Matching Items (5)
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- All Subjects: Origami
- Creators: Jiang, Hanqing
- Resource Type: Text
Description
This research project will test the structural properties of a 3D printed origami inspired structure and compare them with a standard honeycomb structure. The models have equal face areas, model heights, and overall volume but wall thicknesses will be different. Stress-deformation curves were developed from static loading testing. The area under these curves was used to calculate the toughness of the structures. These curves were analyzed to see which structures take more load and which deform more before fracture. Furthermore, graphs of the Stress-Strain plots were produced. Using 3-D printed parts in tough resin printed with a Stereolithography (SLA) printer, the origami inspired structure withstood a larger load, produced a larger toughness and deformed more before failure than the equivalent honeycomb structure.
ContributorsMcGregor, Alexander (Author) / Jiang, Hanqing (Thesis director) / Kingsbury, Dallas (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
This thesis examines the mechanical properties of an origami inspired structure and its equivalent cube counterpart to determine if this origami configuration is an effective load bearing and energy absorption structure. To test this, a folded paper model was created for visual realization and then 3D printed models were created to undergo compression testing using the Instron 4411. The data from testing was used to create stress-strain curves for each sample, which were then used to determine the maximum stress and toughness of each structure. The performance of these structures was also compared to other known material performance. The origami structure was found to outperform the equivalent cube in both maximum stress it could withstand before failure and toughness. These results are grounds for further research to be done to determine the validity of origami structures as viable alternatives to current material configurations.
ContributorsFong, Jessica (Author) / Jiang, Hanqing (Thesis director) / Kingsbury, Dallas (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
Origami and Kirigami are two traditional art forms in the world. Origami, from
‘ori’ meaning folding, and ‘kami’ meaning paper is the art of paper folding. Kirigami, from ‘kiri’ meaning cutting, is the art of the combination of paper cutting and paper folding. In this dissertation, Origami and kirigami concepts were successively utilized in making stretchable lithium ion batteries and three-dimensional (3D) silicon structure which both provide excellent mechanical characteristics.
‘ori’ meaning folding, and ‘kami’ meaning paper is the art of paper folding. Kirigami, from ‘kiri’ meaning cutting, is the art of the combination of paper cutting and paper folding. In this dissertation, Origami and kirigami concepts were successively utilized in making stretchable lithium ion batteries and three-dimensional (3D) silicon structure which both provide excellent mechanical characteristics.
ContributorsSong, Zeming (Author) / Jiang, Hanqing (Thesis advisor) / Dai, Lenore (Committee member) / Yu, Hongbin (Committee member) / He, Ximin (Committee member) / Arizona State University (Publisher)
Created2016
Description
Origami and kirigami, the technique of generating three-dimensional (3D) structures from two-dimensional (2D) flat sheets, are now more and more involved in scientific and engineering fields. Therefore, the development of tools for their theoretical analysis becomes more and more important. Since much effort was paid on calculations based on pure mathematical consideration and only limited effort has been paid to include mechanical properties, the goal of my research is developing a method to analyze the mechanical behavior of origami and kirigami based structures. Mechanical characteristics, including nonlocal effect and fracture of the structures, as well as elasticity and plasticity of materials are studied. For calculation of relative simple structures and building of structures’ constitutive relations, analytical approaches were used. For more complex structures, finite element analysis (FEA), which is commonly applied as a numerical method for the analysis of solid structures, was utilized. The general study approach is not necessarily related to characteristic size of model. I believe the scale-independent method described here will pave a new way to understand the mechanical response of a variety of origami and kirigami based structures under given mechanical loading.
ContributorsLv, Cheng (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongbin (Committee member) / Wang, Liping (Committee member) / Mignolet, Marc (Committee member) / Hildreth, Owen (Committee member) / Arizona State University (Publisher)
Created2016
Description
Flexible conducting materials have been in the forefront of a rapidly transforming electronics industry, focusing on wearable devices for a variety of applications in recent times. Over the past few decades, bulky, rigid devices have been replaced with a surging demand for thin, flexible, light weight, ultra-portable yet high performance electronics. The interconnects available in the market today only satisfy a few of the desirable characteristics, making it necessary to compromise one feature over another. In this thesis, a method to prepare a thin, flexible, and stretchable inter-connect is presented with improved conductivity compared to previous achievements. It satisfies most mechanical and electrical conditions desired in the wearable electronics industry. The conducting composite, prepared with the widely available, low cost silicon-based organic polymer - polydimethylsiloxane (PDMS) and silver (Ag), is sandwiched between two cured PDMS layers. These protective layers improve the mechanical stability of the inter-connect. The structure can be stretched up to 120% of its original length which can further be enhanced to over 250% by cutting it into a serpentine shape without compromising its electrical stability. The inter-connect, around 500 µm thick, can be integrated into thin electronic packaging. The synthesis process of the composite material, along with its electrical and mechanical and properties are presented in detail. Testing methods and results for mechanical and electrical stability are also illustrated over extensive flexing and stretching cycles. The materials put into test, along with conductive silver (Ag) - polydimethylsiloxane (PDMS) composite in a sandwich structure, are copper foils, copper coated polyimide (PI) and aluminum (Al) coated polyethylene terephthalate (PET).
ContributorsNandy, Mayukh (Author) / Yu, Hongbin (Thesis advisor) / Chan, Candace (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2020