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Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an

Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an important reliability concern. In this thesis, the pore microstructures of solder joint samples and the localized plastic deformation around individual pores was characterized in 3D using lab scale X-ray Microtomography. To observe the deformation of a solder joint in 3D, a solder joint was imaged with Microtomography after reflow and then deformed in shear in several loading steps with additional tomography data taken between each. The 3D tomography datasets were then segmented using the 3D Livewire technique into regions corresponding to solder and pores, and used to generate 3D models of the joint at each strain value using Mimics software. The extent of deformation of individual pores in the joint as a function of strain was quantified using sphericity measurements, and correlated with the observed cracking in the joint. In addition, the error inherent in the data acquisition and 3D modeling process was also quantified. The progression of damage observed with X-ray Microtomography was then used to validate the deformation and failure predicted by a Finite Element (FE) simulation. The FE model was based on the as-reflowed tomography data, and incorporated a ductile damage failure model to simulate fracture. Using the measured sphericity change and cracking information obtained from the tomography data, the FE model is shown to correctly capture the broad plastic deformation and strain localization seen in the actual joint, as well as the crack propagation. Lastly, Digital Image Correlation was investigated as a method of obtaining improved local strain measurements in 3D. This technique measures the displacement of the inherent microstructural features of the joint, and can give localized strain measurements that can be directly comparable to that predicted by modeling. The technique is demonstrated in 2D on Pb-Sn solder, and example 3D data is presented for future analysis.
ContributorsPadilla, Erick (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
This study employs a finite element method based modeling of cementitious composite microstructure to study the effect of presence of inclusions on the stress distribution and the constitutive response of the composite. A randomized periodic microstructure combined with periodic boundary conditions forms the base of the finite element models. Inclusion

This study employs a finite element method based modeling of cementitious composite microstructure to study the effect of presence of inclusions on the stress distribution and the constitutive response of the composite. A randomized periodic microstructure combined with periodic boundary conditions forms the base of the finite element models. Inclusion properties of quartz and light weight aggregates of size 600μm obtained from literature were made use of to study the effect of their material (including inclusion stiffness, stiffness of interfacial transition zone and matrix stiffening) and geometric properties (volume fraction of inclusion, particle size distribution of inclusion and thickness of the interfacial transition zone) on the composite. Traction-separation relationship was used to incorporate the effect of debonding at the interface of the matrix and the inclusion to study the effect on stress distribution in the microstructure. The stress distributions observed upon conducting a finite element analysis are caused due to the stiffness mismatch in both the quartz and the light weight aggregates as expected. The constitutive response of the composite microstructure is found to be in good conformance with semi-analytical models as well as experimental values. The effect of debonding throws up certain important observations on the stress distributions in the microstructure based on the stress concentrations and relaxations caused by the stiffness of the individual components of the microstructure. The study presented discusses the different micromechanical models employed, their applicability and suitability to correctly predict the composite constitutive response.
ContributorsMaroli, Amit (Author) / Neithalath, Narayanan (Thesis advisor) / Rajan, Subramanium (Committee member) / Mobasher, Barzin (Committee member) / Arizona State University (Publisher)
Created2016