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Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in

Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.

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    Date Created
    • 2018
    Resource Type
  • Text
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    Note
    • Partial requirement for: Ph.D., Arizona State University, 2018
      Note type
      thesis
    • Includes bibliographical references (pages 134-145)
      Note type
      bibliography
    • Field of study: Materials science and engineering

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    by Irene Lujan Regalado

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