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Description
This study aims to provide a foundation for future work on photo-responsive polymer composite materials to be utilized in additive manufacturing processes. The curing rate of 2,2-dimethoxy-2-phenyl-acetophenone (DMPA) in thin (<20 µm) and thick (>2 mm) layers of DMPA and poly(ethylene glycol) diacrylate (PEG-DA) mixtures was assessed for 5.0

This study aims to provide a foundation for future work on photo-responsive polymer composite materials to be utilized in additive manufacturing processes. The curing rate of 2,2-dimethoxy-2-phenyl-acetophenone (DMPA) in thin (<20 µm) and thick (>2 mm) layers of DMPA and poly(ethylene glycol) diacrylate (PEG-DA) mixtures was assessed for 5.0 w/v% (grams per 100 mL) concentrations of DMPA dissolved in PEG-DA. The polymerization rate and quality of curing was found to decrease as the concentration of DMPA increased beyond 1.0 w/v%; thus, confirming the existence of an optimum photo-initiator concentration for a specific sheet thickness. The optimum photo-initiator concentration for a 3-3.1 mm thick sheet of PEG-DA microstructure was determined to be between 0.3 and 0.38 w/v% DMPA. The addition of 1,6-hexanediol or 1,3-butanediol to the optimum photo-initiator concentrated solution of DMPA and PEG-DA was found to increase the Tg of the samples; however, the samples could not fully cure within 40-50 s, which suggested a decrease in polymerization rate. Lastly, the DMPA photo-initiator does not produce gaseous byproducts and is translucent when fully cured, which makes it attractive for infusion with strengthening materials because quality light penetration is paramount to quick polymerization rates. It is recommended that more trials be conducted to evaluate the mechanical properties of the optimum curing rate for DMPA and PEG-DA microstructures as well as a mechanical property comparison following the addition of either of the two alcohols.
ContributorsPiper, Tyler Irvin (Author) / Green, Green (Thesis director) / Lind, Mary Laura (Committee member) / School of Sustainability (Contributor) / Chemical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-12