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- Creators: Tamizhmani, Govindasamy
Description
Potential induced degradation (PID) due to high system voltages is one of the major degradation mechanisms in photovoltaic (PV) modules, adversely affecting their performance due to the combined effects of the following factors: system voltage, superstrate/glass surface conductivity, encapsulant conductivity, silicon nitride anti-reflection coating property and interface property (glass/encapsulant; encapsulant/cell; encapsulant/backsheet). Previous studies carried out at ASU's Photovoltaic Reliability Laboratory (ASU-PRL) showed that only negative voltage bias (positive grounded systems) adversely affects the performance of commonly available crystalline silicon modules. In previous studies, the surface conductivity of the glass surface was obtained using either conductive carbon layer extending from the glass surface to the frame or humidity inside an environmental chamber. This thesis investigates the influence of glass surface conductivity disruption on PV modules. In this study, conductive carbon was applied only on the module's glass surface without extending to the frame and the surface conductivity was disrupted (no carbon layer) at 2cm distance from the periphery of frame inner edges. This study was carried out under dry heat at two different temperatures (60 °C and 85 °C) and three different negative bias voltages (-300V, -400V, and -600V). To replicate closeness to the field conditions, half of the selected modules were pre-stressed under damp heat for 1000 hours (DH 1000) and the remaining half under 200 hours of thermal cycling (TC 200). When the surface continuity was disrupted by maintaining a 2 cm gap from the frame to the edge of the conductive layer, as demonstrated in this study, the degradation was found to be absent or negligibly small even after 35 hours of negative bias at elevated temperatures. This preliminary study appears to indicate that the modules could become immune to PID losses if the continuity of the glass surface conductivity is disrupted at the inside boundary of the frame. The surface conductivity of the glass, due to water layer formation in a humid condition, close to the frame could be disrupted just by applying a water repelling (hydrophobic) but high transmittance surface coating (such as Teflon) or modifying the frame/glass edges with water repellent properties.
ContributorsTatapudi, Sai Ravi Vasista (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Srinivasan, Devarajan (Committee member) / Rogers, Bradley (Committee member) / Arizona State University (Publisher)
Created2012
Description
Infant mortality rate of field deployed photovoltaic (PV) modules may be expected to be higher than that estimated by standard qualification tests. The reason for increased failure rates may be attributed to the high system voltages. High voltages (HV) in grid connected modules induce additional stress factors that cause new degradation mechanisms. These new degradation mechanisms are not recognized by qualification stress tests. To study and model the effect of high system voltages, recently, potential induced degradation (PID) test method has been introduced. Using PID studies, it has been reported that high voltage failure rates are essentially due to increased leakage currents from active semiconducting layer to the grounded module frame, through encapsulant and/or glass. This project involved designing and commissioning of a new PID test bed at Photovoltaic Reliability Laboratory (PRL) of Arizona State University (ASU) to study the mechanisms of HV induced degradation. In this study, PID stress tests have been performed on accelerated stress modules, in addition to fresh modules of crystalline silicon technology. Accelerated stressing includes thermal cycling (TC200 cycles) and damp heat (1000 hours) tests as per IEC 61215. Failure rates in field deployed modules that are exposed to long term weather conditions are better simulated by conducting HV tests on prior accelerated stress tested modules. The PID testing was performed in 3 phases on a set of 5 mono crystalline silicon modules. In Phase-I of PID test, a positive bias of +600 V was applied, between shorted leads and frame of each module, on 3 modules with conducting carbon coating on glass superstrate. The 3 module set was comprised of: 1 fresh control, TC200 and DH1000. The PID test was conducted in an environmental chamber by stressing the modules at 85°C, for 35 hours with an intermittent evaluation for Arrhenius effects. In the Phase-II, a negative bias of -600 V was applied on a set of 3 modules in the chamber as defined above. The 3 module set in phase-II was comprised of: control module from phase-I, TC200 and DH1000. In the Phase-III, the same set of 3 modules which were used in the phase-II again subjected to +600 V bias to observe the recovery of lost power during the Phase-II. Electrical performance, infrared (IR) and electroluminescence (EL) were done prior and post PID testing. It was observed that high voltage positive bias in the first phase resulted in little
o power loss, high voltage negative bias in the second phase caused significant power loss and the high voltage positive bias in the third phase resulted in major recovery of lost power.
o power loss, high voltage negative bias in the second phase caused significant power loss and the high voltage positive bias in the third phase resulted in major recovery of lost power.
ContributorsGoranti, Sandhya (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2011