Accelerated testing is vital in learning about the reliability of solar PV modules. The unique streamlined approach taken saves time and resources with a statistically significant number of samples being tested in one chamber under multiple experimental stress conditions that closely mirror field conditions that induce encapsulant browning and solder bond degradation. With short circuit current (Isc) and series resistance (Rs) degradation data sets at multiple temperatures, the activation energies (Ea) for encapsulant browning and solder bond degradation was calculated.
Regular degradation was replaced by the wear-out stages of encapsulant browning and solder bond degradation by subjecting two types of field-aged modules to further accelerated testing. For browning, the Ea calculated through the Arrhenius model was 0.37 ± 0.17 eV and 0.71 ± 0.07 eV. For solder bond degradation, the Arrhenius model was used to calculate an Ea of 0.12 ± 0.05 eV for solder with 2wt% Ag and 0.35 ± 0.04 eV for Sn60Pb40 solder.
To study the effect of types of encapsulant, backsheet, and solder on encapsulant browning and solder bond degradation, 9-cut-cell samples maximizing available data points while minimizing resources underwent accelerated tests described for modules. A ring-like browning feature was observed in samples with UV pass EVA above and UV cut EVA below the cells. The backsheet permeability influences the extent of oxygen photo-bleaching. In samples with solder bond degradation, increased bright spots and cell darkening resulted in increased Rs. Combining image processing with fluorescence imaging and electroluminescence imaging would yield great insight into the two degradation modes.
To test reproducibility of a technical specification under development for potential-induced degradation (PID) and polarization, three crystalline silicon module types were distributed in five replicas each to five laboratories. Stress tests were performed in environmental chambers at 60 °C, 85% relative humidity, 96 h, and with module nameplate system voltage applied. Results from the modules tested indicate that the test protocol can discern susceptibility to PID according to the pass/fail criteria with acceptable consistency from lab to lab; however, areas for improvement are indicated to achieve better uniformity in temperature and humidity on the module surfaces. In the analysis of variance of the results, 6% of the variance was attributed to laboratory influence, 34% to module design, and 60% to variability in test results within a given design. Testing with the additional factor of illumination with ultraviolet light slowed or arrested the degradation. Testing at 25 °C with aluminum foil as the module ground was also examined for comparison. The foil, as tested, did not itself achieve consistent contact to ground at all surfaces, but methods to ensure more consistent grounding were found and proposed. The rates of degradation in each test are compared, and details affecting the rates are discussed.