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Description
In recent years we have witnessed a shift towards multi-processor system-on-chips (MPSoCs) to address the demands of embedded devices (such as cell phones, GPS devices, luxury car features, etc.). Highly optimized MPSoCs are well-suited to tackle the complex application demands desired by the end user customer. These MPSoCs incorporate a

In recent years we have witnessed a shift towards multi-processor system-on-chips (MPSoCs) to address the demands of embedded devices (such as cell phones, GPS devices, luxury car features, etc.). Highly optimized MPSoCs are well-suited to tackle the complex application demands desired by the end user customer. These MPSoCs incorporate a constellation of heterogeneous processing elements (PEs) (general purpose PEs and application-specific integrated circuits (ASICS)). A typical MPSoC will be composed of a application processor, such as an ARM Coretex-A9 with cache coherent memory hierarchy, and several application sub-systems. Each of these sub-systems are composed of highly optimized instruction processors, graphics/DSP processors, and custom hardware accelerators. Typically, these sub-systems utilize scratchpad memories (SPM) rather than support cache coherency. The overall architecture is an integration of the various sub-systems through a high bandwidth system-level interconnect (such as a Network-on-Chip (NoC)). The shift to MPSoCs has been fueled by three major factors: demand for high performance, the use of component libraries, and short design turn around time. As customers continue to desire more and more complex applications on their embedded devices the performance demand for these devices continues to increase. Designers have turned to using MPSoCs to address this demand. By using pre-made IP libraries designers can quickly piece together a MPSoC that will meet the application demands of the end user with minimal time spent designing new hardware. Additionally, the use of MPSoCs allows designers to generate new devices very quickly and thus reducing the time to market. In this work, a complete MPSoC synthesis design flow is presented. We first present a technique \cite{leary1_intro} to address the synthesis of the interconnect architecture (particularly Network-on-Chip (NoC)). We then address the synthesis of the memory architecture of a MPSoC sub-system \cite{leary2_intro}. Lastly, we present a co-synthesis technique to generate the functional and memory architectures simultaneously. The validity and quality of each synthesis technique is demonstrated through extensive experimentation.
ContributorsLeary, Glenn (Author) / Chatha, Karamvir S (Thesis advisor) / Vrudhula, Sarma (Committee member) / Shrivastava, Aviral (Committee member) / Beraha, Rudy (Committee member) / Arizona State University (Publisher)
Created2013
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Description
This work focuses on the existence of multiple resistance states in a type of emerging non-volatile resistive memory device known commonly as Programmable Metallization Cell (PMC) or Conductive Bridge Random Access Memory (CBRAM), which can be important for applications such as multi-bit memory as well as non-volatile logic and neuromorphic

This work focuses on the existence of multiple resistance states in a type of emerging non-volatile resistive memory device known commonly as Programmable Metallization Cell (PMC) or Conductive Bridge Random Access Memory (CBRAM), which can be important for applications such as multi-bit memory as well as non-volatile logic and neuromorphic computing. First, experimental data from small signal, quasi-static and pulsed mode electrical characterization of such devices are presented which clearly demonstrate the inherent multi-level resistance programmability property in CBRAM devices. A physics based analytical CBRAM compact model is then presented which simulates the ion-transport dynamics and filamentary growth mechanism that causes resistance change in such devices. Simulation results from the model are fitted to experimental dynamic resistance switching characteristics. The model designed using Verilog-a language is computation-efficient and can be integrated with industry standard circuit simulation tools for design and analysis of hybrid circuits involving both CMOS and CBRAM devices. Three main circuit applications for CBRAM devices are explored in this work. Firstly, the susceptibility of CBRAM memory arrays to single event induced upsets is analyzed via compact model simulation and experimental heavy ion testing data that show possibility of both high resistance to low resistance and low resistance to high resistance transitions due to ion strikes. Next, a non-volatile sense amplifier based flip-flop architecture is proposed which can help make leakage power consumption negligible by allowing complete shutdown of power supply while retaining its output data in CBRAM devices. Reliability and energy consumption of the flip-flop circuit for different CBRAM low resistance levels and supply voltage values are analyzed and compared to CMOS designs. Possible extension of this architecture for threshold logic function computation using the CBRAM devices as re-configurable resistive weights is also discussed. Lastly, Spike timing dependent plasticity (STDP) based gradual resistance change behavior in CBRAM device fabricated in back-end-of-line on a CMOS die containing integrate and fire CMOS neuron circuits is demonstrated for the first time which indicates the feasibility of using CBRAM devices as electronic synapses in spiking neural network hardware implementations for non-Boolean neuromorphic computing.
ContributorsMahalanabis, Debayan (Author) / Barnaby, Hugh J. (Thesis advisor) / Kozicki, Michael N. (Committee member) / Vrudhula, Sarma (Committee member) / Yu, Shimeng (Committee member) / Arizona State University (Publisher)
Created2015
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Description
The past decade has seen a tremendous surge in running machine learning (ML) functions on mobile devices, from mere novelty applications to now indispensable features for the next generation of devices.

While the mobile platform capabilities range widely, long battery life and reliability are common design concerns that are crucial to

The past decade has seen a tremendous surge in running machine learning (ML) functions on mobile devices, from mere novelty applications to now indispensable features for the next generation of devices.

While the mobile platform capabilities range widely, long battery life and reliability are common design concerns that are crucial to remain competitive.

Consequently, state-of-the-art mobile platforms have become highly heterogeneous by combining a powerful CPUs with GPUs to accelerate the computation of deep neural networks (DNNs), which are the most common structures to perform ML operations.

But traditional von Neumann architectures are not optimized for the high memory bandwidth and massively parallel computation demands required by DNNs.

Hence, propelling research into non-von Neumann architectures to support the demands of DNNs.

The re-imagining of computer architectures to perform efficient DNN computations requires focusing on the prohibitive demands presented by DNNs and alleviating them. The two central challenges for efficient computation are (1) large memory storage and movement due to weights of the DNN and (2) massively parallel multiplications to compute the DNN output.

Introducing sparsity into the DNNs, where certain percentage of either the weights or the outputs of the DNN are zero, greatly helps with both challenges. This along with algorithm-hardware co-design to compress the DNNs is demonstrated to provide efficient solutions to greatly reduce the power consumption of hardware that compute DNNs. Additionally, exploring emerging technologies such as non-volatile memories and 3-D stacking of silicon in conjunction with algorithm-hardware co-design architectures will pave the way for the next generation of mobile devices.

Towards the objectives stated above, our specific contributions include (a) an architecture based on resistive crosspoint array that can update all values stored and compute matrix vector multiplication in parallel within a single cycle, (b) a framework of training DNNs with a block-wise sparsity to drastically reduce memory storage and total number of computations required to compute the output of DNNs, (c) the exploration of hardware implementations of sparse DNNs and architectural guidelines to reduce power consumption for the implementations in monolithic 3D integrated circuits, and (d) a prototype chip in 65nm CMOS accelerator for long-short term memory networks trained with the proposed block-wise sparsity scheme.
ContributorsKadetotad, Deepak Vinayak (Author) / Seo, Jae-Sun (Thesis advisor) / Chakrabarti, Chaitali (Committee member) / Vrudhula, Sarma (Committee member) / Cao, Yu (Committee member) / Arizona State University (Publisher)
Created2019