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Description
Photovoltaic (PV) systems are one of the next generation's renewable energy sources for our world energy demand. PV modules are highly reliable. However, in polluted environments, over time, they will collect grime and dust. There are also limited field data studies about soiling losses on PV modules. The study showed

Photovoltaic (PV) systems are one of the next generation's renewable energy sources for our world energy demand. PV modules are highly reliable. However, in polluted environments, over time, they will collect grime and dust. There are also limited field data studies about soiling losses on PV modules. The study showed how important it is to investigate the effect of tilt angle on soiling. The study includes two sets of mini-modules. Each set has 9 PV modules tilted at 0, 5, 10, 15, 20, 23, 30, 33 and 40°. The first set called "Cleaned" was cleaned every other day. The second set called "Soiled" was never cleaned after the first day. The short circuit current, a measure of irradiance, and module temperature was monitored and recorded every two minutes over three months (January-March 2011). The data were analyzed to investigate the effect of tilt angle on daily and monthly soiling, and hence transmitted solar insolation and energy production by PV modules. The study shows that during the period of January through March 2011 there was an average loss due to soiling of approximately 2.02% for 0° tilt angle. Modules at tilt anlges 23° and 33° also have some insolation losses but do not come close to the module at 0° tilt angle. Tilt anlge 23° has approximately 1.05% monthly insolation loss, and 33° tilt angle has an insolation loss of approximately 0.96%. The soiling effect is present at any tilt angle, but the magnitude is evident: the flatter the solar module is placed the more energy it will lose.
ContributorsCano Valero, José (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Madakannan, Arunachalanadar (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2011
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Description
The object of this study was a 26 year old residential Photovoltaic (PV) monocrystalline silicon (c-Si) power plant, called Solar One, built by developer John F. Long in Phoenix, Arizona (a hot-dry field condition). The task for Arizona State University Photovoltaic Reliability Laboratory (ASU-PRL) graduate students was to evaluate the

The object of this study was a 26 year old residential Photovoltaic (PV) monocrystalline silicon (c-Si) power plant, called Solar One, built by developer John F. Long in Phoenix, Arizona (a hot-dry field condition). The task for Arizona State University Photovoltaic Reliability Laboratory (ASU-PRL) graduate students was to evaluate the power plant through visual inspection, electrical performance, and infrared thermography. The purpose of this evaluation was to measure and understand the extent of degradation to the system along with the identification of the failure modes in this hot-dry climatic condition. This 4000 module bipolar system was originally installed with a 200 kW DC output of PV array (17 degree fixed tilt) and an AC output of 175 kVA. The system was shown to degrade approximately at a rate of 2.3% per year with no apparent potential induced degradation (PID) effect. The power plant is made of two arrays, the north array and the south array. Due to a limited time frame to execute this large project, this work was performed by two masters students (Jonathan Belmont and Kolapo Olakonu) and the test results are presented in two masters theses. This thesis presents the results obtained on the north array and the other thesis presents the results obtained on the south array. The resulting study showed that PV module design, array configuration, vandalism, installation methods and Arizona environmental conditions have had an effect on this system's longevity and reliability. Ultimately, encapsulation browning, higher series resistance (potentially due to solder bond fatigue) and non-cell interconnect ribbon breakages outside the modules were determined to be the primary causes for the power loss.
ContributorsBelmont, Jonathan (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Henderson, Mark (Committee member) / Rogers, Bradley (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material,

Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material, manufacturing process, use condition, as well as, the inherent variabilities present in the system, greatly influence product reliability. Accurate reliability analysis requires an integrated approach to concurrently account for all these factors and their synergistic effects. Such an integrated and robust methodology can be used in design and development of new and advanced microelectronics systems and can provide significant improvement in cycle-time, cost, and reliability. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks of (1) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, (2) Finite Element analysis (FEM) to predict system response needed for life prediction, and (3) development of a probabilistic methodology to predict the reliability, as well as, the sensitivity of the system to various parameters and the variabilities. These tasks and the predictive capabilities of IMPRPK in microelectronic reliability analysis are discussed.
ContributorsFallah-Adl, Ali (Author) / Tasooji, Amaneh (Thesis advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Jiang, Hanqing (Committee member) / Mahajan, Ravi (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Potential induced degradation (PID) due to high system voltages is one of the major degradation mechanisms in photovoltaic (PV) modules, adversely affecting their performance due to the combined effects of the following factors: system voltage, superstrate/glass surface conductivity, encapsulant conductivity, silicon nitride anti-reflection coating property and interface property (glass/encapsulant; encapsulant/cell;

Potential induced degradation (PID) due to high system voltages is one of the major degradation mechanisms in photovoltaic (PV) modules, adversely affecting their performance due to the combined effects of the following factors: system voltage, superstrate/glass surface conductivity, encapsulant conductivity, silicon nitride anti-reflection coating property and interface property (glass/encapsulant; encapsulant/cell; encapsulant/backsheet). Previous studies carried out at ASU's Photovoltaic Reliability Laboratory (ASU-PRL) showed that only negative voltage bias (positive grounded systems) adversely affects the performance of commonly available crystalline silicon modules. In previous studies, the surface conductivity of the glass surface was obtained using either conductive carbon layer extending from the glass surface to the frame or humidity inside an environmental chamber. This thesis investigates the influence of glass surface conductivity disruption on PV modules. In this study, conductive carbon was applied only on the module's glass surface without extending to the frame and the surface conductivity was disrupted (no carbon layer) at 2cm distance from the periphery of frame inner edges. This study was carried out under dry heat at two different temperatures (60 °C and 85 °C) and three different negative bias voltages (-300V, -400V, and -600V). To replicate closeness to the field conditions, half of the selected modules were pre-stressed under damp heat for 1000 hours (DH 1000) and the remaining half under 200 hours of thermal cycling (TC 200). When the surface continuity was disrupted by maintaining a 2 cm gap from the frame to the edge of the conductive layer, as demonstrated in this study, the degradation was found to be absent or negligibly small even after 35 hours of negative bias at elevated temperatures. This preliminary study appears to indicate that the modules could become immune to PID losses if the continuity of the glass surface conductivity is disrupted at the inside boundary of the frame. The surface conductivity of the glass, due to water layer formation in a humid condition, close to the frame could be disrupted just by applying a water repelling (hydrophobic) but high transmittance surface coating (such as Teflon) or modifying the frame/glass edges with water repellent properties.
ContributorsTatapudi, Sai Ravi Vasista (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Srinivasan, Devarajan (Committee member) / Rogers, Bradley (Committee member) / Arizona State University (Publisher)
Created2012
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Description
This thesis discusses the evolution of conduction mechanism in the silver (Ag) on zinc oxide (ZnO) thin film system with respect to the Ag morphology. As a plausible substitute for indium tin oxide (ITO), TCO/Metal/TCO (TMT) structure has received a lot of attentions as a prospective ITO substitute due to

This thesis discusses the evolution of conduction mechanism in the silver (Ag) on zinc oxide (ZnO) thin film system with respect to the Ag morphology. As a plausible substitute for indium tin oxide (ITO), TCO/Metal/TCO (TMT) structure has received a lot of attentions as a prospective ITO substitute due to its low resistivity and desirable transmittance. However, the detailed conduction mechanism is not fully understood. In an attempt to investigate the conduction mechanism of the ZnO/Ag/ZnO thin film system with respect to the Ag microstructure, the top ZnO layer is removed, which offers a better view of Ag morphology by using scanning electron microscopy (SEM). With 2 nm thick Ag layer, it is seen that the Ag forms discrete islands with small islands size (r), but large separation (s); also the effective resistivity of the system is extremely high. This regime is designated as dielectric zone. In this regime, thermionic emission and activated tunneling conduction mechanisms are considered. Based on simulations, when "s" was beyond 6 nm, thermionic emission dominates; with "s" less than 6 nm, activated tunneling is the dominating mechanism. As the Ag thickness increases, the individual islands coalesce and Ag clusters are formed. At certain Ag thickness, there are one or several Ag clusters that percolate the ZnO film, and the effective resistivity of the system exhibits a tremendous drop simultaneously, because the conducting electrons do not need to overcome huge ZnO barrier to transport. This is recognized as percolation zone. As the Ag thickness grows, Ag film becomes more continuous and there are no individual islands left on the surface. The effective resistivity decreases and is comparable to the characteristics of metallic materials, so this regime is categorized as metallic zone. The simulation of the Ag thin film resistivity is performed in terms of Ag thickness, and the experimental data fits the simulation well, which supports the proposed models. Hall measurement and four point probe measurement are carried out to characterize the electrical properties of the thin film system.
ContributorsZhang, Shengke (Author) / Alford, Terry L. (Thesis advisor) / Schroder, Dieter K. (Committee member) / Tasooji, Amaneh (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Building applied photovoltaics (BAPV) is a major application sector for photovoltaics (PV). Due to the negative temperature coefficient of power output, the performance of a PV module decreases as the temperature of the module increases. In hot climatic conditions, such as the summer in Arizona, the operating temperature of a

Building applied photovoltaics (BAPV) is a major application sector for photovoltaics (PV). Due to the negative temperature coefficient of power output, the performance of a PV module decreases as the temperature of the module increases. In hot climatic conditions, such as the summer in Arizona, the operating temperature of a BAPV module can reach as high as 90°C. Considering a typical 0.5%/°C power drop for crystalline silicon (c-Si) modules, a performance decrease of approximately 30% would be expected during peak summer temperatures due to the difference between rated temperature (25°C) and operating temperature (~90°C) of the modules. Also, in a worst-case scenario, such as partial shading of the PV cells of air gap-free BAPV modules, some of the components could attain temperatures that would be high enough to compromise the safety and functionality requirements of the module and its components. Based on the temperature and weather data collected over a year in Arizona, a mathematical thermal model has been developed and presented in this paper to predict module temperature for five different air gaps (0", 1", 2", 3", and 4"). For comparison, modules with a thermally-insulated (R30) back were evaluated to determine the worst-case scenario. This thesis also provides key technical details related to the specially-built, simulated rooftop structure; the mounting configuration of the PV modules on the rooftop structure; the LabVIEW program that was developed for data acquisition and the MATLAB program for developing the thermal models. In order to address the safety issue, temperature test results (obtained in accordance with IEC 61730-2 and UL 1703 safety standards) are presented and analyzed for nine different components of a PV module, i.e., the front glass, substrate/backsheet (polymer), PV cell, j-box ambient, j-box surface, positive terminal, backsheet inside j-box, field wiring, and diode. The temperature test results obtained for about 140 crystalline silicon modules from a large number of manufacturers who tested modules between 2006 and 2009 at ASU/TÜV-PTL were analyzed and presented in this paper under three test conditions, i.e., short-circuit, open-circuit, and short-circuit and shaded. Also, the nominal operating cell temperatures (NOCTs) of the BAPV modules and insulated-back PV modules are presented in this paper for use by BAPV module designers and installers.
ContributorsOh, Jaewon (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley R (Committee member) / Macia, Narciso F. (Committee member) / Arizona State University (Publisher)
Created2010
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Description
Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current

Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints. Effect of texture, grain orientation, and grain-boundary misorientation angle on electromigration and intermetallic compound (IMC) formation is studied through EBSD analysis performed on actual C4 bumps.
ContributorsLara, Leticia (Author) / Tasooji, Amaneh (Thesis advisor) / Lee, Kyuoh (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Solar photovoltaic (PV) generation has seen significant growth in 2021, with an increase of around 22% and exceeding 1000 TWh. However, this has also led to reliability and durability issues, particularly potential induced degradation (PID), which can reduce module output by up to 30%. This study uses cell- and module-level

Solar photovoltaic (PV) generation has seen significant growth in 2021, with an increase of around 22% and exceeding 1000 TWh. However, this has also led to reliability and durability issues, particularly potential induced degradation (PID), which can reduce module output by up to 30%. This study uses cell- and module-level analysis to investigate the impact of superstrate, encapsulant, and substrate on PID.The influence of different substrates and encapsulants is studied using one-cell modules, showing that substrates with poor water-blocking properties can worsen PID, and encapsulants with lower volumetric resistance can conduct easily under damp conditions, enabling PID mechanisms (results show maximum degradation of 9%). Applying an anti-soiling coating on the front glass (superstrate) reduces PID by nearly 53%. Typical superstrates have sodium which accelerates the PID process, and therefore, using such coatings can lessen the PID problem. At the module level, the study examines the influence of weakened interface adhesion strengths in traditional Glass-Backsheet (GB) and emerging Glass-Glass (GG) (primarily bifacial modules) constructions. The findings show nearly 64% more power degradation in GG modules than in GB. Moreover, the current methods for detecting PID use new modules, which can give inaccurate information instead of DH-stressed modules for PID testing, as done in this work. A comprehensive PID susceptibility analysis for multiple fresh bifacial constructions shows significant degradation from 20 to 50% in various constructions. The presence of glass as the substrate exacerbates the PID problem due to more ionic activity available from the two glass sides. Recovery experiments are also conducted to understand the extent of the PID issue. Overall, this study identifies, studies, and explains the impact of superstrate, substrate, and encapsulant on the underlying PID mechanisms. Various pre- and post-stress characterization tests, including light and dark current-voltage (I-V) tests, electroluminescence (EL) imaging, infrared (IR) imaging, and UV fluorescence (UVF) imaging, are used to evaluate the findings. This study is significant as it provides insights into the PID issues in solar PV systems, which can help improve their performance and reliability.
ContributorsMahmood, Farrukh ibne (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Oh, Jaewon (Committee member) / Rajadas, John (Committee member) / Arizona State University (Publisher)
Created2023
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Description
This study introduces a new outdoor accelerated testing method called “Field Accelerated Stress Testing (FAST)” for photovoltaic (PV) modules performed at two different climatic sites in Arizona (hot-dry) and Florida (hot-humid). FAST is a combined accelerated test methodology that simultaneously accounts for all the field-specific stresses and accelerates only key

This study introduces a new outdoor accelerated testing method called “Field Accelerated Stress Testing (FAST)” for photovoltaic (PV) modules performed at two different climatic sites in Arizona (hot-dry) and Florida (hot-humid). FAST is a combined accelerated test methodology that simultaneously accounts for all the field-specific stresses and accelerates only key stresses, such as temperature, to forecast the failure modes by 2- 7 times in advance depending on the activation energy of the degradation mechanism (i.e., 10th year reliability issues can potentially be predicted in the 2nd year itself for an acceleration factor of 5). In this outdoor combined accelerated stress study, the temperatures of test modules were increased (by 16-19℃ compared to control modules) using thermal insulations on the back of the modules. All other conditions (ambient temperature, humidity, natural sunlight, wind speed, wind direction, and tilt angle) were left constant for both test modules (with back thermal insulation) and control modules (without thermal insulation). In this study, a total of sixteen 4-cell modules with two different construction types (glass/glass [GG] and glass/backsheet [GB]) and two different encapsulant types (ethylene vinyl acetate [EVA] and polyolefin elastomer [POE]), were investigated at both sites with eight modules at each site (four insulated and four non-insulated modules at each site). All the modules were extensively characterized before installation in the field and after field exposure over two years. The methods used for characterizing the devices included I-V (current-voltage curves), EL (electroluminescence), UVF (ultraviolet fluorescence), and reflectance. The key findings of this study are: i) the GG modules tend to operate at a higher temperature (1-3℃) than the GB modules at both sites of Arizona and Florida (a lower lifetime is expected for GG modules compared to GB modules); ii) the GG modules tend to experience a higher level of encapsulant discoloration and grid finger degradation than the GB modules at both sites (a higher level of the degradation rate is expected in GG modules compared to GB modules); and, iii) the EVA-based modules tend to have a higher level of discoloration and finger degradation compared to the POE-based modules at both sites.
ContributorsThayumanavan, Rishi Gokul (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Phelan, Patrick (Thesis advisor) / Calhoun, Ronald (Committee member) / Arizona State University (Publisher)
Created2023
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Description
Global photovoltaic (PV) module installation in 2018 is estimated to exceed 100 GW, and crystalline Si (c-Si) solar cell-based modules have a share more than 90% of the global PV market. To reduce the social cost of PV electricity, further developments in reliability of solar panels are expected. These will

Global photovoltaic (PV) module installation in 2018 is estimated to exceed 100 GW, and crystalline Si (c-Si) solar cell-based modules have a share more than 90% of the global PV market. To reduce the social cost of PV electricity, further developments in reliability of solar panels are expected. These will lead to realize longer module lifetime and reduced levelized cost of energy. As many as 86 failure modes are observed in PV modules [1] and series resistance increase is one of the major durability issues of all. Series resistance constitutes emitter sheet resistance, metal-semiconductor contact resistance, and resistance across the metal-solder ribbon. Solder bond degradation at the cell interconnect is one of the primary causes for increase in series resistance, which is also considered to be an invisible defect [1]. Combination of intermetallic compounds (IMC) formation during soldering and their growth due to solid state diffusion over its lifetime result in formation of weak interfaces between the solar cell and the interconnect. Thermal cycling under regular operating conditions induce thermo-mechanical fatigue over these weak interfaces resulting in contact reduction or loss. Contact reduction or loss leads to increase in series resistance which further manifests into power and fill factor loss. The degree of intermixing of metallic interfaces and contact loss depends on climatic conditions as temperature and humidity (moisture ingression into the PV module laminate) play a vital role in reaction kinetics of these layers. Modules from Arizona and Florida served as a good sample set to analyze the effects of hot and humid climatic conditions respectively. The results obtained in the current thesis quantifies the thickness of IMC formation from SEM-EDS profiles, where similar modules obtained from different climatic conditions were compared. The results indicate the thickness of the IMC and detachment degree to be growing with age and operating temperatures of the module. This can be seen in CuxSny IMC which is thicker in the case of Arizona module. The results obtained from FL

ii

aged modules also show that humidity accelerates the formation of IMC as they showed thicker AgxSny layer and weak interconnect-contact interfaces as compared to Arizona modules. It is also shown that climatic conditions have different effects on rate at which CuxSny and AgxSny intermetallic compounds are formed.
ContributorsBuddha, Viswa Sai Pavan (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Alford, Terry (Thesis advisor) / Srinivasan, Devarajan (Committee member) / Arizona State University (Publisher)
Created2018