Due to the vast increase in processing power and energy usage in computing, a need for greater heat dissipation is prevalent. With numerous applications demanding cheaper and more efficient options for thermal management, new technology must be employed. Through the use of additive manufacturing, designs and structures can be created that were not physically possible before without extensive costs. The goal is to design a system that utilizes capillary action, which is the ability for liquids to flow through narrow spaces unassisted. The level of detail required may be achieved with direct metal laser sintering (DMLS) and stereolithography (SLA) 3D printing.