Description

Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill

Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials. Magnetic alignment of ferrous fill material enforces percolation of the high thermal conductivity fill, thereby shifting the governing boundary resistance to the particle- particle interfaces and increasing the directional thermal conductivity of the polymer composite.

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Date Created
  • 2019
Resource Type
  • Text
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    Note
    • Partial requirement for: Ph.D., Arizona State University, 2019
      Note type
      thesis
    • Includes bibliographical references (pages 56-66)
      Note type
      bibliography
    • Field of study: Mechanical engineering

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    by Matthew Ralphs

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