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Description
Solar photovoltaic (PV) industry is tipped to be one of the front-runners in the renewable industry. Typically, PV module manufacturers provide a linear or step warranty of 80% of original power over 25 years. This power loss during the field exposure is primarily attributed to the development of performance affecting

Solar photovoltaic (PV) industry is tipped to be one of the front-runners in the renewable industry. Typically, PV module manufacturers provide a linear or step warranty of 80% of original power over 25 years. This power loss during the field exposure is primarily attributed to the development of performance affecting defects in the PV modules. As many as 86 different defects can occur in a PV module. One of the major defects that can cause significant power loss is the interconnect metallization system (IMS) degradation which is the focus of this thesis. The IMS is composed of cell-interconnect (cell-ribbon interconnect) and string-interconnect (ribbon-ribbon interconnect). The cell interconnect is in turn composed of silver metallization (fingers and busbars) and solder bonds between silver busbar and copper ribbon. Weak solder bonding between copper ribbon and busbar of a cell results in increase of series resistance that in turn affects the fill factor causing a power drop. In this thesis work, the results obtained from various non-destructive and destructive experiments performed on modules exposed in three different climates (Arizona - Hot and Dry, Mexico - Warm and Humid, and California - Temperate) are presented. These experiments include light I-V measurements, dark I-V measurements, infrared imaging, extraction of test samples from the modules, peel strength measurements and four-point resistance measurements. The extraction of test samples was performed using a mechanical method and a chemical method. The merits and demerits of these two methods are presented. A drop of 10.33% in fill factor was observed for a 0.05Ω increase in the series resistance of the modules investigated in this work. Different combinations in a cell that can cause series resistance increase were considered and their effect on fill factor were observed using four-point probe experiments. Peel test experiments were conducted to correlate the effect of series resistance on the ribbon peel strength. Finally, climate specific thermal modelling was performed for 4 different sites over 20 years in order to calculate the accumulated thermal fatigue and also to evaluate its correlation, if any, with the increase of series resistance.
ContributorsTummala, Abhishiktha (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Phelan, Patrick (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2016