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This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal

This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted.

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    Date Created
    • 2014
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2014
      Note type
      thesis
    • Includes bibliographical references (p. 48-49)
      Note type
      bibliography
    • Field of study: Industrial engineering

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    by Xinyue Xu

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