Semiconductor scaling technology has led to a sharp growth in transistor counts. This has resulted in an exponential increase on both power dissipation and heat flux (or power density) in modern microprocessors. These microprocessors are integrated as the major components in many modern embedded devices, which offer richer features and attain higher performance than ever before. Therefore, power and thermal management have become the significant design considerations for modern embedded devices.
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- Partial requirement for: Ph.D., Arizona State University, 2012Note typethesis
- Includes bibliographical references (p. 144-153)Note typebibliography
- Field of study: Computer science