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Description
Environmentally responsive hydrogels are one interesting class of soft materials. Due to their remarkable responsiveness to stimuli such as temperature, pH, or light, they have attracted widespread attention in many fields. However, certain functionality of these materials alone is often limited in comparison to other materials such as silicon; thus,

Environmentally responsive hydrogels are one interesting class of soft materials. Due to their remarkable responsiveness to stimuli such as temperature, pH, or light, they have attracted widespread attention in many fields. However, certain functionality of these materials alone is often limited in comparison to other materials such as silicon; thus, there is a need to integrate soft and hard materials for the advancement of environmental-ly responsive materials.

Conventional hydrogels lack good mechanical properties and have inherently slow response time, important characteristics which must be improved before the hydrogels can be integrated with silicon. In the present dissertation work, both these important attrib-utes of a temperature responsive hydrogel, poly(N-isopropylacrylamide) (PNIPAAm), were improved by adopting a low temperature polymerization process and adding a sili-cate compound, tetramethyl orthosilicate. Furthermore, the transition temperature was modulated by adjusting the media quality in which the hydrogels were equilibrated, e.g. by adding a co-solvent (methanol) or an anionic surfactant (sodium dodecyl sulfate). In-terestingly, the results revealed that, based on the hydrogels’ porosity, there were appre-ciable differences when the PNIPAAm hydrogels interacted with the media molecules.

Next, an adhesion mechanism was developed in order to transfer silicon thin film onto the hydrogel surface. This integration provided a means of mechanical buckling of the thin silicon film due to changes in environmental stimuli (e.g., temperature, pH). We also investigated how novel transfer printing techniques could be used to generate pat-terned deformation of silicon thin film when integrated on a planar hydrogel substrate. Furthermore, we explore multilayer hybrid hydrogel structures formed by the integration of different types of hydrogels that have tunable curvatures under the influence of differ-ent stimuli. Silicon thin film integration on such tunable curvature substrates reveal char-acteristic reversible buckling of the thin film in the presence of multiple stimuli.

Finally, different approaches of incorporating visible light response in PNIPAAm are discussed. Specifically, a chemical chromophore- spirobenzopyran was synthesized and integrated through chemical cross-linking into the PNIPAAm hydrogels. Further, methods of improving the light response and mechanical properties were also demonstrat-ed. Interestingly, such a system was shown to have potential application as light modulated topography altering system
ContributorsChatterjee, Prithwish (Author) / Dai, Lenore L. (Thesis advisor) / Jiang, Hanqing (Thesis advisor) / Lind, Mary Laura (Committee member) / Yu, Hongyu (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2015
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Description
Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. In the presence of water, the interfaces between the encapsulant and the cell, glass, and backsheet all experience losses of adhesion, exposing the module to accelerated degradation. Understanding

Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. In the presence of water, the interfaces between the encapsulant and the cell, glass, and backsheet all experience losses of adhesion, exposing the module to accelerated degradation. Understanding the relation between interfacial adhesion and water content inside photovoltaic modules can help mitigate detrimental power losses. Water content measurements via water reflectometry detection combined with 180° peel tests were used to study adhesion of module materials exposed to damp heat and dry heat conditions. The effect of temperature, cumulative water dose, and water content on interfacial adhesion between ethylene vinyl acetate and (1) glass, (2) front of the cell, and (3) backsheet was studied. Temperature and time decreased adhesion at all these interfaces. Water content in the sample during the measurement showed significant decreases in adhesion for the Backsheet/Ethylene vinyl acetate interface. Water dose showed little effect for the Glass/ Ethylene vinyl acetate and Backsheet/ Ethylene vinyl acetate interfaces, but there was significant adhesion loss with water dose at the front cell busbar/encapsulant interface. Initial tensile test results to monitor the effects of the mechanical properties ethylene vinyl acetate and backsheet showed water content increasing the strength of ethylene vinyl acetate during plastic deformation but no change in the strength of the backsheet properties. This mechanical property change is likely inducing variation along the peel interface to possibly convolute the adhesion measurements conducted or to explain the variation seen for the water saturated and dried peel test sample types.
ContributorsTheut, Nicholas (Author) / Bertoni, Mariana (Thesis advisor) / Holman, Zachary (Committee member) / Chan, Candace (Committee member) / Arizona State University (Publisher)
Created2020