Advancements in thermal interface materials (TIMs) allows for the creation of new and more powerful electronics as they increase the heat transfer from the component to the heat sink. Current industrial options provide decent heat transfer, but the creation of TIMs with higher thermal conductivities is needed. In addition, if these TIMs are elastic in nature, their effectiveness can greatly increase as they can deal with changing interfaces without degradation of their properties.
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- Partial requirement for: M.S., Arizona State University, 2017Note typethesis
- Includes bibliographical references (pages 27-28)Note typebibliography
- Field of study: Mechanical engineering