increases from source to drain. For BJTs, with collector-base junction reverse biased, most minority carriers diffuse through the base from emitter to collector very fast, but the minority carrier concentration at the collector-base space-charge region is not zero. For JFETs, the boundaries of the space-charge region are difficult to determine, the channel does not disappear after pinch off, the shape of channel is always tapered, and the carrier concentration in the channel decreases progressively. After simulating traditional sized devices, I also simulated typical nano-scaled devices and show that they behave similarly to large devices. These simulation results provide a more complete understanding of device physics and device operation in those regions usually not addressed in semiconductor device physics books.
ContributorsYang, Xuan (Author) / Schroder, Dieter K. (Thesis advisor) / Vasileska, Dragica (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2011
Description
The scaling of transistors has numerous advantages such as increased memory density, less power consumption and better performance; but on the other hand, they also give rise to many reliability issues. One of the major reliability issue is the hot carrier injection and the effect it has on device degradation over time which causes serious circuit malfunctions.
Hot carrier injection has been studied from early 1980's and a lot of research has been done on the various hot carrier injection mechanisms and how the devices get damaged due to this effect. However, most of the existing hot carrier degradation models do not consider the physics involved in the degradation process and they just calculate the change in threshold voltage for different stress voltages and time. Based on this, an analytical expression is formulated that predicts the device lifetime.
This thesis starts by discussing various hot carrier injection mechanisms and the effects it has on the device. Studies have shown charges getting trapped in gate oxide and interface trap generation are two mechanisms for device degradation. How various device parameters get affected due to these traps is discussed here. The physics based models such as lucky hot electron model and substrate current model are presented and gives an idea how the gate current and substrate current can be related to hot carrier injection and density of traps created.
Devices are stressed under various voltages and from the experimental data obtained, the density of trapped charges and interface traps are calculated using mid-gap technique. In this thesis, a simple analytical model based on substrate current is used to calculate the density of trapped charges in oxide and interface traps generated and it is a function of stress voltage and stress time. The model is verified against the data and the TCAD simulations. Finally, the analytical model is incorporated in a Verilog-A model and based on the surface potential method, the threshold voltage shift due to hot carrier stress is calculated.
Hot carrier injection has been studied from early 1980's and a lot of research has been done on the various hot carrier injection mechanisms and how the devices get damaged due to this effect. However, most of the existing hot carrier degradation models do not consider the physics involved in the degradation process and they just calculate the change in threshold voltage for different stress voltages and time. Based on this, an analytical expression is formulated that predicts the device lifetime.
This thesis starts by discussing various hot carrier injection mechanisms and the effects it has on the device. Studies have shown charges getting trapped in gate oxide and interface trap generation are two mechanisms for device degradation. How various device parameters get affected due to these traps is discussed here. The physics based models such as lucky hot electron model and substrate current model are presented and gives an idea how the gate current and substrate current can be related to hot carrier injection and density of traps created.
Devices are stressed under various voltages and from the experimental data obtained, the density of trapped charges and interface traps are calculated using mid-gap technique. In this thesis, a simple analytical model based on substrate current is used to calculate the density of trapped charges in oxide and interface traps generated and it is a function of stress voltage and stress time. The model is verified against the data and the TCAD simulations. Finally, the analytical model is incorporated in a Verilog-A model and based on the surface potential method, the threshold voltage shift due to hot carrier stress is calculated.
ContributorsMuthuseenu, Kiraneswar (Author) / Barnaby, Hugh (Thesis advisor) / Kozicki, Michael (Committee member) / Velo, Yago Gonzalez (Committee member) / Arizona State University (Publisher)
Created2017
Description
The existing compact models can reproduce the characteristics of MOSFETs in the temperature range of -40oC to 125oC. Some applications require circuits to operate over a wide temperature range consisting of temperatures below the specified range of existing compact models, requiring wide temperature range compact models for the design of such circuits. In order to develop wide temperature range compact models, fourteen different geometries of n-channel and p-channel MOSFETs manufactured in a 0.18μm mixed-signal process were electrically characterized over a temperature range of 40 K to 298 K. Electrical characterization included ID-VG and ID-VD under different drain, body and gate biases respectively. The effects of low-temperature operation on the performance of 0.18μm MOSFETs have been studied and discussed in terms of sub-threshold characteristics, threshold voltage, the effect of the body bias and linearity of the device. As it is well understood, the subthreshold slope, the threshold voltage, drive currents of the MOSFETs increase when the temperature of the MOSFETs is lowered, which makes it advantageous to operate the MOSFETs at low-temperatures. However the internal linearity gm1/gm3 of the MOSFETs degrades as the temperature of the MOSFETs is lowered, and the performance of the MOSFETs can be affected by the interface traps that exist in higher density close to conduction band and valence band energy levels, as the Fermi-level moves closer to bandgap edges when MOSFETs are operated at cryogenic temperatures.
ContributorsKathuria, Achal (Author) / Barnaby, Hugh (Thesis advisor) / Schroder, Dieter K. (Committee member) / Vermeire, Bert (Committee member) / Arizona State University (Publisher)
Created2010