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Description

A novel strain sensing procedure using an optical scanning methodology and diffraction grating is explored. The motivation behind this study is due to uneven thermal strain distribution across semiconductor chips

A novel strain sensing procedure using an optical scanning methodology and diffraction grating is explored. The motivation behind this study is due to uneven thermal strain distribution across semiconductor chips that are composed of varying materials. Due to the unique properties of the materials and the different coefficients of thermal expansion (CTE), one can expect the material that experiences the highest strain to be the most likely failure point of the chip.

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Date Created
  • 2014-05
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  • Text
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