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Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an

Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an important reliability concern. In this thesis, the pore microstructures of solder joint samples and the localized plastic deformation around individual pores was characterized in 3D using lab scale X-ray Microtomography. To observe the deformation of a solder joint in 3D, a solder joint was imaged with Microtomography after reflow and then deformed in shear in several loading steps with additional tomography data taken between each. The 3D tomography datasets were then segmented using the 3D Livewire technique into regions corresponding to solder and pores, and used to generate 3D models of the joint at each strain value using Mimics software. The extent of deformation of individual pores in the joint as a function of strain was quantified using sphericity measurements, and correlated with the observed cracking in the joint. In addition, the error inherent in the data acquisition and 3D modeling process was also quantified. The progression of damage observed with X-ray Microtomography was then used to validate the deformation and failure predicted by a Finite Element (FE) simulation. The FE model was based on the as-reflowed tomography data, and incorporated a ductile damage failure model to simulate fracture. Using the measured sphericity change and cracking information obtained from the tomography data, the FE model is shown to correctly capture the broad plastic deformation and strain localization seen in the actual joint, as well as the crack propagation. Lastly, Digital Image Correlation was investigated as a method of obtaining improved local strain measurements in 3D. This technique measures the displacement of the inherent microstructural features of the joint, and can give localized strain measurements that can be directly comparable to that predicted by modeling. The technique is demonstrated in 2D on Pb-Sn solder, and example 3D data is presented for future analysis.
ContributorsPadilla, Erick (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
This study explores the possibility of two matrices containing metallic particulates to act as smart materials by sensing of strain due to the presence of the conducting particles in the matrix. The first matrix is a regular Portland cement-based one while the second is a novel iron-based, carbonated binder developed

This study explores the possibility of two matrices containing metallic particulates to act as smart materials by sensing of strain due to the presence of the conducting particles in the matrix. The first matrix is a regular Portland cement-based one while the second is a novel iron-based, carbonated binder developed at ASU. Four different iron replacement percentages by volume (10%, 20%, 30% and 40%) in a Portland cement matrix were selected, whereas the best performing iron carbonate matrix developed was used. Electrical impedance spectroscopy was used to obtain the characteristic Nyquist plot before and after application of flexural load. Electrical circuit models were used to extract the changes in electrical properties under application of load. Strain sensing behavior was evaluated with respect to application of different stress levels and varying replacement levels of the inclusion. A similar approach was used to study the strain sensing capabilities of novel iron carbonate binder. It was observed that the strain sensing efficiency increased with increasing iron percentage and the resistivity increased with increase in load (or applied stress) for both the matrices. It is also found that the iron carbonate binder is more efficient in strain sensing as it had a higher gage factor when compared to the OPC matrix containing metallic inclusions.

Analytical equations (Maxwell) were used to extract frequency dependent electrical conductivity and permittivity of the cement paste (or the host matrix), interface, inclusion (iron) and voids to develop a generic electro-mechanical coupling model to for the strain sensing behavior. COMSOL Multiphysics 5.2a was used as finite element analysis software to develop the model. A MATLAB formulation was used to generate the microstructure with different volume fractions of inclusions. Material properties were assigned (the frequency dependent electrical parameters) and the coupled structural and electrical physics interface in COMSOL was used to model the strain sensing response. The experimental change in resistance matched well with the simulated values, indicating the applicability of the model to predict the strain sensing response of particulate composite systems.
ContributorsChowdhury, Swaptik (Author) / Neithalath, Narayanan (Thesis advisor) / Rajan, Subramaniam D. (Committee member) / Hoover, Christian G (Committee member) / Arizona State University (Publisher)
Created2017