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- Creators: Jiao, Yang
- Creators: Wang, Robert
Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018
Description
Advancements in thermal interface materials (TIMs) allows for the creation of new and more powerful electronics as they increase the heat transfer from the component to the heat sink. Current industrial options provide decent heat transfer, but the creation of TIMs with higher thermal conductivities is needed. In addition, if these TIMs are elastic in nature, their effectiveness can greatly increase as they can deal with changing interfaces without degradation of their properties. The research performed delves into this idea, creating elastic TIMs using liquid metal (LM), in this case galinstan, along with other matrix particles embedded in Polydimethylsiloxane (PDMS) to create an easy to use, relatively inexpensive, thermally conductive, but electrically insulative, pad with increased thermal conductivity from industrial solutions.
The pads were created using varying amounts of LM and matrix materials ranging from copper microspheres to diamond powder mixed into PDMS using a high-speed mixer. The material was then cast into molds and cured to create the pads. Once the pads were created, the difficulty came in quantifying their thermal properties. A stepped bar apparatus (SBA) following ASTM D5470 was created to measure the thermal resistance of the pads but it was determined that thermal conductivity was a more usable metric of the pads’ performance. This meant that the pad’s in-situ thickness was needed during testing, prompting the installation of a linear encoder to measure the thickness. The design and analysis of the necessary modification and proposed future design is further detailed in the following paper.
The pads were created using varying amounts of LM and matrix materials ranging from copper microspheres to diamond powder mixed into PDMS using a high-speed mixer. The material was then cast into molds and cured to create the pads. Once the pads were created, the difficulty came in quantifying their thermal properties. A stepped bar apparatus (SBA) following ASTM D5470 was created to measure the thermal resistance of the pads but it was determined that thermal conductivity was a more usable metric of the pads’ performance. This meant that the pad’s in-situ thickness was needed during testing, prompting the installation of a linear encoder to measure the thickness. The design and analysis of the necessary modification and proposed future design is further detailed in the following paper.
ContributorsKemme, Nicholas (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2017