This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted.
Download count: 0
- Partial requirement for: M.S., Arizona State University, 2014Note typethesis
- Includes bibliographical references (p. 48-49)Note typebibliography
- Field of study: Industrial engineering