Matching Items (2)
Filtering by
- Member of: ASU Electronic Theses and Dissertations
Description
Wide bandgap (WBG) semiconductors GaN (3.4 eV), Ga2O3 (4.8 eV) and AlN (6.2 eV), have gained considerable interests for energy-efficient optoelectronic and electronic applications in solid-state lighting, photovoltaics, power conversion, and so on. They can offer unique device performance compared with traditional semiconductors such as Si. Efficient GaN based light-emitting diodes (LEDs) have increasingly displaced incandescent and fluorescent bulbs as the new major light sources for lighting and display. In addition, due to their large bandgap and high critical electrical field, WBG semiconductors are also ideal candidates for efficient power conversion.
In this dissertation, two types of devices are demonstrated: optoelectronic and electronic devices. Commercial polar c-plane LEDs suffer from reduced efficiency with increasing current densities, knowns as “efficiency droop”, while nonpolar/semipolar LEDs exhibit a very low efficiency droop. A modified ABC model with weak phase space filling effects is proposed to explain the low droop performance, providing insights for designing droop-free LEDs. The other emerging optoelectronics is nonpolar/semipolar III-nitride intersubband transition (ISBT) based photodetectors in terahertz and far infrared regime due to the large optical phonon energy and band offset, and the potential of room-temperature operation. ISBT properties are systematically studied for devices with different structures parameters.
In terms of electronic devices, vertical GaN p-n diodes and Schottky barrier diodes (SBDs) with high breakdown voltages are homoepitaxially grown on GaN bulk substrates with much reduced defect densities and improved device performance. The advantages of the vertical structure over the lateral structure are multifold: smaller chip area, larger current, less sensitivity to surface states, better scalability, and smaller current dispersion. Three methods are proposed to boost the device performances: thick buffer layer design, hydrogen-plasma based edge termination technique, and multiple drift layer design. In addition, newly emerged Ga2O3 and AlN power electronics may outperform GaN devices. Because of the highly anisotropic crystal structure of Ga2O3, anisotropic electrical properties have been observed in Ga2O3 electronics. The first 1-kV-class AlN SBDs are demonstrated on cost-effective sapphire substrates. Several future topics are also proposed including selective-area doping in GaN power devices, vertical AlN power devices, and (Al,Ga,In)2O3 materials and devices.
In this dissertation, two types of devices are demonstrated: optoelectronic and electronic devices. Commercial polar c-plane LEDs suffer from reduced efficiency with increasing current densities, knowns as “efficiency droop”, while nonpolar/semipolar LEDs exhibit a very low efficiency droop. A modified ABC model with weak phase space filling effects is proposed to explain the low droop performance, providing insights for designing droop-free LEDs. The other emerging optoelectronics is nonpolar/semipolar III-nitride intersubband transition (ISBT) based photodetectors in terahertz and far infrared regime due to the large optical phonon energy and band offset, and the potential of room-temperature operation. ISBT properties are systematically studied for devices with different structures parameters.
In terms of electronic devices, vertical GaN p-n diodes and Schottky barrier diodes (SBDs) with high breakdown voltages are homoepitaxially grown on GaN bulk substrates with much reduced defect densities and improved device performance. The advantages of the vertical structure over the lateral structure are multifold: smaller chip area, larger current, less sensitivity to surface states, better scalability, and smaller current dispersion. Three methods are proposed to boost the device performances: thick buffer layer design, hydrogen-plasma based edge termination technique, and multiple drift layer design. In addition, newly emerged Ga2O3 and AlN power electronics may outperform GaN devices. Because of the highly anisotropic crystal structure of Ga2O3, anisotropic electrical properties have been observed in Ga2O3 electronics. The first 1-kV-class AlN SBDs are demonstrated on cost-effective sapphire substrates. Several future topics are also proposed including selective-area doping in GaN power devices, vertical AlN power devices, and (Al,Ga,In)2O3 materials and devices.
ContributorsFu, Houqiang (Author) / Zhao, Yuji (Thesis advisor) / Vasileska, Dragica (Committee member) / Goodnick, Stephen (Committee member) / Yu, Hongbin (Committee member) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2019
Description
Modern Complementary-Metal-Oxide-Semiconductor (CMOS) technologies are facing critical challenges: scaling channel lengths below ~10 nm is hindered by significant transport degradation as bulk semiconductors (i.e., silicon) are thinned down, energy consumption is affected by short-channel effects and off-state leakage, and conventional von Neumann computing architectures face serious bottlenecks affecting performance and efficiency (energy consumption and throughput). Neuromorhic and/or in-memory computing architectures using resistive random-access memory (RRAM) crossbar arrays are promising candidates to mitigate these bottlenecks and to circumvent CMOS scaling challenges. Recently, emerging two dimensional materials (2DMs) are investigated towards ultra-scaled CMOS devices, as well as towards non-volatile memory and neuromorphic devices with potential improvements in scalability, power consumption, switching speed, and compatibility with CMOS integration.The first part of this dissertation presents contributions towards high-yield 2DMs field- effect-transistors (FETs) fabrication using wafer-scale chemical vapor deposition (CVD) monolayer MoS2. This work provides valuable insight about metal contact processing, including extraction of Schottky barrier heights and Fermi-level pinning effects, for next- generation integrated electronic systems based on CVD-grown 2DMs.
The second part introduces wafer-scale fabrication of memristor arrays with CVD- grown hexagonal boron nitride (h-BN) as the active switching layer. This work establishes the multi-state analog pulse programmability and presents the first experimental demonstration of dot-product computation and implementation of multi-variable stochastic linear regression on h-BN memristor hardware. This work extends beyond previous demonstrations of non-volatile resistive switching (NVRS) behavior in isolated h-BN memristors and paves the way for more sophisticated demonstrations of machine learning applications based on 2DMs.
Finally, combining the benefits of CVD-grown 2DMs and graphene edge contacts, vertical h-BN memristors with ultra-small active areas are introduced through this research. These devices achieve low operating currents (high resistance), large RHRS/RLRS ratio, and enable three-dimensional (3D) integration (vertical stacking) for ultimate RRAM scalability. Moreover, they facilitate studying fundamental NVRS mechanisms of single conductive nano-filaments (CNFs) which was previously unattainable in planar devices. This way, single quantum step in conductance was experimentally observed, consistent with theorized atomically-constrained CNFs behavior associated with potential improvements in stability of NVRS operation. This is supported by measured improvements in retention of quantized conductance compared to other non-2DMs filamentary-based memristors.
ContributorsXie, Jing (Author) / Sanchez Esqueda, Ivan (Thesis advisor) / Fu, Houqiang (Committee member) / Kozicki, Michael (Committee member) / Marinella, Matthew (Committee member) / Arizona State University (Publisher)
Created2023