Matching Items (2)
Description
In this project, a novel method is presented for measuring the resistivity of nanoscale metallic conductors (nanowires) using a variable-spacing 2-point method with a modified ultrahigh vacuum scanning tunneling microscope. An auxiliary field emission imaging method that allows for scanning insulating surfaces using a large gap distance (20nm) is also presented. Using these methods, the resistivity of self-assembled endotaxial FeSi2 nanowires (NWs) on Si(110) was measured. The resistivity was found to vary inversely with NW width, being rhoNW = 200 uOhm cm at 12 nm and 300 uOhm cm at 2 nm. The increase at small w is attributed to boundary scattering, and is fit to the Fuchs-Sondheimer model, yielding values of rho0 = 150 uOhm cm and lambda = 2.4 nm, for specularity parameter p = 0.5. These results are attributed to a high concentration of point defects in the FeSi2 structure, with a correspondingly short inelastic electron scattering length. It is remarkable that the defect concentration persists in very small structures, and is not changed by surface oxidation.
ContributorsTobler, Samuel (Author) / Bennett, Peter (Thesis advisor) / McCartney, Martha (Committee member) / Tao, Nongjian (Committee member) / Doak, Bruce (Committee member) / Chen, Tingyong (Committee member) / Arizona State University (Publisher)
Created2011
Description
Nickel-Copper metallization for silicon solar cells offers a cost effective alternative to
traditional screen printed silver paste technology. The main objective of this work is to
study the formation of nickel silicide contacts with and without native silicon dioxide SiO2.
The effect of native SiO2 on the silicide formation has been studied using Raman
spectroscopy, Rutherford backscattering spectrometry and sheet resistance
measurements which shows that SiO
2
acts as a diffusion barrier for silicidation at low
temperatures of 350°C. At 400°C the presence of SiO2 results in the increased formation
of nickel mono-silicide phase with reduced thickness when compared to samples without
any native oxide. Pre and post-anneal measurements of Suns Voc, photoluminescence and
Illuminated lock in thermography show effect of annealing on electrical characteristics of
the device. The presence of native oxide is found to prevent degradation of the solar cells
when compared to cells without any native oxide. A process flow for fabricating silicon
solar cells using light induced plating of nickel and copper with and without native oxide
(SiO2) has been developed and cell results for devices fabricated on 156mm wafers have
been discussed.
traditional screen printed silver paste technology. The main objective of this work is to
study the formation of nickel silicide contacts with and without native silicon dioxide SiO2.
The effect of native SiO2 on the silicide formation has been studied using Raman
spectroscopy, Rutherford backscattering spectrometry and sheet resistance
measurements which shows that SiO
2
acts as a diffusion barrier for silicidation at low
temperatures of 350°C. At 400°C the presence of SiO2 results in the increased formation
of nickel mono-silicide phase with reduced thickness when compared to samples without
any native oxide. Pre and post-anneal measurements of Suns Voc, photoluminescence and
Illuminated lock in thermography show effect of annealing on electrical characteristics of
the device. The presence of native oxide is found to prevent degradation of the solar cells
when compared to cells without any native oxide. A process flow for fabricating silicon
solar cells using light induced plating of nickel and copper with and without native oxide
(SiO2) has been developed and cell results for devices fabricated on 156mm wafers have
been discussed.
ContributorsJain, Harsh Narendrakumar (Author) / Bowden, Stuart (Thesis advisor) / Alford, Terry (Thesis advisor) / Holman, Zachary (Committee member) / Arizona State University (Publisher)
Created2016