This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20µm to 100µm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography.
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- Partial requirement for: Ph.D., Arizona State University, 2018Note typethesis
- Includes bibliographical referencesNote typebibliography
- Field of study: Materials science and engineering