Matching Items (2)

154700-Thumbnail Image.png

A friction and adhesion characterization setup for extreme temperatures

Description

It is well known that the geckos can cling to almost any surface using highly dense micro
ano fibrils found on the feet that rely on Van Der Waals forces

It is well known that the geckos can cling to almost any surface using highly dense micro
ano fibrils found on the feet that rely on Van Der Waals forces to adhere. A few experimental and theoretical approaches have been taken to understand the adhesion mechanism of gecko feet. This work explains the building procedure of custom experimental setup to test the adhesion force over a temperature range and extends its application in space environment, potentially unsafe working condition.

This study demonstrates that these adhesive capable of switching adhesive properties not only at room environment but also over a temperature range of -160 degC to 120 degC in vacuum conditions. These conditions are similar to the condition experienced by a satellite in a space orbiting around the earth. Also, this study demonstrated various detachment and specimen patch preparation methods. The custom-made experimental setup for adhesion test can measure adhesion force in temperature and pressure controlled environment over specimen size of 1 sq. inch. A cryogenic cooling system with liquid nitrogen is used to achieve -160 degC and an electric resistive heating system are used to achieve 120 degC in controlled volume. Thermal electrodes, infrared thermopile detectors are used to record temperature at sample and pressure indicator to record vacuum condition in controlled volume. Reversibility of the switching behaviour of the specimen in controlled environment confirms its application in space and very high or very low-temperature conditions.

The experimental setup was developed using SolidWorks as a design tool, Ansys as simulation tool and the data acquisition utilizes LabVIEW available in the market today.

Contributors

Agent

Created

Date Created
  • 2016

149742-Thumbnail Image.png

Thermo-mechanical analysis of temporary bonding systems for flexible microelectronics fabrication applications

Description

Temporary bonding-debonding of flexible plastic substrates to rigid carriers may facilitate effective substrate handling by automated tools for manufacture of flexible microelectronics. The primary challenges in implementing practical temporary bond-debond

Temporary bonding-debonding of flexible plastic substrates to rigid carriers may facilitate effective substrate handling by automated tools for manufacture of flexible microelectronics. The primary challenges in implementing practical temporary bond-debond technology originate from the stress that is developed during high temperature processing predominately through thermal-mechanical property mismatches between carrier, adhesive and substrate. These stresses are relaxed through bowing of the bonded system (substrate-adhesive-carrier), which causes wafer handling problems, or through delamination of substrate from rigid carrier. Another challenge inherent to flexible plastic substrates and linked to stress is their dimensional instability, which may manifest itself in irreversible deformation upon heating and cooling cycles. Dimensional stability is critical to ensure precise registration of different layers during photolithography. The global objective of this work is to determine comprehensive experimental characterization and develop underlying fundamental engineering concept that could enable widespread adoption and scale-up of temporary bonding processing protocols for flexible microelectronics manufacturing. A series of carriers with different coefficient of thermal expansion (CTE), modulus and thickness were investigated to correlate the thermo-mechanical properties of carrier with deformation behavior of bonded systems. The observed magnitude of system bow scaled with properties of carriers according to well-established Stoney's equation. In addition, rheology of adhesive impacted the deformation of bonded system. In particular, distortion-bowing behavior correlated directly with the relative loss factor of adhesive and flexible plastic substrate. Higher loss factor of adhesive compared to that of substrate allowed the stress to be relaxed with less bow, but led to significantly greater dimensional distortion. Conversely, lower loss factor of adhesive allowed less distortion but led to larger wafer bow. A finite element model using ANSYS was developed to predict the trend in bow-distortion of bonded systems as a function of the viscoelastic properties of adhesive. Inclusion of the viscoelasticity of flexible plastic substrate itself was critical to achieving good agreement between simulation and experiment. Simulation results showed that there is a limited range within which tuning the rheology of adhesive can control the stress-distortion. Therefore, this model can aid in design of new adhesive formulations compatible with different processing requirements of various flexible microelectronics applications.

Contributors

Agent

Created

Date Created
  • 2011