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Description
A fully automated logic design methodology for radiation hardened by design (RHBD) high speed logic using fine grained triple modular redundancy (TMR) is presented. The hardening techniques used in the cell library are described and evaluated, with a focus on both layout techniques that mitigate total ionizing dose (TID) and latchup issues and flip-flop designs that mitigate single event transient (SET) and single event upset (SEU) issues. The base TMR self-correcting master-slave flip-flop is described and compared to more traditional hardening techniques. Additional refinements are presented, including testability features that disable the self-correction to allow detection of manufacturing defects. The circuit approach is validated for hardness using both heavy ion and proton broad beam testing. For synthesis and auto place and route, the methodology and circuits leverage commercial logic design automation tools. These tools are glued together with custom CAD tools designed to enable easy conversion of standard single redundant hardware description language (HDL) files into hardened TMR circuitry. The flow allows hardening of any synthesizable logic at clock frequencies comparable to unhardened designs and supports standard low-power techniques, e.g. clock gating and supply voltage scaling.
ContributorsHindman, Nathan (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Barnaby, Hugh (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2012
Description
Microprocessors are the processing heart of any digital system and are central to all the technological advancements of the age including space exploration and monitoring. The demands of space exploration require a special class of microprocessors called radiation hardened microprocessors which are less susceptible to radiation present outside the earth's atmosphere, in other words their functioning is not disrupted even in presence of disruptive radiation. The presence of these particles forces the designers to come up with design techniques at circuit and chip levels to alleviate the errors which can be encountered in the functioning of microprocessors. Microprocessor evolution has been very rapid in terms of performance but the same cannot be said about its rad-hard counterpart. With the total data processing capability overall increasing rapidly, the clear lack of performance of the processors manifests as a bottleneck in any processing system. To design high performance rad-hard microprocessors designers have to overcome difficult design problems at various design stages i.e. Architecture, Synthesis, Floorplanning, Optimization, routing and analysis all the while maintaining circuit radiation hardness. The reference design `HERMES' is targeted at 90nm IBM G process and is expected to reach 500Mhz which is twice as fast any processor currently available. Chapter 1 talks about the mechanisms of radiation effects which cause upsets and degradation to the functioning of digital circuits. Chapter 2 gives a brief description of the components which are used in the design and are part of the consistent efforts at ASUVLSI lab culminating in this chip level implementation of the design. Chapter 3 explains the basic digital design ASIC flow and the changes made to it leading to a rad-hard specific ASIC flow used in implementing this chip. Chapter 4 talks about the triple mode redundant (TMR) specific flow which is used in the block implementation, delineating the challenges faced and the solutions proposed to make the flow work. Chapter 5 explains the challenges faced and solutions arrived at while using the top-level flow described in chapter 3. Chapter 6 puts together the results and analyzes the design in terms of basic integrated circuit design constraints.
ContributorsRamamurthy, Chandarasekaran (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Barnaby, Hugh J (Committee member) / Mayhew, David (Committee member) / Arizona State University (Publisher)
Created2013
Description
Thin film transistors (TFTs) are being used in a wide variety of applications such as image sensors, radiation detectors, as well as for use in liquid crystal displays. However, there is a conspicuous absence of interface electronics for bridging the gap between the flexible sensors and digitized displays. Hence is the need to build the same. In this thesis, the feasibility of building mixed analog circuits in TFTs are explored and demonstrated. A flexible CMOS op-amp is demonstrated using a-Si:H and pentacene TFTs. The achieved performance is ¡Ö 50 dB of DC open loop gain with unity gain frequency (UGF) of 7 kHz. The op-amp is built on the popular 2 stage topology with the 2nd stage being cascoded to provide sufficient gain. A novel biasing circuit was successfully developed modifying the gm biasing circuit to retard the performance degradation as the TFTs aged. A switched capacitor 7 bit DAC was developed in only nMOS topology using a-Si:H TFTs, based on charge sharing concept. The DAC achieved a maximum differential non-linearity (DNL) of 0.6 least significant bit (LSB), while the maximum integral non-linearity (INL) was 1 LSB. TFTs were used as switches in this architecture; as a result the performance was quite unchanged even as the TFTs degraded. A 5 bit fully flash ADC was also designed using all nMOS a-Si:H TFTs. Gray coding was implemented at the output to avoid errors due to comparator meta-stability. Finally a 5 bit current steering DAC was also built using all nMOS a-Si:H TFTs. However, due to process variation, the DNL was increased to 1.2 while the INL was about 1.8 LSB. Measurements were made on the external stress effects on zinc indium oxide (ZIO) TFTs. Electrically induced stresses were studied applying DC bias on the gate and drain. These stresses shifted the device characteristics like threshold voltage and mobility. The TFTs were then mechanically stressed by stretching them across cylindrical structures of various radii. Both the subthreshold swing and mobility underwent significant changes when the stress was tensile while the change was minor under compressive stress, applied parallel to channel length.
ContributorsDey, Aritra (Author) / Allee, David R. (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Garrity, Douglas A (Committee member) / Song, Hongjiang (Committee member) / Clark, Lawrence T (Committee member) / Arizona State University (Publisher)
Created2011
Description
The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.
ContributorsMaurya, Satendra Kumar (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Vrudhula, Sarma (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2012
Description
Circuits on smaller technology nodes become more vulnerable to radiation-induced upset. Since this is a major problem for electronic circuits used in space applications, designers have a variety of solutions in hand. Radiation hardening by design (RHBD) is an approach, where electronic components are designed to work properly in certain radiation environments without the use of special fabrication processes. This work focuses on the cache design for a high performance microprocessor. The design tries to mitigate radiation effects like SEE, on a commercial foundry 45 nm SOI process. The design has been ported from a previously done cache design at the 90 nm process node. The cache design is a 16 KB, 4 way set associative, write-through design that uses a no-write allocate policy. The cache has been tested to write and read at above 2 GHz at VDD = 0.9 V. Interleaved layout, parity protection, dual redundancy, and checking circuits are used in the design to achieve radiation hardness. High speed is accomplished through the use of dynamic circuits and short wiring routes wherever possible. Gated clocks and optimized wire connections are used to reduce power. Structured methodology is used to build up the entire cache.
ContributorsXavier, Jerin (Author) / Clark, Lawrence T (Thesis advisor) / Cao, Yu (Committee member) / Allee, David R. (Committee member) / Arizona State University (Publisher)
Created2012
Description
Clock generation and distribution are essential to CMOS microchips, providing synchronization to external devices and between internal sequential logic. Clocks in microprocessors are highly vulnerable to single event effects and designing reliable energy efficient clock networks for mission critical applications is a major challenge. This dissertation studies the basics of radiation hardening, essentials of clock design and impact of particle strikes on clocks in detail and presents design techniques for hardening complete clock systems in digital ICs.
Since the sequential elements play a key role in deciding the robustness of any clocking strategy, hardened-by-design implementations of triple-mode redundant (TMR) pulse clocked latches and physical design methodologies for using TMR master-slave flip-flops in application specific ICs (ASICs) are proposed. A novel temporal pulse clocked latch design for low power radiation hardened applications is also proposed. Techniques for designing custom RHBD clock distribution networks (clock spines) and ASIC clock trees for a radiation hardened microprocessor using standard CAD tools are presented. A framework for analyzing the vulnerabilities of clock trees in general, and study the parameters that contribute the most to the tree’s failure, including impact on controlled latches is provided. This is then used to design an integrated temporally redundant clock tree and pulse clocked flip-flop based clocking scheme that is robust to single event transients (SETs) and single event upsets (SEUs). Subsequently, designing robust clock delay lines for use in double data rate (DDRx) memory applications is studied in detail. Several modules of the proposed radiation hardened all-digital delay locked loop are designed and studied. Many of the circuits proposed in this entire body of work have been implemented and tested on a standard low-power 90-nm process.
Since the sequential elements play a key role in deciding the robustness of any clocking strategy, hardened-by-design implementations of triple-mode redundant (TMR) pulse clocked latches and physical design methodologies for using TMR master-slave flip-flops in application specific ICs (ASICs) are proposed. A novel temporal pulse clocked latch design for low power radiation hardened applications is also proposed. Techniques for designing custom RHBD clock distribution networks (clock spines) and ASIC clock trees for a radiation hardened microprocessor using standard CAD tools are presented. A framework for analyzing the vulnerabilities of clock trees in general, and study the parameters that contribute the most to the tree’s failure, including impact on controlled latches is provided. This is then used to design an integrated temporally redundant clock tree and pulse clocked flip-flop based clocking scheme that is robust to single event transients (SETs) and single event upsets (SEUs). Subsequently, designing robust clock delay lines for use in double data rate (DDRx) memory applications is studied in detail. Several modules of the proposed radiation hardened all-digital delay locked loop are designed and studied. Many of the circuits proposed in this entire body of work have been implemented and tested on a standard low-power 90-nm process.
ContributorsChellappa, Srivatsan (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Cao, Yu (Committee member) / Ogras, Umit Y. (Committee member) / Arizona State University (Publisher)
Created2015
Description
Digital systems are essential to the technological advancements in space exploration. Microprocessor and flash memory are the essential parts of such a digital system. Space exploration requires a special class of radiation hardened microprocessors and flash memories, which are not functionally disrupted in the presence of radiation. The reference design ‘HERMES’ is a radiation-hardened microprocessor with performance comparable to commercially available designs. The reference design ‘eFlash’ is a prototype of soft-error hardened flash memory for configuring Xilinx FPGAs. These designs are manufactured using a foundry bulk CMOS 90-nm low standby power (LP) process. This thesis presents the post-silicon validation results of these designs.
ContributorsGogulamudi, Anudeep Reddy (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Brunhaver, John (Committee member) / Arizona State University (Publisher)
Created2016
Description
Soft errors are considered as a key reliability challenge for sub-nano scale transistors. An ideal solution for such a challenge should ultimately eliminate the effect of soft errors from the microprocessor. While forward recovery techniques achieve fast recovery from errors by simply voting out the wrong values, they incur the overhead of three copies execution. Backward recovery techniques only need two copies of execution, but suffer from check-pointing overhead.
In this work I explored the efficiency of integrating check-pointing into the application and the effectiveness of recovery that can be performed upon it. After evaluating the available fine-grained approaches to perform recovery, I am introducing InCheck, an in-application recovery scheme that can be integrated into instruction-duplication based techniques, thus providing a fast error recovery. The proposed technique makes light-weight checkpoints at the basic-block granularity, and uses them for recovery purposes.
To evaluate the effectiveness of the proposed technique, 10,000 fault injection experiments were performed on different hardware components of a modern ARM in-order simulated processor. InCheck was able to recover from all detected errors by replaying about 20 instructions, however, the state of the art recovery scheme failed more than 200 times.
In this work I explored the efficiency of integrating check-pointing into the application and the effectiveness of recovery that can be performed upon it. After evaluating the available fine-grained approaches to perform recovery, I am introducing InCheck, an in-application recovery scheme that can be integrated into instruction-duplication based techniques, thus providing a fast error recovery. The proposed technique makes light-weight checkpoints at the basic-block granularity, and uses them for recovery purposes.
To evaluate the effectiveness of the proposed technique, 10,000 fault injection experiments were performed on different hardware components of a modern ARM in-order simulated processor. InCheck was able to recover from all detected errors by replaying about 20 instructions, however, the state of the art recovery scheme failed more than 200 times.
ContributorsLokam, Sai Ram Dheeraj (Author) / Shrivastava, Aviral (Thesis advisor) / Clark, Lawrence T (Committee member) / Mubayi, Anuj (Committee member) / Arizona State University (Publisher)
Created2016
Description
Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies.
Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques.
A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.
Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques.
A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.
ContributorsRamamurthy, Chandarasekaran (Author) / Clark, Lawrence T (Thesis advisor) / Allee, David (Committee member) / Bakkaloglu, Bertan (Committee member) / Holbert, Keith E. (Committee member) / Arizona State University (Publisher)
Created2017
Description
Digital systems are increasingly pervading in the everyday lives of humans. The security of these systems is a concern due to the sensitive data stored in them. The physically unclonable function (PUF) implemented on hardware provides a way to protect these systems. Static random-access memories (SRAMs) are designed and used as a strong PUF to generate random numbers unique to the manufactured integrated circuit (IC).
Digital systems are important to the technological improvements in space exploration. Space exploration requires radiation hardened microprocessors which minimize the functional disruptions in the presence of radiation. The design highly efficient radiation-hardened microprocessor for enabling spacecraft (HERMES) is a radiation-hardened microprocessor with performance comparable to the commercially available designs. These designs are manufactured using a foundry complementary metal-oxide semiconductor (CMOS) 55-nm triple-well process. This thesis presents the post silicon validation results of the HERMES and the PUF mode of SRAM across process corners.
Chapter 1 gives an overview of the blocks implemented on the test chip 25. It also talks about the pre-silicon functional verification methodology used for the test chip. Chapter 2 discusses about the post silicon testing setup of test chip 25 and the validation of the setup. Chapter 3 describes the architecture and the test bench of the HERMES along with its testing results. Chapter 4 discusses the test bench and the perl scripts used to test the SRAM along with its testing results. Chapter 5 gives a summary of the post-silicon validation results of the HERMES and the PUF mode of SRAM.
Digital systems are important to the technological improvements in space exploration. Space exploration requires radiation hardened microprocessors which minimize the functional disruptions in the presence of radiation. The design highly efficient radiation-hardened microprocessor for enabling spacecraft (HERMES) is a radiation-hardened microprocessor with performance comparable to the commercially available designs. These designs are manufactured using a foundry complementary metal-oxide semiconductor (CMOS) 55-nm triple-well process. This thesis presents the post silicon validation results of the HERMES and the PUF mode of SRAM across process corners.
Chapter 1 gives an overview of the blocks implemented on the test chip 25. It also talks about the pre-silicon functional verification methodology used for the test chip. Chapter 2 discusses about the post silicon testing setup of test chip 25 and the validation of the setup. Chapter 3 describes the architecture and the test bench of the HERMES along with its testing results. Chapter 4 discusses the test bench and the perl scripts used to test the SRAM along with its testing results. Chapter 5 gives a summary of the post-silicon validation results of the HERMES and the PUF mode of SRAM.
ContributorsMedapuram, Sai Bharadwaj (Author) / Clark, Lawrence T (Thesis advisor) / Allee, David R. (Committee member) / Brunhaver, John S (Committee member) / Arizona State University (Publisher)
Created2017