Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.
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- Partial requirement for: Ph.D., Arizona State University, 2018Note typethesis
- Includes bibliographical references (pages 134-145)Note typebibliography
- Field of study: Materials science and engineering