Matching Items (3)
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- All Subjects: Electromagnetism
- Genre: Doctoral Dissertation
- Creators: Bakkaloglu, Bertan
- Member of: Theses and Dissertations
Description
With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz.
ContributorsWu, Hao (Author) / Yu, Hongbin (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Chickamenahalli, Shamala (Committee member) / Arizona State University (Publisher)
Created2013
Description
The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
ContributorsBensalem, Brahim (Author) / Aberle, James T. (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Tirkas, Panayiotis A. (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2018
Description
In this dissertation a new wideband circular HIS is proposed. The circular periodicity made it possible to illuminate the surface with a cylindrical TEMz wave and; a novel technique is utilized to make it wideband. Two models are developed to analyze the
reflection characteristics of the proposed HIS.
The circularly symmetric high impedance surface is used as a ground plane for the design of a low-profile loop and spiral radiating elements. It is shown that a HIS with circular periodicity provides a wider operational bandwidth for curvilinear radiating elements such, such as loops and spirals, compared to canonical rectangular HISs.
It is also observed that, with the aid of a circular HIS ground plane the gain of a loop and a spiral increases compared to when a perfect magnetic conductor (PMC) or rectangular HIS is used as a ground plane. The circular HIS was fabricated and the loop and spiral elements were placed individually in close proximity to it.
Also, due to the growing demand for low-radar signature (RCS) antennas for advanced airborne vehicles, curved and flexible HIS ground planes, which meet both the aerodynamic and low RCS requirements, have recently become popular candidates within the antenna and microwave technology. This encouraged us, to propose a spherical HIS where a 2-D curvature is introduced to the previously designed flat HIS.
The major problem associated with spherical HIS is the impact of the curvature on its reflection properties. After characterization of the flat circular HIS, which is addressed in the first part of this dissertation, a spherical curvature is introduced to the flat circular HIS and its impact on the reflection properties was examined when it was illuminated with the same cylindrical TEMz wave. The same technique, as for the flat HIS ground plane, is utilized to make the spherical HIS wideband. A loop and spiral element were placed in the vicinity of the curved HIS and their performanceswere investigated. The HISs were also fabricated and measurements were conducted to verify the simulations. An excellent agreement was observed.
reflection characteristics of the proposed HIS.
The circularly symmetric high impedance surface is used as a ground plane for the design of a low-profile loop and spiral radiating elements. It is shown that a HIS with circular periodicity provides a wider operational bandwidth for curvilinear radiating elements such, such as loops and spirals, compared to canonical rectangular HISs.
It is also observed that, with the aid of a circular HIS ground plane the gain of a loop and a spiral increases compared to when a perfect magnetic conductor (PMC) or rectangular HIS is used as a ground plane. The circular HIS was fabricated and the loop and spiral elements were placed individually in close proximity to it.
Also, due to the growing demand for low-radar signature (RCS) antennas for advanced airborne vehicles, curved and flexible HIS ground planes, which meet both the aerodynamic and low RCS requirements, have recently become popular candidates within the antenna and microwave technology. This encouraged us, to propose a spherical HIS where a 2-D curvature is introduced to the previously designed flat HIS.
The major problem associated with spherical HIS is the impact of the curvature on its reflection properties. After characterization of the flat circular HIS, which is addressed in the first part of this dissertation, a spherical curvature is introduced to the flat circular HIS and its impact on the reflection properties was examined when it was illuminated with the same cylindrical TEMz wave. The same technique, as for the flat HIS ground plane, is utilized to make the spherical HIS wideband. A loop and spiral element were placed in the vicinity of the curved HIS and their performanceswere investigated. The HISs were also fabricated and measurements were conducted to verify the simulations. An excellent agreement was observed.
ContributorsAmiri, Mikal Askarian (Author) / Balanis, Constantine A (Thesis advisor) / Aberle, James T (Committee member) / Bakkaloglu, Bertan (Committee member) / Trichopoulos, Georgios C (Committee member) / Arizona State University (Publisher)
Created2018