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- All Subjects: Metal oxide semiconductors, Complementary
- Creators: Kitchen, Jennifer
Description
Negative Bias Temperature Instability (NBTI) is commonly seen in p-channel transistors under negative gate voltages at an elevated temperature. The interface traps, oxide traps and NBTI mechanisms are discussed and their effect on circuit degradation and results are discussed. This thesis focuses on developing a model for simulating impact of NBTI effects at circuit level. The model mimics the effects of degradation caused by the defects.
The NBTI model developed in this work is validated and sanity checked by using the simulation data from silvaco and gives excellent results. Furthermore the susceptibility of CMOS circuits such as the CMOS inverter, and a ring oscillator to NBTI is investigated. The results show that the oscillation frequency of a ring oscillator decreases and the SET pulse broadens with the NBTI.
The NBTI model developed in this work is validated and sanity checked by using the simulation data from silvaco and gives excellent results. Furthermore the susceptibility of CMOS circuits such as the CMOS inverter, and a ring oscillator to NBTI is investigated. The results show that the oscillation frequency of a ring oscillator decreases and the SET pulse broadens with the NBTI.
ContributorsPadala, Sudheer (Author) / Barnaby, Hugh (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
Description
Rail clamp circuits are widely used for electrostatic discharge (ESD) protection in semiconductor products today. A step-by-step design procedure for the traditional RC and single-inverter-based rail clamp circuit and the design, simulation, implementation, and operation of two novel rail clamp circuits are described for use in the ESD protection of complementary metal-oxide-semiconductor (CMOS) circuits. The step-by-step design procedure for the traditional circuit is technology-node independent, can be fully automated, and aims to achieve a minimal area design that meets specified leakage and ESD specifications under all valid process, voltage, and temperature (PVT) conditions. The first novel rail clamp circuit presented employs a comparator inside the traditional circuit to reduce the value of the time constant needed. The second circuit uses a dynamic time constant approach in which the value of the time constant is dynamically adjusted after the clamp is triggered. Important metrics for the two new circuits such as ESD performance, latch-on immunity, clamp recovery time, supply noise immunity, fastest power-on time supported, and area are evaluated over an industry-standard PVT space using SPICE simulations and measurements on a fabricated 40 nm test chip.
ContributorsVenkatasubramanian, Ramachandran (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2016
Description
This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below:
1) A transformer-based power combiner architecture for out-phasing transmitters
2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA)
3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters
This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB.
The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%.
Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.
1) A transformer-based power combiner architecture for out-phasing transmitters
2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA)
3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters
This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB.
The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%.
Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.
ContributorsMoallemi, Soroush (Author) / Kitchen, Jennifer (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Thornton, Trevor (Committee member) / Arizona State University (Publisher)
Created2019
Description
This work analyzes and develops a point-of-load (PoL) synchronous buck converter using enhancement-mode Gallium Nitride (e-GaN), with emphasis on optimizing reverse conduction loss by using a well-known technique of placing an anti-parallel Schottky diode across the synchronous power device. This work develops an improved analytical switching model for the GaN-based converter with the Schottky diode using piecewise linear approximations.
To avoid a shoot-through between the power switches of the buck converter, a small dead-time is inserted between gate drive switching transitions. Despite optimum dead-time management for a power converter, optimum dead-times vary for different load conditions. These variations become considerably large for PoL applications, which demand high output current with low output voltages. At high switching frequencies, these variations translate into losses that contribute significantly to the total loss of the converter. To understand and quantify power loss in a hard-switching buck converter that uses a GaN power device in parallel with a Schottky diode, piecewise transitions are used to develop an analytical switching model that quantifies the contribution of reverse conduction loss of GaN during dead-time.
The effects of parasitic elements on the dynamics of the switching converter are investigated during one switching cycle of the converter. A designed prototype of a buck converter is correlated to the predicted model to determine the accuracy of the model. This comparison is presented using simulations and measurements at 400 kHz and 2 MHz converter switching speeds for load (1A) condition and fixed dead-time values. Furthermore, performance of the buck converter with and without the Schottky diode is also measured and compared to demonstrate and quantify the enhanced performance when using an anti-parallel diode. The developed power converter achieves peak efficiencies of 91.7% and 93.86% for 2 MHz and 400 KHz switching frequencies, respectively, and drives load currents up to 6A for a voltage conversion from 12V input to 3.3V output.
In addition, various industry Schottky diodes have been categorized based on their packaging and electrical characteristics and the developed analytical model provides analytical expressions relating the diode characteristics to power stage performance parameters. The performance of these diodes has been characterized for different buck converter voltage step-down ratios that are typically used in industry applications and different switching frequencies ranging from 400 KHz to 2 MHz.
To avoid a shoot-through between the power switches of the buck converter, a small dead-time is inserted between gate drive switching transitions. Despite optimum dead-time management for a power converter, optimum dead-times vary for different load conditions. These variations become considerably large for PoL applications, which demand high output current with low output voltages. At high switching frequencies, these variations translate into losses that contribute significantly to the total loss of the converter. To understand and quantify power loss in a hard-switching buck converter that uses a GaN power device in parallel with a Schottky diode, piecewise transitions are used to develop an analytical switching model that quantifies the contribution of reverse conduction loss of GaN during dead-time.
The effects of parasitic elements on the dynamics of the switching converter are investigated during one switching cycle of the converter. A designed prototype of a buck converter is correlated to the predicted model to determine the accuracy of the model. This comparison is presented using simulations and measurements at 400 kHz and 2 MHz converter switching speeds for load (1A) condition and fixed dead-time values. Furthermore, performance of the buck converter with and without the Schottky diode is also measured and compared to demonstrate and quantify the enhanced performance when using an anti-parallel diode. The developed power converter achieves peak efficiencies of 91.7% and 93.86% for 2 MHz and 400 KHz switching frequencies, respectively, and drives load currents up to 6A for a voltage conversion from 12V input to 3.3V output.
In addition, various industry Schottky diodes have been categorized based on their packaging and electrical characteristics and the developed analytical model provides analytical expressions relating the diode characteristics to power stage performance parameters. The performance of these diodes has been characterized for different buck converter voltage step-down ratios that are typically used in industry applications and different switching frequencies ranging from 400 KHz to 2 MHz.
ContributorsKoli, Gauri (Author) / Kitchen, Jennifer (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Ozev, Sule (Committee member) / Arizona State University (Publisher)
Created2020