Matching Items (30)
Filtering by
- All Subjects: Mechanical Engineering
- Creators: Solanki, Kiran
Description
Pb-free solders are used as interconnects in various levels of micro-electronic packaging. Reliability of these interconnects is very critical for the performance of the package. One of the main factors affecting the reliability of solder joints is the presence of porosity which is introduced during processing of the joints. In this thesis, the effect of such porosity on the deformation behavior and eventual failure of the joints is studied using Finite Element (FE) modeling technique. A 3D model obtained by reconstruction of x-ray tomographic image data is used as input for FE analysis to simulate shear deformation and eventual failure of the joint using ductile damage model. The modeling was done in ABAQUS (v 6.10). The FE model predictions are validated with experimental results by comparing the deformation of the pores and the crack path as predicted by the model with the experimentally observed deformation and failure pattern. To understand the influence of size, shape, and distribution of pores on the mechanical behavior of the joint four different solder joints with varying degrees of porosity are modeled using the validated FE model. The validation technique mentioned above enables comparison of the simulated and actual deformation only. A more robust way of validating the FE model would be to compare the strain distribution in the joint as predicted by the model and as observed experimentally. In this study, to enable visualization of the experimental strain for the 3D microstructure obtained from tomography, a three dimensional digital image correlation (3D DIC) code has been implemented in MATLAB (MathWorks Inc). This developed 3D DIC code can be used as another tool to verify the numerical model predictions. The capability of the developed code in measuring local displacement and strain is demonstrated by considering a test case.
ContributorsJakkali, Vaidehi (Author) / Chawla, Nikhilesh K (Thesis advisor) / Jiang, Hanqing (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2011
Description
Recently, the use of zinc oxide (ZnO) nanowires as an interphase in composite materials has been demonstrated to increase the interfacial shear strength between carbon fiber and an epoxy matrix. In this research work, the strong adhesion between ZnO and carbon fiber is investigated to elucidate the interactions at the interface that result in high interfacial strength. First, molecular dynamics (MD) simulations are performed to calculate the adhesive energy between bare carbon and ZnO. Since the carbon fiber surface has oxygen functional groups, these were modeled and MD simulations showed the preference of ketones to strongly interact with ZnO, however, this was not observed in the case of hydroxyls and carboxylic acid. It was also found that the ketone molecules ability to change orientation facilitated the interactions with the ZnO surface. Experimentally, the atomic force microscope (AFM) was used to measure the adhesive energy between ZnO and carbon through a liftoff test by employing highly oriented pyrolytic graphite (HOPG) substrate and a ZnO covered AFM tip. Oxygen functionalization of the HOPG surface shows the increase of adhesive energy. Additionally, the surface of ZnO was modified to hold a negative charge, which demonstrated an increase in the adhesive energy. This increase in adhesion resulted from increased induction forces given the relatively high polarizability of HOPG and the preservation of the charge on ZnO surface. It was found that the additional negative charge can be preserved on the ZnO surface because there is an energy barrier since carbon and ZnO form a Schottky contact. Other materials with the same ionic properties of ZnO but with higher polarizability also demonstrated good adhesion to carbon. This result substantiates that their induced interaction can be facilitated not only by the polarizability of carbon but by any of the materials at the interface. The versatility to modify the magnitude of the induced interaction between carbon and an ionic material provides a new route to create interfaces with controlled interfacial strength.
ContributorsGalan Vera, Magdian Ulises (Author) / Sodano, Henry A (Thesis advisor) / Jiang, Hanqing (Committee member) / Solanki, Kiran (Committee member) / Oswald, Jay (Committee member) / Speyer, Gil (Committee member) / Arizona State University (Publisher)
Created2013
Description
With increasing concerns of the intrinsic toxicity of lead (Pb) in electronics, a series of tin (Sn) based alloys involving silver (Ag) and copper (Cu) have been proposed as replacements for Pb-Sn solder and widely accepted by industry. However, they have a higher melting point and often exhibit poorer damage tolerance than Pb-Sn alloys. Recently, a new class of alloys with trace amount of rare-earth (RE) elements has been discovered and investigated. In previous work from Prof. Chawla's group, it has been shown that cerium (Ce)-based Pb-free solder are less prone to oxidation and Sn whiskering, and exhibit desirable attributes of microstructural refinement and enhanced ductility relative to lanthanum (La)-based Sn-3.9Ag-0.7Cu (SAC) alloy. Although the formation of RESn3 was believed to be directly responsible for the enhanced ductility in RE-containing SAC solder by allowing microscopic voids to nucleate throughout the solder volume, this cavitation-based mechanism needs to be validated experimentally and numerically. Additionally, since the previous study has exhibited the realistic feasibility of Ce-based SAC lead-free solder alloy as a replacement to conventional SAC alloys, in this study, the proposed objective focuses on the in in-depth understanding of mechanism of enhanced ductility in Ce-based SAC alloy and possible issues associated with integration of this new class of solder into electronic industry, including: (a) study of long-term thermal and mechanical stability on industrial metallization, (b) examine the role of solder volume and wetting behavior of the new solder, relative to Sn-3.9Ag-0.7Cu alloys, (c) conduct experiments of new solder alloys in the form of mechanical shock and electromigration. The research of this new class alloys will be conducted in industrially relevant conditions, and the results would serve as the first step toward integration of these new, next generation solders into the industry.
ContributorsXie, Huxiao (Author) / Chawla, Nikhilesh (Thesis advisor) / Krause, Stephen (Committee member) / Solanki, Kiran (Committee member) / Mirpuri, Kabir (Committee member) / Arizona State University (Publisher)
Created2012
Description
The following is a report that will evaluate the microstructure of the nickel-based superalloy Hastelloy X and its relationship to mechanical properties in different load conditions. Hastelloy X is of interest to the company AORA because its strength and oxidation resistance at high temperatures is directly applicable to their needs in a hybrid concentrated solar module. The literature review shows that the microstructure will produce different carbides at various temperatures, which can be beneficial to the strength of the alloy. These precipitates are found along the grain boundaries and act as pins that limit dislocation flow, as well as grain boundary sliding, and improve the rupture strength of the material. Over time, harmful precipitates form which counteract the strengthening effect of the carbides and reduce rupture strength, leading to failure. A combination of indentation and microstructure mapping was used in an effort to link local mechanical behavior to microstructure variability. Electron backscatter diffraction (EBSD) and energy dispersive spectroscopy (EDS) were initially used as a means to characterize the microstructure prior to testing. Then, a series of room temperature Vickers hardness tests at 50 and 500 gram-force were used to evaluate the variation in the local response as a function of indentation size. The room temperature study concluded that both the hardness and standard deviation increased at lower loads, which is consistent with the grain size distribution seen in the microstructure scan. The material was then subjected to high temperature spherical indentation. Load-displacement curves were essential in evaluating the decrease in strength of the material with increasing temperature. Through linear regression of the unloading portion of the curve, the plastic deformation was determined and compared at different temperatures as a qualitative method to evaluate local strength.
ContributorsCelaya, Andrew Jose (Author) / Peralta, Pedro (Thesis director) / Solanki, Kiran (Committee member) / Barrett, The Honors College (Contributor) / Mechanical and Aerospace Engineering Program (Contributor)
Created2015-05
Description
This paper investigates Surface Mechanical Attrition Treatment (SMAT) and the influence of treatment temperature and initial sample surface finish on the corrosion resistance of 7075-T651 aluminum alloy. Ambient SMAT was performed on AA7075 samples polished to 80-grit initial surface roughness. Potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) tests were used to characterize the corrosion behavior of samples before and after SMAT. Electrochemical tests indicated an improved corrosion resistance after application of SMAT process. The observed improvements in corrosion properties are potentially due to microstructural changes in the material surface induced by SMAT which encouraged the formation of a passive oxide layer. Further testing and research are required to understand the corrosion related effects of cryogenic SMAT and initial-surface finish as the COVID-19 pandemic inhibited experimentation plans.
ContributorsDeorio, Jordan Anthony (Author) / Solanki, Kiran (Thesis director) / Rajagopalan, Jagannathan (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2020-05
Description
The goal of this research is to compare the mechanical properties of CP-Ti and Ti-O and to understand the relationship between a material's microstructure and its response to fatigue. Titanium has been selected due to its desirable properties and applicability in several engineering fields. Both samples are polished and etched in order to visualize and characterize the microstructure and its features. The samples then undergo strain-controlled fatigue tests for several thousand cycles. Throughout testing, images of the samples are taken at zero and maximum load for DIC analysis. The DIC results can be used to study the local strains of the samples. The DIC analysis performed on the CP-Ti sample and presented in this study will be used to understand how the addition of oxygen in the Ti-O impacts fatigue response. The outcome of this research can be used to develop long-lasting, high strength materials.
ContributorsRiley, Erin Ashland (Author) / Solanki, Kiran (Thesis director) / Oswald, Jay (Committee member) / School of Art (Contributor) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
Description
An approach for modeling resistance spot welding of thin-gauge, dissimilar metal sheets with high electrical conductivity is presented in this work. In this scenario, the electrical and thermal contact resistances play a dominant role in heat generation and temperature evolution within the workpieces; these interactions ultimately control the weld geometry. Existing models are limited in modeling these interactions, especially for dissimilar and thin-gauge metal sheets, and at higher temperatures when the multiphysics becomes increasingly interdependent. The approach presented here uses resistivity measurements, combined with thermal modeling and known bulk resistance relationships to infer the relationship between electrical contact resistance and temperature for each of the different material interfaces in the welding process. Corresponding thermal contact resistance models are developed using the Wiedemann-Franz law combined with a scaling factor to account for nonmetallic behavior. Experimental and simulation voltage histories and final weld diameter were used to validate this model for a Cu/Al/Cu and a Cu/Al/Cu/Al/Cu stack-ups. This model was then used to study the effect of Ni-P coating on resistance spot welding of Cu and Al sheets in terms of weld formation, mechanical deformation, and contact resistance. Contact resistance and current density distribution are highly dependent on contact pressure and temperature distribution at the Cu/Al interface in the presence of alumina. The Ni-P coating helps evolve a partially-bonded donut shaped weld into a fully-bonded hourglass-shaped weld by decreasing the dependence of contact resistance and current density distribution on contact pressure and temperature distribution at the Cu/Al interface. This work also provides an approach to minimize distortion due to offset-rolling in thin aluminum sheets by optimizing the stiffening feature geometry. The distortion is minimized using particle swarm optimization. The objective function is a function of distortion and smallest radius of curvature in the geometry. Doubling the minimum allowable radius of curvature nearly doubles the reduction in distortion from the stadium shape for a quarter model. Reduction in distortion in the quarter model extends to the full-scale model with the best design performing 5.3% and 27% better than the corresponding nominal design for a quarter and full-scale model, respectively.
ContributorsVeeresh, Pawan (Author) / Oswald, Jay (Thesis advisor) / Carlson, Blair (Committee member) / Hoover, Christian (Committee member) / Rajagopalan, Jagannathan (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2022
Quantum Mechanical Study of the Electronic Structure and Thermoelectric Properties of Heusler Alloys
Description
Heusler alloys were discovered in 1903, and materials with half-metallic characteristics have drawn more attention from researchers since the advances in semiconductor industry [1]. Heusler alloys have found application as spin-filters, tunnel junctions or giant magnetoresistance (GMR) devices in technological applications [1]. In this work, the electronic structures, phonon dispersion, thermal properties, and electrical conductivities of PdMnSn and six novel alloys (AuCrSn, AuMnGe, Au2MnSn, Cu2NiGe, Pd2NiGe and Pt2CoSn) along with their magnetic moments are studied using ab initio calculations to understand the roots of half-metallicity in these alloys of Heusler family. From the phonon dispersion, the thermodynamic stability of the alloys in their respective phases is assessed. Phonon modes were also used to further understand the electrical transport in the crystals of these seven alloys. This study evaluates the relationship between materials' electrical conductivity and minority-spin bandgap in the band structure, and it provides suggestions for selecting constituent elements when designing new half-metallic Heusler alloys of C1b and L21 structures.
ContributorsPatel, Deep (Author) / Zhuang, Houlong (Thesis advisor) / Solanki, Kiran (Committee member) / Huang, Huei-Ping (Committee member) / Arizona State University (Publisher)
Created2023
Description
The increasing demand for structural materials with superior mechanical properties has provided a strong impetus to the discovery of novel materials, and innovations in processing techniques to improve the properties of existing materials. Methods like severe plastic deformation (SPD) and surface mechanical attrition treatment (SMAT) have led to significant enhancement in the strength of traditional structural materials like Al and Fe based alloys via microstructural refinement. However, the nanocrystalline materials produced using these techniques exhibit poor ductility due to the lack of effective strain hardening mechanisms, and as a result the well-known strength-ductility trade-off persists. To overcome this trade-off, researchers have proposed the concept of heterostructured materials, which are composed of domains ranging in size from a few nanometers to several micrometers. Over the last two decades, there has been intense research on the development of new methods to synthesize heterostructured materials. However, none of these methods is capable of providing precise control over key microstructural parameters such as average grain size, grain morphology, and volume fraction and connectivity of coarse and fine grains. Due to the lack of microstructural control, the relationship between these parameters and the deformation behavior of heterostructured materials cannot be investigated systematically, and hence designing heterostructured materials with optimized properties is currently infeasible. This work aims to address this scientific and technological challenge and is composed of two distinct but interrelated parts. The first part concerns the development of a broadly applicable synthesis method to produce heterostructured metallic films with precisely defined architectures. This method exploits two forms of film growth (epitaxial and Volmer-Weber) to generate heterostructured metallic films. The second part investigates the effect of different microstructural parameters on the deformation behavior of heterostructured metallic films with the aim of elucidating their structure-property relationships. Towards this end, freestanding heterostructured Fe films with different architectures were fabricated and uniaxially deformed using MEMS stages. The results from these experiments are presented and their implications for the mechanical properties of heterostructured materials is discussed.
ContributorsBerlia, Rohit (Author) / Rajagopalan, Jagannathan (Thesis advisor) / Sieradzki, Karl (Committee member) / Peralta, Pedro (Committee member) / Crozier, Peter (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2021
Description
This thesis presents a study of the microstructure and mechanical properties of Yttrium-Zinc (YZn) thin films. Rare-earth intermetallic compounds have gained significant attention in recent years due to their unique structural and mechanical properties, making them suitable for various applications. However, studies on the Y-Zn system are scarce and there are very few published reports on YZn thin films. The main objective of this study is to investigate the microstructure and mechanical properties of YZn thin films using various experimental techniques.In this study, YZn films of various thicknesses were synthesized via magnetron co-sputtering: 200 nm, 500 nm, 1 µm, 2 µm and 11.5 µm. Then these samples were annealed at 250°C, 300°C, 350°C and 400°C to investigate their microstructural evolution and mechanical properties. X-ray diffraction (XRD) and scanning electron microscopy (SEM) based techniques have been used to analyze the microstructure and chemical composition of these compounds. The mechanical properties such as hardness and elastic modulus have been measured using nanoindentation.
The results show that the microstructure of YZn thin films is dependent on the annealing conditions. The microstructure of samples deposited at room temperature and those annealed at 250°C and 300°C were found to be amorphous except for the 200 nm YZn film. Annealing at higher temperatures leads to crystallization of the films. Moreover, the results demonstrate that YZn intermetallic thin films have high hardness, which varies with the film thickness and annealing treatment.
This work represents an initial effort to understand the microstructural evolution and mechanical properties of YZn thin films as a function of film thickness and annealing temperatures. The results of this study can be used to guide the design and development of YZn thin films with tailored microstructures and mechanical properties for various applications.
ContributorsAkkarakaduppil, Riju Philip James (Author) / Rajagopalan, Jagannathan (Thesis advisor, Committee member) / Peralta, Pedro (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2023