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- Creators: Gel, Esma
Description
Accelerated life testing (ALT) is the process of subjecting a product to stress conditions (temperatures, voltage, pressure etc.) in excess of its normal operating levels to accelerate failures. Product failure typically results from multiple stresses acting on it simultaneously. Multi-stress factor ALTs are challenging as they increase the number of experiments due to the stress factor-level combinations resulting from the increased number of factors. Chapter 2 provides an approach for designing ALT plans with multiple stresses utilizing Latin hypercube designs that reduces the simulation cost without loss of statistical efficiency. A comparison to full grid and large-sample approximation methods illustrates the approach computational cost gain and flexibility in determining optimal stress settings with less assumptions and more intuitive unit allocations.
Implicit in the design criteria of current ALT designs is the assumption that the form of the acceleration model is correct. This is unrealistic assumption in many real-world problems. Chapter 3 provides an approach for ALT optimum design for model discrimination. We utilize the Hellinger distance measure between predictive distributions. The optimal ALT plan at three stress levels was determined and its performance was compared to good compromise plan, best traditional plan and well-known 4:2:1 compromise test plans. In the case of linear versus quadratic ALT models, the proposed method increased the test plan's ability to distinguish among competing models and provided better guidance as to which model is appropriate for the experiment.
Chapter 4 extends the approach of Chapter 3 to ALT sequential model discrimination. An initial experiment is conducted to provide maximum possible information with respect to model discrimination. The follow-on experiment is planned by leveraging the most current information to allow for Bayesian model comparison through posterior model probability ratios. Results showed that performance of plan is adversely impacted by the amount of censoring in the data, in the case of linear vs. quadratic model form at three levels of constant stress, sequential testing can improve model recovery rate by approximately 8% when data is complete, but no apparent advantage in adopting sequential testing was found in the case of right-censored data when censoring is in excess of a certain amount.
Implicit in the design criteria of current ALT designs is the assumption that the form of the acceleration model is correct. This is unrealistic assumption in many real-world problems. Chapter 3 provides an approach for ALT optimum design for model discrimination. We utilize the Hellinger distance measure between predictive distributions. The optimal ALT plan at three stress levels was determined and its performance was compared to good compromise plan, best traditional plan and well-known 4:2:1 compromise test plans. In the case of linear versus quadratic ALT models, the proposed method increased the test plan's ability to distinguish among competing models and provided better guidance as to which model is appropriate for the experiment.
Chapter 4 extends the approach of Chapter 3 to ALT sequential model discrimination. An initial experiment is conducted to provide maximum possible information with respect to model discrimination. The follow-on experiment is planned by leveraging the most current information to allow for Bayesian model comparison through posterior model probability ratios. Results showed that performance of plan is adversely impacted by the amount of censoring in the data, in the case of linear vs. quadratic model form at three levels of constant stress, sequential testing can improve model recovery rate by approximately 8% when data is complete, but no apparent advantage in adopting sequential testing was found in the case of right-censored data when censoring is in excess of a certain amount.
ContributorsNasir, Ehab (Author) / Pan, Rong (Thesis advisor) / Runger, George C. (Committee member) / Gel, Esma (Committee member) / Kao, Ming-Hung (Committee member) / Montgomery, Douglas C. (Committee member) / Arizona State University (Publisher)
Created2014
Description
This dissertation presents methods for addressing research problems that currently can only adequately be solved using Quality Reliability Engineering (QRE) approaches especially accelerated life testing (ALT) of electronic printed wiring boards with applications to avionics circuit boards. The methods presented in this research are generally applicable to circuit boards, but the data generated and their analysis is for high performance avionics. Avionics equipment typically requires 20 years expected life by aircraft equipment manufacturers and therefore ALT is the only practical way of performing life test estimates. Both thermal and vibration ALT induced failure are performed and analyzed to resolve industry questions relating to the introduction of lead-free solder product and processes into high reliability avionics. In chapter 2, thermal ALT using an industry standard failure machine implementing Interconnect Stress Test (IST) that simulates circuit board life data is compared to real production failure data by likelihood ratio tests to arrive at a mechanical theory. This mechanical theory results in a statistically equivalent energy bound such that failure distributions below a specific energy level are considered to be from the same distribution thus allowing testers to quantify parameter setting in IST prior to life testing. In chapter 3, vibration ALT comparing tin-lead and lead-free circuit board solder designs involves the use of the likelihood ratio (LR) test to assess both complete failure data and S-N curves to present methods for analyzing data. Failure data is analyzed using Regression and two-way analysis of variance (ANOVA) and reconciled with the LR test results that indicating that a costly aging pre-process may be eliminated in certain cases. In chapter 4, vibration ALT for side-by-side tin-lead and lead-free solder black box designs are life tested. Commercial models from strain data do not exist at the low levels associated with life testing and need to be developed because testing performed and presented here indicate that both tin-lead and lead-free solders are similar. In addition, earlier failures due to vibration like connector failure modes will occur before solder interconnect failures.
ContributorsJuarez, Joseph Moses (Author) / Montgomery, Douglas C. (Thesis advisor) / Borror, Connie M. (Thesis advisor) / Gel, Esma (Committee member) / Mignolet, Marc (Committee member) / Pan, Rong (Committee member) / Arizona State University (Publisher)
Created2012